JP5752574B2 - フェノールノボラック樹脂及びそれを用いたエポキシ樹脂組成物 - Google Patents
フェノールノボラック樹脂及びそれを用いたエポキシ樹脂組成物 Download PDFInfo
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- JP5752574B2 JP5752574B2 JP2011259761A JP2011259761A JP5752574B2 JP 5752574 B2 JP5752574 B2 JP 5752574B2 JP 2011259761 A JP2011259761 A JP 2011259761A JP 2011259761 A JP2011259761 A JP 2011259761A JP 5752574 B2 JP5752574 B2 JP 5752574B2
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- epoxy resin
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- phenol novolac
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- 239000003822 epoxy resin Substances 0.000 title claims description 146
- 229920000647 polyepoxide Polymers 0.000 title claims description 146
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- 229920003986 novolac Polymers 0.000 title claims description 112
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- 239000011347 resin Substances 0.000 claims description 44
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 36
- 125000004432 carbon atom Chemical group C* 0.000 claims description 35
- -1 biphenyl compound Chemical class 0.000 claims description 33
- 239000002904 solvent Substances 0.000 claims description 31
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- 239000004305 biphenyl Substances 0.000 claims description 28
- 125000000217 alkyl group Chemical group 0.000 claims description 26
- 238000004128 high performance liquid chromatography Methods 0.000 claims description 25
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 18
- 125000003545 alkoxy group Chemical group 0.000 claims description 17
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 13
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- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
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- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 3
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- 239000003566 sealing material Substances 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
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- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
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- B32B2307/30—Properties of the layers or laminate having particular thermal properties
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- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
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- C08G2261/342—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms
- C08G2261/3424—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms non-conjugated, e.g. paracyclophanes or xylenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/70—Post-treatment
- C08G2261/76—Post-treatment crosslinking
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011259761A JP5752574B2 (ja) | 2011-11-29 | 2011-11-29 | フェノールノボラック樹脂及びそれを用いたエポキシ樹脂組成物 |
| CN201280052226.5A CN103958561B (zh) | 2011-11-29 | 2012-11-27 | 线型酚醛树脂以及使用了该线型酚醛树脂的环氧树脂组合物 |
| PCT/JP2012/080536 WO2013080936A1 (ja) | 2011-11-29 | 2012-11-27 | フェノールノボラック樹脂及びそれを用いたエポキシ樹脂組成物 |
| KR1020147010822A KR101889442B1 (ko) | 2011-11-29 | 2012-11-27 | 페놀노볼락 수지 및 그것을 이용한 에폭시 수지조성물 |
| TW101144854A TW201329137A (zh) | 2011-11-29 | 2012-11-29 | 酚系酚醛清漆樹脂及使用其之環氧樹脂組合物 |
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| JP2011259761A JP5752574B2 (ja) | 2011-11-29 | 2011-11-29 | フェノールノボラック樹脂及びそれを用いたエポキシ樹脂組成物 |
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| JP2013112738A JP2013112738A (ja) | 2013-06-10 |
| JP2013112738A5 JP2013112738A5 (https=) | 2014-11-20 |
| JP5752574B2 true JP5752574B2 (ja) | 2015-07-22 |
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| JP (1) | JP5752574B2 (https=) |
| KR (1) | KR101889442B1 (https=) |
| CN (1) | CN103958561B (https=) |
| TW (1) | TW201329137A (https=) |
| WO (1) | WO2013080936A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812447B2 (ja) | 1988-03-16 | 1996-02-07 | キヤノン株式会社 | トナー及びその製造方法 |
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|---|---|---|---|---|
| JP6041663B2 (ja) * | 2012-12-21 | 2016-12-14 | 日本化薬株式会社 | フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物 |
| JP2015067806A (ja) * | 2013-09-30 | 2015-04-13 | 日本ゼオン株式会社 | プリント配線板形成用硬化性組成物およびプリント配線板形成用積層体の製造方法 |
| JP7098881B2 (ja) * | 2017-03-31 | 2022-07-12 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3577437A (en) * | 1969-01-06 | 1971-05-04 | Monsanto Co | Epoxy resins from alkylated phenol novolac resins |
| JP2981281B2 (ja) * | 1990-11-29 | 1999-11-22 | 三井化学株式会社 | フェノール重合体の製造方法 |
| JP2866747B2 (ja) * | 1990-12-21 | 1999-03-08 | 三井化学株式会社 | フェノール重合体の製造方法 |
| JP3122834B2 (ja) | 1994-09-20 | 2001-01-09 | 明和化成株式会社 | 新規フェノールノボラック縮合体 |
| JP3586327B2 (ja) * | 1995-12-25 | 2004-11-10 | 明和化成株式会社 | フェノール−ナフトールノボラック縮合体 |
| JP3575776B2 (ja) * | 1995-12-28 | 2004-10-13 | 日本化薬株式会社 | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
| JPH09268218A (ja) * | 1996-03-29 | 1997-10-14 | Nippon Kayaku Co Ltd | エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物 |
| JP3992181B2 (ja) * | 2002-03-22 | 2007-10-17 | 日本化薬株式会社 | エポキシ樹脂の製造方法 |
| JP5400267B2 (ja) * | 2005-12-13 | 2014-01-29 | 日立化成株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
| JP5228328B2 (ja) * | 2007-02-01 | 2013-07-03 | 宇部興産株式会社 | 低溶融粘度フェノールノボラック樹脂、その製造方法およびそれを用いたエポキシ樹脂硬化物 |
| JP5135973B2 (ja) * | 2007-09-28 | 2013-02-06 | Dic株式会社 | エポキシ樹脂組成物、及びその硬化物 |
| JP2011252037A (ja) * | 2010-05-31 | 2011-12-15 | Meiwa Kasei Kk | エポキシ樹脂組成物、該エポキシ樹脂組成物を用いた半導体封止材料及び積層板 |
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- 2012-11-27 KR KR1020147010822A patent/KR101889442B1/ko active Active
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812447B2 (ja) | 1988-03-16 | 1996-02-07 | キヤノン株式会社 | トナー及びその製造方法 |
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| WO2013080936A1 (ja) | 2013-06-06 |
| JP2013112738A (ja) | 2013-06-10 |
| CN103958561B (zh) | 2016-04-27 |
| CN103958561A (zh) | 2014-07-30 |
| TW201329137A (zh) | 2013-07-16 |
| TWI560219B (https=) | 2016-12-01 |
| KR20140099229A (ko) | 2014-08-11 |
| KR101889442B1 (ko) | 2018-08-17 |
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