JP6170948B2 - フィルムを含むシラン含有エチレンインターポリマー配合物及びそれを含む電子デバイスモジュール - Google Patents
フィルムを含むシラン含有エチレンインターポリマー配合物及びそれを含む電子デバイスモジュール Download PDFInfo
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- JP6170948B2 JP6170948B2 JP2014555753A JP2014555753A JP6170948B2 JP 6170948 B2 JP6170948 B2 JP 6170948B2 JP 2014555753 A JP2014555753 A JP 2014555753A JP 2014555753 A JP2014555753 A JP 2014555753A JP 6170948 B2 JP6170948 B2 JP 6170948B2
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- Prior art keywords
- ethylene
- ethylene interpolymer
- film
- interpolymer
- silane
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- 239000005977 Ethylene Substances 0.000 title claims description 162
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 title claims description 161
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 title claims description 31
- 229910000077 silane Inorganic materials 0.000 title claims description 31
- 239000000203 mixture Substances 0.000 title description 31
- 239000010410 layer Substances 0.000 claims description 86
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 36
- 229910052796 boron Inorganic materials 0.000 claims description 34
- 229910052782 aluminium Inorganic materials 0.000 claims description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 25
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 9
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 7
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 3
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- 238000000034 method Methods 0.000 description 43
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 8
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- 239000003112 inhibitor Substances 0.000 description 7
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- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
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- UZFMOKQJFYMBGY-UHFFFAOYSA-N 4-hydroxy-TEMPO Chemical group CC1(C)CC(O)CC(C)(C)N1[O] UZFMOKQJFYMBGY-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 230000006835 compression Effects 0.000 description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 150000002978 peroxides Chemical class 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
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- 235000012239 silicon dioxide Nutrition 0.000 description 5
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- 229910052723 transition metal Inorganic materials 0.000 description 5
- 150000003624 transition metals Chemical class 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
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- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920000578 graft copolymer Polymers 0.000 description 4
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- CPOFMOWDMVWCLF-UHFFFAOYSA-N methyl(oxo)alumane Chemical class C[Al]=O CPOFMOWDMVWCLF-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
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- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 3
- BAVYZALUXZFZLV-UHFFFAOYSA-O Methylammonium ion Chemical compound [NH3+]C BAVYZALUXZFZLV-UHFFFAOYSA-O 0.000 description 3
