JP5728026B2 - 研磨パッド及びこれの製造方法 - Google Patents

研磨パッド及びこれの製造方法 Download PDF

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Publication number
JP5728026B2
JP5728026B2 JP2012546101A JP2012546101A JP5728026B2 JP 5728026 B2 JP5728026 B2 JP 5728026B2 JP 2012546101 A JP2012546101 A JP 2012546101A JP 2012546101 A JP2012546101 A JP 2012546101A JP 5728026 B2 JP5728026 B2 JP 5728026B2
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Prior art keywords
polishing
layer
composition
present disclosure
polishing pad
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English (en)
Japanese (ja)
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JP2013515379A5 (https=
JP2013515379A (ja
Inventor
ナイチャオ リー，
ナイチャオ リー，
ウィリアム ディー． ジョセフ，
ウィリアム ディー． ジョセフ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2013515379A5 publication Critical patent/JP2013515379A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Polyurethanes Or Polyureas (AREA)
JP2012546101A 2009-12-22 2010-12-20 研磨パッド及びこれの製造方法 Active JP5728026B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US28898209P 2009-12-22 2009-12-22
US61/288,982 2009-12-22
US42244210P 2010-12-13 2010-12-13
US61/422,442 2010-12-13
PCT/US2010/061199 WO2011087737A2 (en) 2009-12-22 2010-12-20 Polishing pad and method of making the same

Publications (3)

Publication Number Publication Date
JP2013515379A JP2013515379A (ja) 2013-05-02
JP2013515379A5 JP2013515379A5 (https=) 2014-02-13
JP5728026B2 true JP5728026B2 (ja) 2015-06-03

Family

ID=44247814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012546101A Active JP5728026B2 (ja) 2009-12-22 2010-12-20 研磨パッド及びこれの製造方法

Country Status (6)

Country Link
US (1) US20130012108A1 (https=)
JP (1) JP5728026B2 (https=)
KR (1) KR101855073B1 (https=)
SG (1) SG181890A1 (https=)
TW (1) TWI517975B (https=)
WO (1) WO2011087737A2 (https=)

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US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
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JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
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KR101894071B1 (ko) * 2016-11-03 2018-08-31 에스케이씨 주식회사 연마패드 제조용 자외선 경화형 수지 조성물, 연마패드 및 이의 제조방법
US11814795B2 (en) * 2017-04-03 2023-11-14 Jl Darling Llc Coating for recyclable paper
US11524390B2 (en) * 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
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KR102270392B1 (ko) * 2019-10-01 2021-06-30 에스케이실트론 주식회사 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치
TWI741753B (zh) * 2019-10-29 2021-10-01 南韓商Ｓｋｃ索密思股份有限公司 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法
KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
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Also Published As

Publication number Publication date
KR101855073B1 (ko) 2018-05-09
CN102762340A (zh) 2012-10-31
TW201130656A (en) 2011-09-16
TWI517975B (zh) 2016-01-21
WO2011087737A2 (en) 2011-07-21
WO2011087737A3 (en) 2011-09-15
US20130012108A1 (en) 2013-01-10
JP2013515379A (ja) 2013-05-02
SG181890A1 (en) 2012-07-30
KR20120120247A (ko) 2012-11-01

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