WO2023182259A1 - Matériau de borne et borne de connexion électrique - Google Patents

Matériau de borne et borne de connexion électrique Download PDF

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Publication number
WO2023182259A1
WO2023182259A1 PCT/JP2023/010836 JP2023010836W WO2023182259A1 WO 2023182259 A1 WO2023182259 A1 WO 2023182259A1 JP 2023010836 W JP2023010836 W JP 2023010836W WO 2023182259 A1 WO2023182259 A1 WO 2023182259A1
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WIPO (PCT)
Prior art keywords
alloy
coating layer
terminal
layer
base material
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PCT/JP2023/010836
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English (en)
Japanese (ja)
Inventor
倫丈 竃本
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
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Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2023182259A1 publication Critical patent/WO2023182259A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • the present disclosure relates to terminal materials and electrical connection terminals.
  • a material in which a coating layer made of another metal is provided on the surface of a base material made of metal such as copper or copper alloy is often used.
  • the covering layer can impart desired properties to the electrical connection terminal.
  • a coating layer containing a Cu--Sn alloy is known as a coating layer that can reduce friction on the surface of a terminal material and reduce the insertion force (combinant force) required to connect an electrical connection terminal.
  • an alloy part 41 made of a Cu-Sn alloy and having irregularities is formed, as in the terminal material 9 shown in FIG.
  • a structure in which the portion 42 covers the surface of the alloy portion 41 is formed. It is said that because the alloy part 41 made of a hard Cu-Sn alloy is present below the Sn part 42, the effect of lowering friction can be obtained at the same time as the effect of lowering contact resistance due to the contribution of the Sn part 42. .
  • Patent Document 1 discloses that at least the surface of the contact part with the mating material of the copper alloy base material is , discloses a terminal including a layer obtained by reflow processing a layer formed by sequentially laminating a nickel plating layer, a copper plating layer, and a tin plating layer with a thickness of 1.1 ⁇ m or less. A copper-tin alloy layer is formed by the reflow process. Patent Document 1 states that by making the tin plating layer thinner, the mechanical resistance caused by plastic deformation during terminal insertion can be reduced.
  • Patent Document 1 attempts to reduce the insertion force of the terminal by thinning the Sn plating layer, which is the raw material for alloy formation, but does not mention the Cu-Sn alloy and the distribution of Sn in the coating layer. Not yet. By considering the distribution of Cu-Sn alloy and Sn in the coating layer, it is possible that friction can be effectively reduced.
  • the terminal material of the present disclosure includes a base material and a coating layer that covers the surface of the base material, and the coating layer includes an alloy portion made of a Cu-Sn alloy and a Sn , both the alloy part and the Sn part are exposed on the surface of the coating layer, and the alloy exposure rate indicating the area ratio occupied by the alloy part on the surface of the coating layer is 30%. That's all.
  • the electrical connection terminal of the present disclosure is configured to include the terminal material, and the coating layer is formed on the surface of the base material at least in the contact portion that contacts the other conductive member.
  • the terminal material and electrical connection terminal according to the present disclosure are terminal materials that can effectively reduce surface friction from the viewpoint of the distribution of Cu-Sn alloy and Sn in the coating layer containing Cu-Sn alloy and Sn. , and such electrical connection terminals.
  • FIG. 1 is a cross-sectional view schematically showing the configuration of a terminal material according to an embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional view showing the structure of material layers for forming the terminal material.
  • FIG. 3 is a cross-sectional view schematically showing the structure of an electrical connection terminal according to an embodiment of the present disclosure.
  • FIG. 4 shows a table of scanning electron microscope images obtained by observing the surface of the coating layer, the binarized image obtained from the images, and the alloy exposure rate.
  • FIG. 5 is a diagram in which the alloy exposure rate and the terminal insertion force are plotted against the thickness of the Sn portion.
  • FIG. 6 is a cross-sectional view schematically showing the structure of a terminal material in which the Sn portion is formed thick.
  • the terminal material of the present disclosure includes a base material and a coating layer that covers the surface of the base material, and the coating layer includes an alloy portion made of a Cu-Sn alloy and a Sn , both the alloy part and the Sn part are exposed on the surface of the coating layer, and the alloy exposure rate indicating the area ratio occupied by the alloy part on the surface of the coating layer is 30%. That's all.