- 239000012963 UV stabilizer Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 230000001627 detrimental effect Effects 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 229910052735 hafnium Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003446 ligand Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 239000003760 tallow Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- AXZHQYSKPYLONQ-UHFFFAOYSA-N C=C.[B] Chemical group C=C.[B] AXZHQYSKPYLONQ-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KVOZXXSUSRZIKD-UHFFFAOYSA-N Prop-2-enylcyclohexane Chemical compound C=CCC1CCCCC1 KVOZXXSUSRZIKD-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004708 Very-low-density polyethylene Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003426 co-catalyst Substances 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
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- 239000008393 encapsulating agent Substances 0.000 description 2
- HEAMQYHBJQWOSS-UHFFFAOYSA-N ethene;oct-1-ene Chemical compound C=C.CCCCCCC=C HEAMQYHBJQWOSS-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
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- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
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- ZSSVCEUEVMALRD-UHFFFAOYSA-N 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-(octyloxy)phenol Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C1=NC(C=2C(=CC(C)=CC=2)C)=NC(C=2C(=CC(C)=CC=2)C)=N1 ZSSVCEUEVMALRD-UHFFFAOYSA-N 0.000 description 1
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- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- WBWXVCMXGYSMQA-UHFFFAOYSA-N 3,9-bis[2,4-bis(2-phenylpropan-2-yl)phenoxy]-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C=1C=C(OP2OCC3(CO2)COP(OC=2C(=CC(=CC=2)C(C)(C)C=2C=CC=CC=2)C(C)(C)C=2C=CC=CC=2)OC3)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 WBWXVCMXGYSMQA-UHFFFAOYSA-N 0.000 description 1
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- 229920002367 Polyisobutene Polymers 0.000 description 1
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Images
Classifications
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
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- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
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- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10697—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being cross-linked
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
- C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
- C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
- C08F4/60—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
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Description
−CH2−CHR1−(R2)m−Si(R3)3−n(OR4)n I
グラフト化前の「アルコキシシラン」化合物を意味する用語「グラフト性アルコキシシラン化合物」は、次式で表すことができるアルコキシシラン化合物を指す。
CH2=CR1−(R2)m−Si(R3)3−n(OR4)n II
但し、I又はIIいずれの場合も、
R1はH又はCH3であり、
R2は1〜20の炭素原子を含むアルキル、アリール、又はヒドロカルビルであり、また、エステル、アミド、及びエーテル、その他などの他の官能基を含んでもよく、
mは0又は1であり、
R3は1〜20の炭素原子を含むアルキル、アリール、又はヒドロカルビルであり、
R4は1〜6の炭素原子を含むアルキル又はカルボキシルアルキル(好ましくはメチル又はエチル)であり、
nは1、2、又は3(好ましくは3)である。
A.フィルム及びガラス(又は他の層)を、ガラス層の外表面を、フィルムのシラン含有エチレンインターポリマー外表面に対して面接触するように配置するステップと、
B.フィルムとガラスとの互いに接触する外表面間において接着的密着を与える積層温度において、フィルムをガラス層に積層及び接着し、任意に(架橋が所望され、且つこの時点で架橋が行われることを意図する場合)、シラン含有エチレンインターポリマー層を架橋するステップと、
を含む。
・「外側向きの」受光外表面及び「内側向きの」外表面を有する受光トップシート層13(例えば、ガラス層)、
・トップ層13の方向に向いた一つの外表面及びPV電池11の光反応性表面の方向に向いた一つの外表面を有し、層12b又は層14と共に、PV電池表面を密封及び封止するシラン含有エチレンインターポリマーフィルム層12a、
・PV電池11
・必要な場合には、(任意に本発明に係る)第2の封止フィルム層12b、及び
・ガラス又は他の裏面層基材を含む裏面層14。
別段の記載がない、文脈から暗示的でない、又は本技術分野において周知でない限りにおいて、全ての部及びパーセンテージは重量を基準とする。
