JP5716038B2 - Euvリソグラフィ用反射光学素子 - Google Patents
Euvリソグラフィ用反射光学素子 Download PDFInfo
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- JP5716038B2 JP5716038B2 JP2012543669A JP2012543669A JP5716038B2 JP 5716038 B2 JP5716038 B2 JP 5716038B2 JP 2012543669 A JP2012543669 A JP 2012543669A JP 2012543669 A JP2012543669 A JP 2012543669A JP 5716038 B2 JP5716038 B2 JP 5716038B2
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- 230000003287 optical effect Effects 0.000 title claims description 66
- 238000001900 extreme ultraviolet lithography Methods 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims description 87
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 30
- HBVFXTAPOLSOPB-UHFFFAOYSA-N nickel vanadium Chemical compound [V].[Ni] HBVFXTAPOLSOPB-UHFFFAOYSA-N 0.000 claims description 23
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 21
- 229910052750 molybdenum Inorganic materials 0.000 claims description 21
- 239000011733 molybdenum Substances 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- DUQYSTURAMVZKS-UHFFFAOYSA-N [Si].[B].[Ni] Chemical compound [Si].[B].[Ni] DUQYSTURAMVZKS-UHFFFAOYSA-N 0.000 claims description 12
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims description 12
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 claims description 12
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 claims description 12
- 238000005286 illumination Methods 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- 229910052580 B4C Inorganic materials 0.000 claims description 8
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- AUVPWTYQZMLSKY-UHFFFAOYSA-N boron;vanadium Chemical compound [V]#B AUVPWTYQZMLSKY-UHFFFAOYSA-N 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 155
- 229910000990 Ni alloy Inorganic materials 0.000 description 22
- 238000000576 coating method Methods 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 11
- 230000005855 radiation Effects 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0891—Ultraviolet [UV] mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G02B1/105—
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Optical Elements Other Than Lenses (AREA)
Description
2 基板
3 保護層
4 第1の多層膜系
40 周期
41 吸収層
42 スペーサ層
6 第2の多層膜系
60 周期
61−67 第2の多層膜系の層
100 EUVリソグラフィ装置
110 ビーム成形系
111 放射源
112 集光ミラー
113 モノクロメータ
120 照明系
121,122 ミラー
130 フォトマスク
140 投影系
141,142 ミラー
150 ウェハ
Claims (11)
- 軟X線及び極端紫外線波長域内の作業波長用で、特にEUVリソグラフィ装置用の反射光学素子であって、基板上に前記作業波長で屈折率の異なる実数部を有する少なくとも2つの交互材料からなる第1の多層膜系を備え、該第1の多層膜系が前記基板に層応力を及ぼし、前記基板上に周期的に交互の少なくとも2つの材料からなる第2の多層膜系を備え、該第2の多層膜系が前記第1の多層膜系と前記基板との間に配置され、前記基板に反対方向の層応力を及ぼすように構成され、前記第2の多層膜系(6)の前記少なくとも2つの材料の第1の材料(61)が、前記第2の多層膜系(6)の少なくとも1つの他の材料(62)の1nmまでの厚さの層によって、前記第1の材料(61)がアモルファス状態で存在するような間隔で遮断され、前記少なくとも1つの他の材料の層(62)の厚さが0.8nm未満であり、前記第1の材料は、ニッケル−シリコン、ニッケル−ホウ素、ニッケル−モリブデン、ニッケル−シリコン−ホウ素又はニッケル−バナジウムからなる群から選ばれる、ことを特徴とする反射光学素子。
- 前記第2の多層膜系(6)の前記少なくとも2つの材料(61,62)は周期的に交互に配置され、前記第2の多層膜系(6)の1つの周期(60)の全厚に対する前記第2の多層膜系の1つの周期内の第1の材料の層(61)の全厚の比(G)が0.80より大きい、請求項1記載の反射光学素子。
- 前記少なくとも一つの他の材料の層(62)は、炭化ホウ素、炭素、炭化シリコン、窒化シリコン、シリコン、クロム及びそれらの組み合わせからなる群から選ばれる、請求項1または2に記載の反射光学素子。
- 軟X線及び極端紫外線波長域内の作業波長用で、特にEUVリソグラフィ装置用の反射光学素子であって、基板上に前記作業波長で屈折率の異なる実数部を有する少なくとも2つの交互材料からなる第1の多層膜系を備え、前記少なくとも2つの交互材料の第1の材料がモリブデンで、第2の材料がシリコンであり、該第1の多層膜系が前記基板に層応力を及ぼし、前記基板上に周期的に交互の少なくとも2つの材料からなる第2の多層膜系を備え、該第2の多層膜系が前記第1の多層膜系と前記基板との間に配置され、前記基板に反対方向の層応力を及ぼし、前記第2の多層膜系の材料の一つがニッケル−シリコン、ニッケル−ホウ素、ニッケル−モリブデン、ニッケル−シリコン−ホウ素又はニッケル−バナジウムからなる群から選ばれ、前記第2の多層膜系の1つの周期の全厚に対する前記第2の多層膜系の1つの周期内のニッケル−シリコン、ニッケル−ホウ素、ニッケル−モリブデン、ニッケル−シリコン−ホウ素又はニッケル−バナジウムからなる群から選ばれる層の全厚の比(G)が少なくとも0.25である、反射光学素子。
- 前記第2の多層膜系は、ニッケル−シリコン、ニッケル−ホウ素、ニッケル−モリブデン、ニッケル−シリコン−ホウ素又はニッケル−バナジウムからなる群から選ばれる層(61)と前記第1の多層膜系(4)の作業波長で屈折率の異なる実数部を有する材料の少なくとも2つの層(64,65)の周期からなる、請求項4記載の反射光学素子。
- 前記第2の多層膜系(6)は、交互層(61,67)に配置された2つの材料の周期(68)と第3の材料の層(66)とからなり、前記2つの材料のうち一つはニッケル−シリコン、ニッケル−ホウ素、ニッケル−モリブデン、ニッケル−シリコン−ホウ素又はニッケル−バナジウムからなる群から選ばれる請求項4記載の反射光学素子。
- 前記第2の多層膜系は、ニッケル−シリコン、ニッケル−ホウ素、ニッケル−モリブデン、ニッケル−シリコン−ホウ素又はニッケル−バナジウムからなる群から選ばれる第1の層(61)と他の金属の第2の層(62)の周期(60)からなる、請求項4記載の反射光学素子。
- 前記第2の多層膜系の前記少なくとも一つの他の材料(62,64,65,66)は、モリブデン、シリコン、炭素、窒化シリコン、クロム及びそれらの任意の組み合わせからなる群から選ばれる、請求項4−7のいずれかに記載の反射光学素子。