  • the Cu--Sn alloy comes into direct contact with the other party's conductive member, such as the other party's terminal. Furthermore, since the amount of Sn portions present on the surface of the coating layer is reduced, wear due to digging up or adhesion of the Sn portions becomes less likely to occur. As a result, the friction on the surface of the coating layer is kept low. In particular, when the alloy exposure rate on the surface of the coating layer is 30% or more, the friction reduction effect of the Cu--Sn alloy can be sufficiently obtained.
  • the alloy exposure rate is preferably 50% or less.
  • a coating layer in which Sn is exposed at a certain exposure rate along with the Cu--Sn alloy can be easily manufactured by a method of laminating and heating a Cu layer and a Sn layer. Further, by sufficiently exposing Sn to the surface of the coating layer, the friction reduction effect due to the contribution of the Cu--Sn alloy and the effect due to the contribution of Sn, such as reduction in contact resistance, are both achieved.
  • the average thickness of the Sn portion is preferably 0.10 ⁇ m or more and 0.35 ⁇ m or less. Further, the average thickness of the alloy portion is preferably 0.25 ⁇ m or more and 0.48 ⁇ m or less. Then, by a method of laminating and heating a Cu layer and a Sn layer, a coating layer having a high alloy exposure rate and an excellent friction reduction effect can be manufactured.
  • the base material is made of Cu or a Cu alloy, and further includes a diffusion suppressing layer made of Ni or a Ni alloy between the base material and the coating layer.
  • the diffusion suppressing layer made of Ni and Ni alloy effectively suppresses atoms such as Cu constituting the base material from diffusing into the coating layer. Thereby, it is possible to reduce the influence of atomic diffusion from the base material, exhibit a predetermined alloy exposure rate, and stably obtain a coating layer with reduced friction.
  • the electrical connection terminal of the present disclosure is configured to include the terminal material, and the coating layer is formed on the surface of the base material at least in the contact portion that contacts the other conductive member.
  • both the alloy part and the Sn part are exposed on the surface of the contact part and have a predetermined alloy exposure ratio, so that the contact part can maintain a low surface friction coefficient as described above. It becomes what is given.
  • the electrical connection terminal is preferably configured as a male terminal for a printed circuit board.
  • Male terminals for printed circuit boards are often constructed as post-plated products in which a base material is formed into the terminal shape and then a metal coating layer is formed. , the thickness of the coating layer is unevenly distributed, and a thick metal coating layer is likely to be formed at sharp points such as the tips of male terminals. As a result, friction may increase at the tip.
  • an alloy exposure rate of 30% or more is ensured, so even if there are areas where the coating layer is locally thick, surface friction is effectively reduced, including at those areas. low insertion force can be achieved.
  • the term "elementary metal” includes cases where it contains unavoidable impurities.
  • alloy includes both a solid solution and an intermetallic compound.
  • an alloy containing a certain metal as a main component refers to an alloy in which the metal element is contained in the composition in an amount of 50 atomic % or more.
  • Terminal materials according to embodiments of the present disclosure will be described below.
  • a cross section of a terminal material 1 according to an embodiment of the present disclosure is schematically shown in FIG.
  • the terminal material 1 includes a base material 2 and a coating layer 4 that covers the surface of the base material 2. Although optional, it is preferable to provide a diffusion suppressing layer 3 between the base material 2 and the coating layer 4.
  • the coating layer 4 is preferably exposed on the outermost surface of the terminal material 1, but a thin film (not shown) such as an organic layer may be added to the surface of the coating layer 4 unless it significantly affects the characteristics of the coating layer 4. may be provided.
  • the material constituting the base material 2 is not particularly limited.
  • the base material 2 Cu or Cu alloy, Al or Al alloy, Fe or Fe alloy, etc., which are often used as constituent materials of electrical connection members, can be suitably used.
  • Cu or Cu alloy which is a metal with excellent conductivity and mechanical properties, can be suitably used.
  • the diffusion suppression layer 3 is a layer that suppresses atoms such as Cu that constitute the base material 2 from diffusing into the coating layer 4.
  • constituent atoms of the base material diffuse to the surface of the coating layer 4 and undergo oxidation, the contact resistance of the surface of the coating layer 4 increases. Further, due to the influence of the diffused constituent atoms of the base material, there is a possibility that the desired composition and material distribution cannot be obtained in the coating layer 4. Therefore, by providing the diffusion suppressing layer 3 between the base material 2 and the coating layer 4, it is possible to suppress those phenomena that may occur when constituent atoms of the base material diffuse into the coating layer 4.
