JP5736270B2 - 放熱部品及びその製造方法 - Google Patents

放熱部品及びその製造方法 Download PDF

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Publication number
JP5736270B2
JP5736270B2 JP2011170156A JP2011170156A JP5736270B2 JP 5736270 B2 JP5736270 B2 JP 5736270B2 JP 2011170156 A JP2011170156 A JP 2011170156A JP 2011170156 A JP2011170156 A JP 2011170156A JP 5736270 B2 JP5736270 B2 JP 5736270B2
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JP
Japan
Prior art keywords
plating layer
metal
layer
plating
carbon
Prior art date
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Active
Application number
JP2011170156A
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English (en)
Japanese (ja)
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JP2012082510A (ja
JP2012082510A5 (OSRAM
Inventor
順之 諏訪
順之 諏訪
賢二 川村
賢二 川村
周三 青木
周三 青木
昌夫 中沢
昌夫 中沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011170156A priority Critical patent/JP5736270B2/ja
Priority to US13/228,992 priority patent/US9136200B2/en
Publication of JP2012082510A publication Critical patent/JP2012082510A/ja
Publication of JP2012082510A5 publication Critical patent/JP2012082510A5/ja
Application granted granted Critical
Publication of JP5736270B2 publication Critical patent/JP5736270B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemically Coating (AREA)
JP2011170156A 2010-09-14 2011-08-03 放熱部品及びその製造方法 Active JP5736270B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011170156A JP5736270B2 (ja) 2010-09-14 2011-08-03 放熱部品及びその製造方法
US13/228,992 US9136200B2 (en) 2010-09-14 2011-09-09 Heat radiating component and method of producing same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010205631 2010-09-14
JP2010205631 2010-09-14
JP2011170156A JP5736270B2 (ja) 2010-09-14 2011-08-03 放熱部品及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012082510A JP2012082510A (ja) 2012-04-26
JP2012082510A5 JP2012082510A5 (OSRAM) 2014-08-07
JP5736270B2 true JP5736270B2 (ja) 2015-06-17

Family

ID=45806999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011170156A Active JP5736270B2 (ja) 2010-09-14 2011-08-03 放熱部品及びその製造方法

Country Status (2)

Country Link
US (1) US9136200B2 (OSRAM)
JP (1) JP5736270B2 (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6118540B2 (ja) * 2012-11-08 2017-04-19 新光電気工業株式会社 放熱部品及びその製造方法
WO2016180278A1 (zh) * 2015-05-08 2016-11-17 宁波信远工业集团有限公司 一种波热转化结构及其应用
JP6489979B2 (ja) * 2015-09-07 2019-03-27 新光電気工業株式会社 放熱部品及びその製造方法
US20170211899A1 (en) * 2016-01-27 2017-07-27 GM Global Technology Operations LLC Heat exchangers containing carbon nanotubes and methods for the manufacture thereof
CN108779556B (zh) * 2016-03-25 2020-06-12 三菱重工发动机和增压器株式会社 纤维增强构件的镀敷方法
GB201706783D0 (en) * 2017-04-28 2017-06-14 Cambridge Entpr Ltd Composite layers, methods for their manufacture and uses thereof
JP2020011426A (ja) * 2018-07-17 2020-01-23 Ｊｘ金属株式会社 積層体及び放熱部材
JP7129316B2 (ja) * 2018-11-07 2022-09-01 昭和電工株式会社 沸騰伝熱部材および沸騰冷却装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002206170A (ja) * 2000-11-10 2002-07-26 Ngk Insulators Ltd メッキされた複合材料及びその製造方法
US20030066632A1 (en) * 2001-10-09 2003-04-10 Charles J. Bishop Corrosion-resistant heat exchanger
JP4324434B2 (ja) 2003-09-18 2009-09-02 新光電気工業株式会社 放熱部材及びその製造方法
JP4448356B2 (ja) * 2004-03-26 2010-04-07 富士通株式会社 半導体装置およびその製造方法
JP4993157B2 (ja) 2004-05-07 2012-08-08 新光電気工業株式会社 粒状物及び粒状物の製造方法
JP4489561B2 (ja) 2004-06-18 2010-06-23 国立大学法人信州大学 繊維状ナノカーボン・金属複合材料およびその製造方法
US7906210B2 (en) 2004-10-27 2011-03-15 Nissei Plastic Industrial Co., Ltd. Fibrous nanocarbon and metal composite and a method of manufacturing the same
JP4044926B2 (ja) 2004-12-20 2008-02-06 株式会社エルグ 表面処理方法及び接点部材
JP2007254876A (ja) * 2006-03-27 2007-10-04 Dowa Holdings Co Ltd 複合めっき材およびその製造方法
JP4599565B2 (ja) * 2006-10-23 2010-12-15 国立大学法人信州大学 電解めっき方法および電解めっき液
JP2008149393A (ja) * 2006-12-15 2008-07-03 Seiko Epson Corp 加工工具、及び当該加工工具の製造方法
JP2008214667A (ja) * 2007-02-28 2008-09-18 Shinshu Univ 亜鉛−ナノカーボン複合めっき物およびその製造方法
JP5467446B2 (ja) * 2007-08-27 2014-04-09 株式会社ブラザー 炭素繊維強化プラスチックからの炭素繊維の脱落防止方法
JP2010180454A (ja) * 2009-02-05 2010-08-19 Hitachi Cable Ltd 表面処理銅箔およびその製造方法ならびに銅張積層板
JP2010192661A (ja) 2009-02-18 2010-09-02 Sumitomo Electric Ind Ltd 放熱部品とその製造方法、およびこれを用いた放熱装置と放熱方法
JP5453602B2 (ja) * 2009-03-17 2014-03-26 国立大学法人信州大学 無電解Ｃｕめっき液および無電解Ｃｕめっき方法
US20120031644A1 (en) * 2010-04-15 2012-02-09 Los Alamos National Security, Llc Ultraconducting articles

Also Published As

Publication number Publication date
JP2012082510A (ja) 2012-04-26
US9136200B2 (en) 2015-09-15
US20120064361A1 (en) 2012-03-15

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