- 請求項1−8のいずれかに記載の少なくとも一つの反射光学素子(121,122)を備える、特にEUVリソグラフィ装置用の投影系(120)。
- 請求項1−8のいずれかに記載の少なくとも一つの反射光学素子(141,142)を備える、特にEUVリソグラフィ装置用の照明系(140)。
- 請求項1−8のいずれかに記載の少なくとも一つの反射光学素子(112,113,121,122,141,142)を備える、特にEUVリソグラフィ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009054653.7 | 2009-12-15 | ||
DE102009054653A DE102009054653A1 (de) | 2009-12-15 | 2009-12-15 | Spiegel für den EUV-Wellenlängenbereich, Substrat für einen solchen Spiegel, Verwendung einer Quarzschicht für ein solches Substrat, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel oder einem solchen Substrat und Projetktionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv |
PCT/EP2010/069553 WO2011073157A1 (en) | 2009-12-15 | 2010-12-13 | Reflective optical element for euv lithography |
Publications (2)
Publication Number | Publication Date |
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JP2013513961A JP2013513961A (ja) | 2013-04-22 |
JP5716038B2 true JP5716038B2 (ja) | 2015-05-13 |
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ID=67060207
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Application Number | Title | Priority Date | Filing Date |
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JP2012543669A Active JP5716038B2 (ja) | 2009-12-15 | 2010-12-13 | Euvリソグラフィ用反射光学素子 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8937709B2 (ja) |
EP (1) | EP2513686B1 (ja) |
JP (1) | JP5716038B2 (ja) |
CN (1) | CN102782531B (ja) |
WO (1) | WO2011073157A1 (ja) |
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EP2513686B1 (en) * | 2009-12-15 | 2019-04-10 | Carl Zeiss SMT GmbH | Reflective optical element for euv lithography |
DE102012203633A1 (de) | 2012-03-08 | 2013-09-12 | Carl Zeiss Smt Gmbh | Spiegel für den EUV-Wellenlängenbereich, Herstellungsverfahren für einen solchen Spiegel und Projektionsbelichtungsanlage mit einem solchen Spiegel |
US20140272684A1 (en) | 2013-03-12 | 2014-09-18 | Applied Materials, Inc. | Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor |
US9612521B2 (en) * | 2013-03-12 | 2017-04-04 | Applied Materials, Inc. | Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
US9354508B2 (en) | 2013-03-12 | 2016-05-31 | Applied Materials, Inc. | Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
US9632411B2 (en) | 2013-03-14 | 2017-04-25 | Applied Materials, Inc. | Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor |
DE102013102670A1 (de) | 2013-03-15 | 2014-10-02 | Asml Netherlands B.V. | Optisches Element und optisches System für die EUV-Lithographie sowie Verfahren zur Behandlung eines solchen optischen Elements |
EP3071899A4 (en) * | 2013-11-19 | 2017-06-21 | Tokyo Ohka Kogyo Co., Ltd. | Reflective mirror for light concentrating system, and light concentrating system |
EP2905637A1 (en) * | 2014-02-07 | 2015-08-12 | ASML Netherlands B.V. | EUV optical element having blister-resistant multilayer cap |
US9690016B2 (en) * | 2014-07-11 | 2017-06-27 | Applied Materials, Inc. | Extreme ultraviolet reflective element with amorphous layers and method of manufacturing thereof |
US9612522B2 (en) * | 2014-07-11 | 2017-04-04 | Applied Materials, Inc. | Extreme ultraviolet mask blank production system with thin absorber and manufacturing system therefor |
DE102015213253A1 (de) | 2015-07-15 | 2017-01-19 | Carl Zeiss Smt Gmbh | Spiegel, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
DE102016207307A1 (de) * | 2016-04-28 | 2017-11-02 | Carl Zeiss Smt Gmbh | Optisches Element und optische Anordnung damit |
DE102016212373A1 (de) | 2016-07-07 | 2018-01-11 | Carl Zeiss Smt Gmbh | Optisches System, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
DE102016213831A1 (de) * | 2016-07-27 | 2018-02-01 | Carl Zeiss Smt Gmbh | Reflektives optisches Element für die EUV-Lithographie |
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US20120013976A1 (en) | 2012-01-19 |
WO2011073157A1 (en) | 2011-06-23 |
US20120019797A1 (en) | 2012-01-26 |
CN102782531B (zh) | 2014-12-17 |
EP2513686B1 (en) | 2019-04-10 |
JP2013513961A (ja) | 2013-04-22 |
US8928972B2 (en) | 2015-01-06 |
US8937709B2 (en) | 2015-01-20 |
CN102782531A (zh) | 2012-11-14 |
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