  • the type of diffusion suppressing layer 3 is not limited as long as it can suppress the diffusion of constituent atoms of the base material, but Ni or Ni alloy is preferably used as a metal that exhibits a high diffusion suppressing effect. It can be applied to Although the thickness of the diffusion suppressing layer 3 is not particularly limited, it is preferably 0.5 ⁇ m or more from the viewpoint of obtaining a sufficient diffusion suppressing effect. On the other hand, from the viewpoint of workability, etc., the thickness is preferably 2 ⁇ m or less. At the interface between the diffusion suppressing layer 3, the base material 2, and the coating layer 4, a region where the metal forming the diffusion suppressing layer 3 and the metal forming the base material 2 and the coating layer 4, respectively, formed an alloy is formed. may have.
  • the covering layer 4 is configured as a metal layer containing Sn and Cu.
  • the coating layer 4 does not have a uniform composition and includes both an alloy part 41 made of a Cu--Sn alloy and an Sn part 42 made of Sn. It is preferable that the coating layer 4 is composed only of Sn and Cu, excluding unavoidable impurities and atoms that unavoidably diffuse from the base material 2 and the diffusion suppressing layer 3. It is preferable that the alloy part 41 and the Sn part 42 be composed of only a Cu-Sn alloy and Sn, respectively, excluding unavoidable impurities, but a small amount of impurities or additive elements other than the Cu-Sn alloy and Sn may be added. (for example, 10% by mass or less).
  • the composition of the Cu--Sn alloy constituting the alloy portion 41 is not particularly limited, it is preferably composed of an intermetallic compound of Cu 6 Sn 5 as a main component. The details of the structure of the coating layer 4 will be explained below.
  • the coating layer 4 has an alloy part 41 made of a Cu-Sn alloy and an Sn part 42 made of Sn, and both the alloy part 41 and the Sn part 42 is exposed on the surface of the coating layer 4.
  • the alloy portion 41 is configured as a layer having an uneven structure projecting like a mountain.
  • the Sn portion 42 is formed by covering the alloy portion 41 so as to fill the unevenness of the uneven structure.
  • the coating layer 4, which includes the alloy part 41 made of a Cu-Sn alloy having an uneven structure and the Sn part 42 covering the surface thereof, is formed by combining the Cu layer 5 and the Sn layer 6 as described later. It can be easily manufactured by sequentially laminating the layers and heating them.
  • both the alloy part 41 and the Sn part 42 are exposed on the outermost surface of the coating layer 4. That is, near the top of the convex portion of the uneven structure of the alloy portion 41, there is an exposed alloy portion 41a where the Cu—Sn alloy is exposed and is not covered with the Sn portion 42. Then, on the surface of the coating layer 4, the area ratio occupied by the alloy part 41, that is, the alloy exposure ratio expressed as the ratio of the area occupied by the exposed alloy part 41a to the entire surface area is 30% or more. There is.
  • the Sn portion 42 exhibits low contact resistance and provides good electrical connection characteristics between the surface of the terminal material 1 and the other conductive member.
  • the alloy portion 41 plays a role in keeping the friction low (reducing the coefficient of friction) in the coating layer 4 because the Cu--Sn alloy has characteristics such as high hardness.
  • the presence of the alloy portion 41 in the lower layer of the Sn portion 42 provides a friction reduction effect on the surface of the Sn portion 42 . Further, since the alloy portion 41 is exposed on the outermost surface and comes into direct contact with the other conductive member, an even higher effect in reducing friction can be obtained.
  • both the Sn portion 42 and the alloy portion 41 made of Cu-Sn are exposed on the surface of the coating layer 4, so that contact resistance can be reduced, etc. It is possible to enjoy both the effects of the alloy portion 41 and the effects of the alloy portion 41, such as reduction of friction.
  • the Sn portion 42 is formed thickly as shown in FIG. By occupying a large volume, when sliding is performed between the Sn portions 42 and the other conductive member, the Sn portions 42 cause digging and adhesion, thereby increasing the coefficient of friction.
  • the alloy exposure rate of the alloy part 41 is 30% or more. This results in a particularly excellent friction reduction effect.