DOC6114 − ジルコニウム,[2,2’’’−[1,3−プロパンジイルビス(オキシ−kO)]ビス[3’’,5,5’’−トリス(1,1−ジメチルエチル)−5’-メチル[1,1’:3’,1’’−ターフェニル」−2’−オラート−kO]]ジメチル−
CGC7 − チタン,[N−(1,1−ジメチルエチル)−1,1−ジメチル−1−[(1,2,3,4,5−η)−2,3,4,5−テトラメチル−2,4−シクロペンタジエン−1−イル]−シランアミネート(2−)−N][η4−1,3−ペンタジエン]−
MMAO − 修飾メチルアルミノキサン
FAB − トリス−ペンタフルオロフェニルボレート
RIBS−2 − ビス(水素化獣脂アルキル)メチル−アンモニウム,テトラキス(ペンタフルオロフェニル)ボレート
インターポリマーの密度はASTM D−792に準拠して算出し、曲げ弾性率はASTM D−790に準拠して算出し、正割及び引張弾性率は2%正割弾性率として算出する。
以下に、本願の当初の特許請求の範囲に記載された発明を付記する。
[1]
(A)シラン含有エチレンインターポリマーであって、
(1)0.905g/cm 3 未満の密度を有するエチレンインターポリマーと、
(2)少なくとも0.1重量パーセントのアルコキシシランと、
を含み、
(3)5×10 15 オーム・cmを超える、60℃で測定される体積抵抗率を有する
前記(A)を含む表面層を含む、1又は2以上の層を有するエチレンインターポリマーフィルム。
[2]
エチレンインターポリマーが、共にエチレンインターポリマーの重量を基準として、10ppm未満の残留ホウ素含有量及び100ppm未満の残留アルミニウム含有量を有する、[1]記載のエチレンインターポリマーフィルム。
[3]
前記エチレンインターポリマーが、遷移金属に酸素原子を介して配位するビス−(ビフェニルフェノール)配位子の錯体を含む触媒を用いて調製されてなる、[1]記載のエチレンインターポリマーフィルム。
[4]
前記遷移金属が、Ti、Zr及びHfからなる群より選択される、[3]記載のエチレンインターポリマーフィルム。
[5]
前記錯体が、[2,2’’’−[1,3−プロパンジイルビス(オキシ−kO)]ビス[3’’,5,5’’−トリス(1,1−ジメチルエチル)−5’−メチル[1,1’:3’,1’’−ターフェニル]−2’−オラート−kO]]ジメチルである、[4]記載のエチレンインターポリマーフィルム。
[6]
前記エチレンインターポリマーが、修飾メチルアルミノキサン型の助触媒からなり、如何なるホウ素含有助触媒も実質的に含まない助触媒を用いて調製されてなる、[3]乃至[5]のいずれか一項に記載のエチレンインターポリマーフィルム。
[7]
前記エチレンインターポリマーが、極低密度ポリエチレン、均一に分岐した直鎖状エチレン/α−オレフィンインターポリマー、及び均一に分岐した実質的に直鎖状のエチレン/α−オレフィンポリマーから構成される群より選択される、[1]記載のエチレンインターポリマーフィルム。
[8]
前記エチレンインターポリマーが、実質的に直鎖状のエチレンインターポリマーである、[7]記載のエチレンインターポリマーフィルム。
[9]
前記エチレンポリマーが、0.85g/cm 3 を超え0.905g/cm 3 未満の密度を有する、[1]記載のエチレンインターポリマーフィルム。
[10]
前記エチレンインターポリマーが、架橋されてなり、該架橋されたエチレンインターポリマーが、約85パーセント未満の、ASTM 2765−95により測定されるキシレン可溶抽出分を含むことにより測定される、少なくとも約15パーセントの架橋インターポリマーを含む、[1]のエチレンインターポリマーフィルム。
[11]
前記エチレンインターポリマーが、ビニルトリ−エトキシシラン及びビニルトリ−メトキシシランから選択されるビニルシランがグラフトされてなる、[1]のエチレンインターポリマーフィルム。
[12]
A.少なくとも一つの電子デバイスと、
B. 前記電子デバイスの少なくとも一つの表面と密着する[1]記載のエチレンインターポリマーフィルムと、
を備える、積層電子デバイスモジュール。
[13]
前記電子デバイスが光電池である、[12]のモジュール。
[14]
(i)受光及び透過カバーシート層と、
(ii)上記[1]乃至[11]のいずれか一項に記載のエチレンインターポリマーフィルムを含む封止フィルム層と、
(iii)1又は2以上の光電池と、
(iv)[1]乃至11のいずれか一項に記載のエチレンインターポリマーフィルムを含む第2の封止フィルム層と、
(v)任意に、バックシート層と、
をこの順に備える、[13]の積層構造モジュール。
[15]
電位誘起劣化(「PID」)試験を行ったときに、約23%以下のPID値を有する、[14]記載の積層構造モジュール。
Claims (5)
- (A)シラン含有エチレンインターポリマーであって、
(1)0.89g/cm3未満の密度を有するエチレンインターポリマーと、
(2)少なくとも0.1重量パーセントのアルコキシシランと、
を含み、
(3)5×1015オーム・cmを超える、60℃で測定される体積抵抗率を有し、
(4)残留ホウ素含有量が10ppm未満である、
前記(A)エチレンインターポリマーを含む表面層を含み、
前記アルコキシシランはグラフト化または共重合により前記エチレンインターポリマー中にグラフトされ又は結合されている、1又は2以上の層を有するエチレンインターポリマーフィルム。 - エチレンインターポリマーが、共にエチレンインターポリマーの重量を基準として、10ppm未満の残留ホウ素含有量及び100ppm未満の残留アルミニウム含有量を有する、請求項1記載のエチレンインターポリマーフィルム。
- 前記エチレンインターポリマーが、0.85g/cm3を超え0.89g/cm3未満の密度を有する、実質的に直鎖状のエチレンインターポリマーである、請求項2記載のエチレンインターポリマーフィルム。
- 前記エチレンインターポリマーが、ビニルトリ−エトキシシラン及びビニルトリ−メトキシシランから選択されるビニルシランがグラフトされてなる、請求項1のエチレンインターポリマーフィルム。
- A.少なくとも一つの電子デバイスと、
B.前記電子デバイスの少なくとも一つの表面と密着する請求項1記載のエチレンインターポリマーフィルムと、
を備える、積層電子デバイスモジュール。
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CN108384033B (zh) | 2021-11-12 |
KR20200020008A (ko) | 2020-02-25 |
EP2809695B1 (en) | 2024-03-13 |
WO2013116649A1 (en) | 2013-08-08 |
KR20140128311A (ko) | 2014-11-05 |
BR112014018938A8 (pt) | 2017-07-11 |
US9362436B2 (en) | 2016-06-07 |
JP2015508833A (ja) | 2015-03-23 |
EP2809695A1 (en) | 2014-12-10 |
CN104114592A (zh) | 2014-10-22 |
KR102380059B1 (ko) | 2022-03-30 |
US20150013753A1 (en) | 2015-01-15 |
BR112014018938A2 (ja) | 2017-06-20 |
CN108384033A (zh) | 2018-08-10 |
BR112014018938B1 (pt) | 2021-02-09 |
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