JP5766912B2 - エチレンマルチブロックコポリマーを含む電子装置モジュール - Google Patents
エチレンマルチブロックコポリマーを含む電子装置モジュール Download PDFInfo
- Publication number
- JP5766912B2 JP5766912B2 JP2009529354A JP2009529354A JP5766912B2 JP 5766912 B2 JP5766912 B2 JP 5766912B2 JP 2009529354 A JP2009529354 A JP 2009529354A JP 2009529354 A JP2009529354 A JP 2009529354A JP 5766912 B2 JP5766912 B2 JP 5766912B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- electronic device
- copolymer
- polymer
- ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10697—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being cross-linked
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/804—Materials of encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82631906P | 2006-09-20 | 2006-09-20 | |
| US60/826,319 | 2006-09-20 | ||
| US86595306P | 2006-11-15 | 2006-11-15 | |
| US60/865,953 | 2006-11-15 | ||
| PCT/US2007/078845 WO2008036707A2 (en) | 2006-09-20 | 2007-09-19 | Electronic device module comprising an ethylene multi-block copolymer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010504646A JP2010504646A (ja) | 2010-02-12 |
| JP2010504646A5 JP2010504646A5 (enExample) | 2010-10-28 |
| JP5766912B2 true JP5766912B2 (ja) | 2015-08-19 |
Family
ID=39154363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009529354A Active JP5766912B2 (ja) | 2006-09-20 | 2007-09-19 | エチレンマルチブロックコポリマーを含む電子装置モジュール |
Country Status (12)
| Country | Link |
|---|---|
| EP (1) | EP2070127B2 (enExample) |
| JP (1) | JP5766912B2 (enExample) |
| CN (1) | CN101517750B (enExample) |
| AT (1) | ATE469440T1 (enExample) |
| BR (1) | BRPI0715034B1 (enExample) |
| CA (1) | CA2663058A1 (enExample) |
| DE (1) | DE602007006826D1 (enExample) |
| ES (1) | ES2344966T5 (enExample) |
| MY (1) | MY149187A (enExample) |
| NO (1) | NO20091127L (enExample) |
| TW (1) | TW200830568A (enExample) |
| WO (1) | WO2008036707A2 (enExample) |
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| CN102217091B (zh) | 2009-07-17 | 2012-11-21 | 三菱树脂株式会社 | 太阳能电池封装材料以及使用该封装材料制作的太阳能电池组件 |
| CN102859863A (zh) * | 2009-07-31 | 2013-01-02 | 纳幕尔杜邦公司 | 用于光伏电池的可交联包封材料 |
| DE102009036970A1 (de) | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| JP5555554B2 (ja) * | 2009-12-28 | 2014-07-23 | 日本ポリエチレン株式会社 | 太陽電池封止材用樹脂組成物 |
| EP2576685A1 (en) * | 2010-05-26 | 2013-04-10 | Dow Global Technologies LLC | Electronic device module comprising polyolefin copolymer with low unsaturation and optional vinyl silane |
| JP2013528951A (ja) * | 2010-06-04 | 2013-07-11 | ダウ グローバル テクノロジーズ エルエルシー | 均質ポリオレフィンコポリマーおよび接着性増強グラフトポリマーの膜を含む電子素子モジュール |
| EP2576686A1 (en) * | 2010-06-04 | 2013-04-10 | Dow Global Technologies LLC | Electronic device module comprising film of homogeneous polyolefin copolymer and adhesive property enhancing graft polymer |
| EP2585293A2 (en) * | 2010-06-24 | 2013-05-01 | Dow Global Technologies LLC | Electronic device module comprising long chain branched (lcb), block, or interconnected copolymers of ethylene and optionally silane |
| CN102985253A (zh) * | 2010-06-24 | 2013-03-20 | 陶氏环球技术有限公司 | 包含异相聚烯烃共聚物和任选硅烷的电子器件模块 |
| JP5539063B2 (ja) * | 2010-06-25 | 2014-07-02 | 日本ポリエチレン株式会社 | 太陽電池封止材用樹脂組成物、及びそれを用いた太陽電池封止材、太陽電池モジュール |
| JP5539064B2 (ja) * | 2010-06-25 | 2014-07-02 | 日本ポリエチレン株式会社 | 太陽電池封止材用樹脂組成物、及びそれを用いた太陽電池封止材、太陽電池モジュール |
| CN103038893B (zh) * | 2010-07-28 | 2016-05-18 | 三菱树脂株式会社 | 太阳能电池封装材料及使用其制成的太阳能电池组件 |
| JP2012054521A (ja) * | 2010-08-02 | 2012-03-15 | Dainippon Printing Co Ltd | 太陽電池モジュール用封止材組成物及び太陽電池モジュール用封止材 |
| WO2012019909A1 (de) | 2010-08-13 | 2012-02-16 | Tesa Se | Verfahren zur kapselung einer elektronischen anordnung |
| RU2592608C2 (ru) * | 2010-08-30 | 2016-07-27 | Дай Ниппон Принтинг Ко., Лтд. | Материал для герметизации солнечных батарей и модуль солнечной батареи, изготовленный с его использованием |
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| US7741397B2 (en) | 2004-03-17 | 2010-06-22 | Dow Global Technologies, Inc. | Filled polymer compositions made from interpolymers of ethylene/α-olefins and uses thereof |
-
2007
- 2007-09-19 BR BRPI0715034-2A patent/BRPI0715034B1/pt active IP Right Grant
- 2007-09-19 CA CA002663058A patent/CA2663058A1/en not_active Abandoned
- 2007-09-19 CN CN2007800349171A patent/CN101517750B/zh active Active
- 2007-09-19 MY MYPI20091111A patent/MY149187A/en unknown
- 2007-09-19 ES ES07814921.8T patent/ES2344966T5/es active Active
- 2007-09-19 AT AT07814921T patent/ATE469440T1/de not_active IP Right Cessation
- 2007-09-19 TW TW096134892A patent/TW200830568A/zh unknown
- 2007-09-19 DE DE602007006826T patent/DE602007006826D1/de active Active
- 2007-09-19 EP EP07814921.8A patent/EP2070127B2/en active Active
- 2007-09-19 WO PCT/US2007/078845 patent/WO2008036707A2/en not_active Ceased
- 2007-09-19 JP JP2009529354A patent/JP5766912B2/ja active Active
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2009
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2070127B2 (en) | 2015-09-02 |
| ES2344966T5 (es) | 2015-11-06 |
| ES2344966T3 (es) | 2010-09-10 |
| CN101517750A (zh) | 2009-08-26 |
| BRPI0715034B1 (pt) | 2019-05-14 |
| WO2008036707A3 (en) | 2008-05-15 |
| EP2070127B1 (en) | 2010-05-26 |
| DE602007006826D1 (de) | 2010-07-08 |
| CA2663058A1 (en) | 2008-03-27 |
| TW200830568A (en) | 2008-07-16 |
| WO2008036707A2 (en) | 2008-03-27 |
| CN101517750B (zh) | 2011-06-29 |
| JP2010504646A (ja) | 2010-02-12 |
| ATE469440T1 (de) | 2010-06-15 |
| NO20091127L (no) | 2009-06-02 |
| EP2070127A2 (en) | 2009-06-17 |
| BRPI0715034A2 (pt) | 2015-05-12 |
| MY149187A (en) | 2013-07-31 |
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