  • the alloy part 41 occupies 30% or more of the surface of the coating layer 4, comes into contact with the other conductive member, and is directly involved in the friction phenomenon during sliding, so that the friction reduction effect of the alloy part 41 is highly exhibited. It is from.
  • the fact that the exposure rate of the alloy part 41 is high means that the thickness of the Sn part 42 covering the alloy part 41 is kept small, and the amount of Sn part 42 present in the coating layer 4 is reduced. It means that.
  • the terminal material 1 according to the present embodiment has an excellent effect of reducing friction on the surface of the coating layer 4. This reduction in friction is obtained as a result of the distribution of the alloy portions 41 and Sn portions 42 in the coating layer 4.
  • the alloy exposure rate is more preferably 35% or more, more preferably 40% or more, or 45% or more.
  • the upper limit of the alloy exposure rate is not particularly determined, but it is preferably kept at about 50% or less, and even 48% or less. An alloy exposure rate of 30% or more and below these upper limits can be easily achieved in the structure of the coating layer 4 in which the Sn part 42 covers the surface of the alloy part 41 having an uneven structure. It can be easily obtained by a method of laminating layers 6 and heating them. In addition, if the alloy exposure rate is below the above upper limit, the exposure rate of the Sn portion 42 will be ensured sufficiently large, so that in addition to the friction reduction effect of the alloy portion 41, the Sn portion The effects brought about by 42 can also be fully obtained.
  • the details of the thickness and distribution of the Sn portion 42 and the alloy portion 41 are not particularly limited as long as the above alloy exposure rate is given. However, since it is easy to provide the coating layer 4 having an alloy exposure rate of 30% or more and preferably 50% or less, and it is easy to form the coating layer 4 by laminating and heating the Cu layer 5 and the Sn layer 6, the coating It is preferable that layer 4 has the following configuration.
  • the thickness of the Sn portion 42 is preferably smaller than the thickness (average value; the same applies below) of the alloy portion 41.
  • the thicknesses of the Sn portion 42 and the alloy portion 41 are not particularly limited.
  • the thickness (average value) of the Sn portion 42 is preferably 0.35 ⁇ m or less, more preferably 0.25 ⁇ m or less, or 0.20 ⁇ m or less. This makes it easy to ensure a high alloy exposure rate, and it is also possible to effectively suppress an increase in friction due to digging up or adhesion of the Sn portion 42.
  • the thickness (average value) of the Sn portion 42 is preferably 0.10 ⁇ m or more, more preferably 0.12 ⁇ m or more.
  • the thickness (average value) of the alloy portion 41 should be 0.25 ⁇ m or more, further 0.30 ⁇ m or more, or 0.35 ⁇ m or more, from the viewpoint of ensuring a sufficient alloy exposure rate and making it easier to obtain the effect of reducing friction. It is preferable that there be.
  • the thickness of the alloy portion 41 is preferably 0.48 ⁇ m or less, and more preferably 0.45 ⁇ m or less.
  • the specific distribution shape of the alloy part 41 and the Sn part 42 exposed on the surface of the coating layer 4 is not particularly limited, but from the viewpoint of effectively utilizing the characteristics of both the alloy part 41 and the Sn part 42. It is only necessary that the alloy portion 41 and the Sn portion 42 are distributed so that they both occupy a certain amount of area and coexist at a location that contacts the other conductive member, such as a contact portion of a terminal.
  • the method of forming the coating layer 4 is not particularly limited, but a method of alloying Cu and Sn can be suitably used. That is, as shown in FIG. 2, a raw material 1' is prepared in which a Cu layer 5 and a Sn layer 6 are laminated in this order on the surface of a base material 2 on which a diffusion suppressing layer 3 is appropriately formed. The Cu layer 5 and the Sn layer 6 are preferably formed by electrolytic plating. Next, this raw material 1' is heated at a temperature equal to or higher than the melting point of Sn (reflow treatment). By heating, alloying of Cu and Sn occurs, and an alloy portion 41 made of a Cu--Sn alloy is formed.
  • the Sn that was not spent on alloying becomes the Sn portion 42.
  • the alloy portion 41 is formed as a layer having an uneven structure without any special operation, and the Sn layer is formed to fill the unevenness. 42 can form a coating layer 4 that covers the alloy part 41.
