JP5748019B1 - ピン端子及び端子材料 - Google Patents
ピン端子及び端子材料 Download PDFInfo
- Publication number
- JP5748019B1 JP5748019B1 JP2014172569A JP2014172569A JP5748019B1 JP 5748019 B1 JP5748019 B1 JP 5748019B1 JP 2014172569 A JP2014172569 A JP 2014172569A JP 2014172569 A JP2014172569 A JP 2014172569A JP 5748019 B1 JP5748019 B1 JP 5748019B1
- Authority
- JP
- Japan
- Prior art keywords
- plating film
- pin terminal
- core material
- terminal
- rich phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims abstract description 31
- 238000007747 plating Methods 0.000 claims abstract description 139
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 73
- 239000000956 alloy Substances 0.000 claims abstract description 73
- 239000011162 core material Substances 0.000 claims abstract description 59
- 229910016347 CuSn Inorganic materials 0.000 claims abstract description 45
- 229910017827 Cu—Fe Inorganic materials 0.000 claims abstract description 25
- 239000000126 substance Substances 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 10
- 229910000765 intermetallic Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 abstract description 28
- 238000005260 corrosion Methods 0.000 abstract description 28
- 239000010949 copper Substances 0.000 description 74
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 48
- 238000000034 method Methods 0.000 description 21
- 230000000694 effects Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- -1 brass Chemical compound 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014172569A JP5748019B1 (ja) | 2014-08-27 | 2014-08-27 | ピン端子及び端子材料 |
| PCT/JP2015/073406 WO2016031676A1 (fr) | 2014-08-27 | 2015-08-20 | Borne à broche et matériau de borne |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014172569A JP5748019B1 (ja) | 2014-08-27 | 2014-08-27 | ピン端子及び端子材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP5748019B1 true JP5748019B1 (ja) | 2015-07-15 |
| JP2016048611A JP2016048611A (ja) | 2016-04-07 |
Family
ID=53718463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014172569A Expired - Fee Related JP5748019B1 (ja) | 2014-08-27 | 2014-08-27 | ピン端子及び端子材料 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5748019B1 (fr) |
| WO (1) | WO2016031676A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7333010B2 (ja) * | 2019-06-27 | 2023-08-24 | 株式会社オートネットワーク技術研究所 | 電気接点材料、端子金具、コネクタ、ワイヤーハーネス、及び電気接点材料の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02145794A (ja) * | 1988-11-28 | 1990-06-05 | Kobe Steel Ltd | 耐熱剥離性に優れたリフロー錫またははんだめっき銅または銅合金材料 |
| JP4305699B2 (ja) * | 1999-10-12 | 2009-07-29 | 協和電線株式会社 | 電子部品用錫系めっき条材とその製造法 |
| JP2003151668A (ja) * | 2001-11-13 | 2003-05-23 | Yazaki Corp | 端 子 |
| US7615255B2 (en) * | 2005-09-07 | 2009-11-10 | Rohm And Haas Electronic Materials Llc | Metal duplex method |
| JP5464792B2 (ja) * | 2007-04-20 | 2014-04-09 | 株式会社神戸製鋼所 | 嵌合型コネクタ用端子の製造方法 |
| JP5498710B2 (ja) * | 2009-02-23 | 2014-05-21 | 三菱伸銅株式会社 | 導電部材及びその製造方法 |
| JP5871206B2 (ja) * | 2011-04-26 | 2016-03-01 | 株式会社オートネットワーク技術研究所 | コネクタ用電気接点材料の製造方法 |
| JP5640922B2 (ja) * | 2011-08-31 | 2014-12-17 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
| JP5811509B2 (ja) * | 2012-04-18 | 2015-11-11 | 株式会社オートネットワーク技術研究所 | コネクタ用電気接点材料の製造方法 |
-
2014
- 2014-08-27 JP JP2014172569A patent/JP5748019B1/ja not_active Expired - Fee Related
-
2015
- 2015-08-20 WO PCT/JP2015/073406 patent/WO2016031676A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016031676A1 (fr) | 2016-03-03 |
| JP2016048611A (ja) | 2016-04-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150414 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150427 |
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| R150 | Certificate of patent or registration of utility model |
Ref document number: 5748019 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
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| LAPS | Cancellation because of no payment of annual fees |