JP5753644B2 - ワイヤーボンディング作業における酸化軽減のためのガス配送システム - Google Patents

ワイヤーボンディング作業における酸化軽減のためのガス配送システム Download PDF

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JP5753644B2
JP5753644B2 JP2011513596A JP2011513596A JP5753644B2 JP 5753644 B2 JP5753644 B2 JP 5753644B2 JP 2011513596 A JP2011513596 A JP 2011513596A JP 2011513596 A JP2011513596 A JP 2011513596A JP 5753644 B2 JP5753644 B2 JP 5753644B2
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Japan
Prior art keywords
gas
wire bonding
delivery mechanism
gas delivery
hole
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JP2011513596A
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English (en)
Japanese (ja)
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JP2012504317A5 (https=
JP2012504317A (ja
Inventor
ギロッティ、ゲーリー、エス．
シュツェスニャク、スタンレー
エメリック、ピーター、ジェイ． バン
エメリック、ピーター、ジェイ． バン
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
クリック アンド ソッファ インダストリーズ、インク．
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2011513596A 2008-06-10 2009-06-08 ワイヤーボンディング作業における酸化軽減のためのガス配送システム Active JP5753644B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6018908P 2008-06-10 2008-06-10
US61/060,189 2008-06-10
PCT/US2009/046535 WO2009152066A2 (en) 2008-06-10 2009-06-08 Gas delivery system for reducing oxidation in wire bonding operations

Publications (3)

Publication Number Publication Date
JP2012504317A JP2012504317A (ja) 2012-02-16
JP2012504317A5 JP2012504317A5 (https=) 2012-07-26
JP5753644B2 true JP5753644B2 (ja) 2015-07-22

Family

ID=41417368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011513596A Active JP5753644B2 (ja) 2008-06-10 2009-06-08 ワイヤーボンディング作業における酸化軽減のためのガス配送システム

Country Status (6)

Country Link
US (2) US8066170B2 (https=)
JP (1) JP5753644B2 (https=)
KR (1) KR101434001B1 (https=)
CN (1) CN101971314B (https=)
SG (1) SG179409A1 (https=)
WO (1) WO2009152066A2 (https=)

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KR101121849B1 (ko) * 2010-03-31 2012-03-21 앰코 테크놀로지 코리아 주식회사 와이어 본딩 장치
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
JP2012244093A (ja) * 2011-05-24 2012-12-10 Renesas Electronics Corp 半導体装置の製造方法
JP5618974B2 (ja) * 2011-08-16 2014-11-05 株式会社新川 ワイヤボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
KR101612012B1 (ko) * 2012-01-26 2016-04-12 가부시키가이샤 신가와 산화 방지 가스 취출 유닛
US8752751B2 (en) * 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
JP2014075519A (ja) 2012-10-05 2014-04-24 Shinkawa Ltd 酸化防止ガス吹き出しユニット
US9245761B2 (en) * 2013-04-05 2016-01-26 Lam Research Corporation Internal plasma grid for semiconductor fabrication
CN104148794B (zh) * 2013-12-05 2016-05-18 武汉电信器件有限公司 氮气保护封焊电极
TWI677068B (zh) * 2017-05-24 2019-11-11 日商新川股份有限公司 打線接合裝置
JP2020155425A (ja) * 2017-07-07 2020-09-24 ヤマハモーターロボティクスホールディングス株式会社 ワイヤボンディング装置
US11239197B2 (en) * 2019-11-27 2022-02-01 Asm Technology Singapore Pte Ltd Wire bonding apparatus threading system
US11826861B1 (en) * 2020-08-12 2023-11-28 Sion Power Corporation Joining systems, clamping fixtures, and related systems and methods
JP2022071993A (ja) * 2020-10-29 2022-05-17 アスリートＦａ株式会社 電子部品接合装置
US20220270937A1 (en) * 2021-02-23 2022-08-25 Kulicke And Soffa Industries, Inc. Methods of determining shear strength of bonded free air balls on wire bonding machines

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JPS57154850A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Capillary structure for wire bonding
JPS59150440A (ja) 1983-02-03 1984-08-28 Toshiba Corp ワイヤボンデイング方法
JPS59150437A (ja) 1983-02-15 1984-08-28 Toshiba Corp ワイヤボンデイング方法
JPS6054446A (ja) * 1983-09-05 1985-03-28 Mitsubishi Electric Corp ワイヤボンデイング装置
US4572772A (en) * 1983-11-07 1986-02-25 Texas Instruments Incorporated Method for cleaning an electrode
JPS60244034A (ja) * 1984-05-18 1985-12-03 Mitsubishi Electric Corp ワイヤボンデイング用雰囲気形成装置
JPS6178131A (ja) 1984-09-25 1986-04-21 Toshiba Corp ワイヤボンデイング装置
JPS62136835A (ja) * 1985-12-10 1987-06-19 Mitsubishi Electric Corp 半導体装置の製造方法
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US5295619A (en) * 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
JP2758819B2 (ja) 1993-12-22 1998-05-28 山形日本電気株式会社 ワイヤボンディング方法
JPH07263480A (ja) * 1994-03-18 1995-10-13 Shinkawa Ltd ワイヤボンデイング方法及び装置
JPH07273138A (ja) 1994-03-31 1995-10-20 Tatsuta Electric Wire & Cable Co Ltd ワイヤボンデイング法
JP3478510B2 (ja) * 1995-03-17 2003-12-15 芝浦メカトロニクス株式会社 ワイヤボンディング装置
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US7614538B2 (en) * 2006-05-15 2009-11-10 Kulicke And Soffa Industries, Inc. Device clamp for reducing oxidation in wire bonding
US7658313B2 (en) * 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
JP4392015B2 (ja) 2006-11-21 2009-12-24 株式会社カイジョー ワイヤボンディング装置
US7578423B1 (en) * 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices

Also Published As

Publication number Publication date
CN101971314B (zh) 2013-10-09
US8066170B2 (en) 2011-11-29
US20110073635A1 (en) 2011-03-31
US20120031877A1 (en) 2012-02-09
CN101971314A (zh) 2011-02-09
WO2009152066A2 (en) 2009-12-17
SG179409A1 (en) 2012-04-27
KR101434001B1 (ko) 2014-08-25
JP2012504317A (ja) 2012-02-16
KR20100102674A (ko) 2010-09-24
WO2009152066A4 (en) 2010-04-29
US8313015B2 (en) 2012-11-20
WO2009152066A3 (en) 2010-03-11

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