  • the alloy exposure rate in the coating layer 4 can be controlled, for example, by the thicknesses of the Cu layer 5 and the Sn layer 6 in the raw material 1'. From the viewpoint of sufficiently increasing the alloy exposure rate, the thickness of the Sn layer 6 should be kept at 6.0 times or less, further 5.0 times or less, and 4.0 times or less than the Cu layer 5. It is preferable to leave it there. Further, the thickness of the Sn layer 6 is preferably set to 0.60 ⁇ m or less, 0.50 ⁇ m or less, or 0.40 ⁇ m or less.
  • the thickness of the Sn layer 6 is set to 1 It is preferable to set it to .0 times or more, further 2.0 times or more, or 3.0 times or more. Further, the thickness of the Sn layer 6 is preferably set to 0.10 ⁇ m or more, 0.20 ⁇ m or more, or 0.30 ⁇ m or more.
  • the thickness of the Cu layer 5 is preferably 0.05 ⁇ m or more, or 0.10 ⁇ m or more, and preferably 0.20 ⁇ m or less.
  • the ratio of the thickness of the Sn layer 6 and the Cu layer 5 in the raw material 1' is the atomic ratio of Sn atoms and Cu atoms contained in the entire coating layer 4 in the coating layer 4 after alloy formation.
  • the value converted to the volume ratio of Cu can be confirmed from the configuration of the terminal material 1.
  • An electrical connection terminal is configured to include the terminal material 1 according to the embodiment of the present disclosure described above.
  • the coating layer 4 is formed at least on a contact portion such as a mating terminal that comes into contact with a mating conductive member.
  • the covering layer 4 (and the diffusion suppressing layer 3) may be formed on the entire surface of the electrical connection terminal or only on a part of the surface as long as it is formed on at least the contact portion.
  • FIG. 3 illustrates the structure of the PCB male terminal 10.
  • the PCB male terminal 10 is a long electrical connection terminal, and has a board connection part 11 at one end that is inserted into a through hole of a printed circuit board and connected, and the other end is inserted into a mating connection terminal. It has a terminal connection part 12 in the shape of a fitting type male terminal that is connected by a connector or the like.
  • a coating layer 4 is provided on the surface of the base material 2 at a location that includes at least the board connection portion 11 and the terminal connection portion 12, which serve as contact portions.
  • the coating layer 4 is formed over the entire surface.
  • both the alloy part 41 and the Sn part 42 are exposed on the surface of the coating layer 4, and by having an alloy exposure rate of 30% or more, friction is reduced. It has an excellent friction reduction effect, and electrical connection terminals made of the terminal material 1 according to the embodiment of the present disclosure, including the male terminal 10 for PCB, can enjoy the friction reduction effect at the contact portion. . That is, for example, insertion force (or fitting force; the same in this specification) is the force required when inserting and fitting the terminal connecting part 11 with a mating conductive member such as a female terminal with sliding movement. can be kept small.
  • a plurality of male PCB terminals 10 are often inserted and mated all at once in the state of a connector fixed to a connector housing, and reducing the insertion force of each terminal 10 has a large insertion force reduction effect for the connector as a whole. Leads to.
  • male terminals for PCBs are often formed by forming a base material into a predetermined terminal shape by punching or the like, and then forming a metal coating layer on the surface of the base material by plating (post-plating).
  • the thickness of the metal coating layer at sharp points such as the tips of the board connection part 11 and the terminal connection part 12 is affected by the primary current distribution during plating.
  • a non-uniform distribution in which the thickness is larger than other parts is likely to occur in the metal coating layer. If a metal coating layer such as a Sn layer that is prone to adhesion or digging is formed thickly at the contact portion, the terminal insertion force will increase.
  • the alloy portion 41 is exposed together with the Sn portion 42 on the surface of the coating layer 4, and the alloy exposure rate is 30% or more.
  • the alloy exposure rate is 30% or more.
  • a Ni diffusion suppressing layer with a thickness of 1 ⁇ m was formed on the surface of a flat copper alloy base material, and then a Cu layer and a Sn layer were formed in this order to obtain a raw material.
  • Each metal layer was formed by electrolytic plating.
  • the thickness of the Cu layer 5 was 0.1 ⁇ m, and the thickness of the Sn layer was as shown in Table 1 below.
  • this raw material was heated and subjected to a reflow treatment to form a coating layer including an alloy part and a Sn part by alloying Cu and Sn.
  • a copper alloy base material was punched into the shape of the male terminal for PCB shown in Fig. 3, and the surface was coated with a Ni layer, a Cu layer, and a Sn layer in the same manner as above.
