JP5770113B2 - 金属箔複合体、並びに成形体及びその製造方法 - Google Patents

金属箔複合体、並びに成形体及びその製造方法 Download PDF

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Publication number
JP5770113B2
JP5770113B2 JP2012005279A JP2012005279A JP5770113B2 JP 5770113 B2 JP5770113 B2 JP 5770113B2 JP 2012005279 A JP2012005279 A JP 2012005279A JP 2012005279 A JP2012005279 A JP 2012005279A JP 5770113 B2 JP5770113 B2 JP 5770113B2
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Japan
Prior art keywords
metal foil
resin layer
composite
copper foil
foil
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Application number
JP2012005279A
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English (en)
Japanese (ja)
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JP2013144382A (ja
JP2013144382A5 (ja
Inventor
和樹 冠
和樹 冠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2012005279A priority Critical patent/JP5770113B2/ja
Priority to CN201380005271.XA priority patent/CN104039545B/zh
Priority to PCT/JP2013/050003 priority patent/WO2013105521A1/ja
Priority to KR1020147018243A priority patent/KR101628591B1/ko
Priority to TW102100536A priority patent/TWI537125B/zh
Publication of JP2013144382A publication Critical patent/JP2013144382A/ja
Publication of JP2013144382A5 publication Critical patent/JP2013144382A5/ja
Application granted granted Critical
Publication of JP5770113B2 publication Critical patent/JP5770113B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2012005279A 2012-01-13 2012-01-13 金属箔複合体、並びに成形体及びその製造方法 Active JP5770113B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012005279A JP5770113B2 (ja) 2012-01-13 2012-01-13 金属箔複合体、並びに成形体及びその製造方法
CN201380005271.XA CN104039545B (zh) 2012-01-13 2013-01-04 金属箔复合体、铜箔、以及成形体及其制造方法
PCT/JP2013/050003 WO2013105521A1 (ja) 2012-01-13 2013-01-04 金属箔複合体、銅箔、並びに成形体及びその製造方法
KR1020147018243A KR101628591B1 (ko) 2012-01-13 2013-01-04 금속박 복합체, 동박, 그리고 성형체 및 그 제조 방법
TW102100536A TWI537125B (zh) 2012-01-13 2013-01-08 Metal foil composite, copper foil, and molded body and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012005279A JP5770113B2 (ja) 2012-01-13 2012-01-13 金属箔複合体、並びに成形体及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013144382A JP2013144382A (ja) 2013-07-25
JP2013144382A5 JP2013144382A5 (ja) 2014-12-25
JP5770113B2 true JP5770113B2 (ja) 2015-08-26

Family

ID=48781470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012005279A Active JP5770113B2 (ja) 2012-01-13 2012-01-13 金属箔複合体、並びに成形体及びその製造方法

Country Status (5)

Country Link
JP (1) JP5770113B2 (zh)
KR (1) KR101628591B1 (zh)
CN (1) CN104039545B (zh)
TW (1) TWI537125B (zh)
WO (1) WO2013105521A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109315069B (zh) * 2016-07-07 2021-01-08 名幸电子有限公司 立体配线基板、立体配线基板的制造方法及立体配线基板用基材
ES2867534T3 (es) * 2016-07-12 2021-10-20 Dainippon Printing Co Ltd Conductor modelado, hoja con conductor, placa calefactora, vehículo, y método de fabricación del conductor modelado
JP6883456B2 (ja) 2017-03-31 2021-06-09 Ｊｘ金属株式会社 積層体及び成形品の製造方法
CN112964495A (zh) * 2021-02-04 2021-06-15 赣州逸豪新材料股份有限公司 一种电解铜箔电解高温剥离抽样检测装置及其实施方法
KR102405236B1 (ko) * 2022-05-11 2022-06-07 고려아연 주식회사 전해 동박의 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668703B2 (ja) * 1988-05-18 1997-10-27 日本ゼオン株式会社 電気回路積層板用接着剤
KR100491385B1 (ko) * 2001-07-04 2005-05-24 닛꼬 긴조꾸 가꼬 가부시키가이샤 적층판용 구리합금박
JP4204033B2 (ja) * 2002-11-28 2009-01-07 日立金属株式会社 金属箔張積層板及びそれを用いてなる配線基板
JP4170977B2 (ja) * 2003-11-28 2008-10-22 日鉱金属株式会社 プレス打抜き性に優れた電子部品用素材
JP4683640B2 (ja) 2006-01-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 プリント配線基板用銅箔及びそれを用いたプリント配線基板
JP5057932B2 (ja) 2007-10-31 2012-10-24 Ｊｘ日鉱日石金属株式会社 圧延銅箔及びフレキシブルプリント配線板
JP5185066B2 (ja) 2008-10-23 2013-04-17 Ｊｘ日鉱日石金属株式会社 屈曲性に優れた銅箔、その製造方法及びフレキシブル銅貼積層板
US20120141809A1 (en) * 2009-07-07 2012-06-07 Kazuki Kanmuri Copper foil composite
CN102549180A (zh) * 2009-09-28 2012-07-04 Jx日矿日石金属株式会社 电子材料用Cu－Ni－Si－Co系铜合金和其制造方法
JP5378286B2 (ja) * 2010-03-30 2013-12-25 Ｊｘ日鉱日石金属株式会社 チタン銅及びその製造方法
JP5325175B2 (ja) * 2010-07-15 2013-10-23 Ｊｘ日鉱日石金属株式会社 銅箔複合体、及び成形体の製造方法
KR101528995B1 (ko) * 2011-03-31 2015-06-15 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 금속박 복합체 및 그것을 사용한 플렉시블 프린트 기판, 그리고 성형체 및 그 제조 방법

Also Published As

Publication number Publication date
CN104039545B (zh) 2016-05-18
JP2013144382A (ja) 2013-07-25
KR20140099531A (ko) 2014-08-12
TW201341174A (zh) 2013-10-16
CN104039545A (zh) 2014-09-10
TWI537125B (zh) 2016-06-11
KR101628591B1 (ko) 2016-06-08
WO2013105521A1 (ja) 2013-07-18

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