JP5712755B2 - 加速度検出器、加速度検出デバイス及び電子機器 - Google Patents
加速度検出器、加速度検出デバイス及び電子機器 Download PDFInfo
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- JP5712755B2 JP5712755B2 JP2011089833A JP2011089833A JP5712755B2 JP 5712755 B2 JP5712755 B2 JP 5712755B2 JP 2011089833 A JP2011089833 A JP 2011089833A JP 2011089833 A JP2011089833 A JP 2011089833A JP 5712755 B2 JP5712755 B2 JP 5712755B2
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- 230000001133 acceleration Effects 0.000 claims description 318
- 238000001514 detection method Methods 0.000 claims description 93
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 230000005484 gravity Effects 0.000 claims description 15
- 229920002050 silicone resin Polymers 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 description 27
- 239000000758 substrate Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 21
- 230000035882 stress Effects 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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JP2011089833A JP5712755B2 (ja) | 2011-04-14 | 2011-04-14 | 加速度検出器、加速度検出デバイス及び電子機器 |
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JP2011089833A JP5712755B2 (ja) | 2011-04-14 | 2011-04-14 | 加速度検出器、加速度検出デバイス及び電子機器 |
Publications (3)
Publication Number | Publication Date |
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JP2012220461A JP2012220461A (ja) | 2012-11-12 |
JP2012220461A5 JP2012220461A5 (enrdf_load_stackoverflow) | 2014-03-20 |
JP5712755B2 true JP5712755B2 (ja) | 2015-05-07 |
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JP2011089833A Active JP5712755B2 (ja) | 2011-04-14 | 2011-04-14 | 加速度検出器、加速度検出デバイス及び電子機器 |
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JP (1) | JP5712755B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10175092B2 (en) * | 2015-06-30 | 2019-01-08 | Nikkiso Cryo Inc. | Cryogenic vibration sensor and insulator pad assembly, and cryogenic pumps including the same |
JP6897187B2 (ja) * | 2017-03-16 | 2021-06-30 | セイコーエプソン株式会社 | 物理量検出器、物理量検出デバイス、電子機器および移動体 |
JP6939475B2 (ja) * | 2017-11-28 | 2021-09-22 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器および移動体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2627592B1 (fr) * | 1988-02-22 | 1990-07-27 | Sagem | Accelerometre pendulaire non asservi a poutre resonante |
FR2666887A1 (fr) * | 1990-09-17 | 1992-03-20 | Asulab Sa | Capteur de mesure d'une grandeur physique. |
JPH05283713A (ja) * | 1992-03-31 | 1993-10-29 | Mitsubishi Electric Corp | 半導体センサ |
JPH06232421A (ja) * | 1993-01-30 | 1994-08-19 | Nippon Seiki Co Ltd | 加速度センサ |
JP3473115B2 (ja) * | 1994-07-04 | 2003-12-02 | 株式会社村田製作所 | 加速度センサ |
US6145380A (en) * | 1997-12-18 | 2000-11-14 | Alliedsignal | Silicon micro-machined accelerometer using integrated electrical and mechanical packaging |
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