  • a coating layer was formed on the terminal surface by layer formation and reflow treatment.
  • a 0.64 mm square terminal was used as the terminal.
  • the produced terminals were set in a connector housing to produce a 40-pole test model connector imitating a multi-pole connector for PCB.
  • FIG. 4 shows SEM images of the surfaces of a plurality of samples in which the thickness of the Sn layer of the raw material was varied, together with the binarized image and the value of the alloy exposure rate.
  • the scale bar in the SEM image indicates 50 ⁇ m.
  • the region observed darkly corresponds to the alloy part made of a Cu-Sn alloy, and the region observed brightly corresponds to the Sn part. From the SEM images, it is confirmed that both the alloy part and the Sn part are mixed and exposed on the surface of each sample.
  • the alloy exposure rate varies depending on the sample, and the alloy exposure rate tends to be high in regions where the Sn layer of the raw material has a relatively small thickness.
  • Table 1 summarizes the thickness of the Sn layer of the raw material, the alloy exposure rate, the thickness of each part, and the measured values of the connector fitting force for each sample.
  • the alloy exposure rate values shown in Table 1 and FIG. 5, which will be described later, are the average of the same measurement results as in FIG. 4 obtained at a plurality of observation points.
  • the values of the alloy exposure rate and the connector fitting force are plotted against the average thickness of the Sn portion in the coating layer for the data shown in Table 1.
  • the alloy exposure rate is indicated by a diamond, and its value is shown on the left axis.
  • the connector fitting force is indicated by a circle, and its value is shown on the right axis.
  • Terminal material 1' Raw material 10 Male terminal for PCB 11 Board connection part 12 Terminal connection part 2 Base material 3 Diffusion suppression layer 4 Covering layer 41 Alloy part 41a Alloy exposed part 42 Sn part 5 Cu layer 6 Sn layer 9 Sn part Thick terminal material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne : un matériau de borne conçu pour réduire efficacement le frottement de surface à partir de la perspective d'un alliage Cu-Sn et des distributions de Sn à l'intérieur d'une couche de revêtement contenant l'alliage Cu-Sn et Sn ; et une borne de connexion électrique comprenant un tel matériau de borne.　Un matériau de borne (1 ) comprend un substrat (2) et une couche de revêtement (4) qui recouvre une surface du substrat (2). La couche de revêtement (4) comporte une partie d'alliage (41) composée d'un alliage Cu-Sn, et une partie Sn (42) composée de Sn. Sur une surface de la couche de revêtement (4), à la fois la partie d'alliage (41) et la partie Sn (42) sont exposées. Sur la surface de la couche de revêtement (4), le taux d'exposition de l'alliage, qui est le pourcentage surfacique que la partie d'alliage (41) représente, est de 30 % ou plus. La borne de connexion électrique est conçue pour comprendre le matériau de borne (1). La couche de revêtement (4) est formée sur la surface du substrat (2), au moins au niveau d'une section de contact où la borne vient en contact avec un élément électroconducteur homologue.
PCT/JP2023/010836 2022-03-22 2023-03-20 Matériau de borne et borne de connexion électrique WO2023182259A1 (fr)

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JP2022-045824 2022-03-22
JP2022045824 2022-03-22

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009005041A1 (fr) * 2007-06-29 2009-01-08 The Furukawa Electric Co., Ltd. Connecteur résistant à l'usure et procédé de fabrication correspondant
JP2016211031A (ja) * 2015-05-07 2016-12-15 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
WO2018074256A1 (fr) * 2016-10-17 2018-04-26 古河電気工業株式会社 Matériau de barre conductrice
JP2020105574A (ja) * 2018-12-27 2020-07-09 三菱マテリアル株式会社 防食端子材及び端子並びに電線端末部構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009005041A1 (fr) * 2007-06-29 2009-01-08 The Furukawa Electric Co., Ltd. Connecteur résistant à l'usure et procédé de fabrication correspondant
JP2016211031A (ja) * 2015-05-07 2016-12-15 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
WO2018074256A1 (fr) * 2016-10-17 2018-04-26 古河電気工業株式会社 Matériau de barre conductrice
JP2020105574A (ja) * 2018-12-27 2020-07-09 三菱マテリアル株式会社 防食端子材及び端子並びに電線端末部構造

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