JP5707081B2 - 非接触形温度センサ - Google Patents
非接触形温度センサ Download PDFInfo
- Publication number
- JP5707081B2 JP5707081B2 JP2010225051A JP2010225051A JP5707081B2 JP 5707081 B2 JP5707081 B2 JP 5707081B2 JP 2010225051 A JP2010225051 A JP 2010225051A JP 2010225051 A JP2010225051 A JP 2010225051A JP 5707081 B2 JP5707081 B2 JP 5707081B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- heat
- contact
- heating roller
- resistant film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 description 50
- 239000010408 film Substances 0.000 description 47
- 238000001514 detection method Methods 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010225051A JP5707081B2 (ja) | 2010-10-04 | 2010-10-04 | 非接触形温度センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010225051A JP5707081B2 (ja) | 2010-10-04 | 2010-10-04 | 非接触形温度センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012078253A JP2012078253A (ja) | 2012-04-19 |
| JP2012078253A5 JP2012078253A5 (enExample) | 2013-11-14 |
| JP5707081B2 true JP5707081B2 (ja) | 2015-04-22 |
Family
ID=46238660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010225051A Active JP5707081B2 (ja) | 2010-10-04 | 2010-10-04 | 非接触形温度センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5707081B2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11460353B2 (en) | 2017-05-01 | 2022-10-04 | Semitec Corporation | Temperature sensor and device equipped with temperature sensor |
| US12146800B2 (en) | 2018-08-10 | 2024-11-19 | Semitec Corporation | Temperature sensor and device equipped with temperature sensor |
| WO2025041736A1 (ja) * | 2023-08-22 | 2025-02-27 | Ｓｅｍｉｔｅｃ株式会社 | 非接触形温度センサ |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101578087B1 (ko) * | 2014-04-22 | 2015-12-17 | (주) 래트론 | 열시정수 감소를 위한 온도센서 구조체 |
| JP6282526B2 (ja) * | 2014-05-19 | 2018-02-21 | 株式会社芝浦電子 | 非接触型温度センサ |
| CN110174187B (zh) * | 2019-05-24 | 2024-01-23 | 国家电网有限公司 | 加热器专用检测工具 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6325339U (enExample) * | 1986-08-01 | 1988-02-19 | ||
| JPH07159254A (ja) * | 1993-12-08 | 1995-06-23 | Ishizuka Denshi Kk | 非接触形温度センサ |
-
2010
- 2010-10-04 JP JP2010225051A patent/JP5707081B2/ja active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11460353B2 (en) | 2017-05-01 | 2022-10-04 | Semitec Corporation | Temperature sensor and device equipped with temperature sensor |
| US12146800B2 (en) | 2018-08-10 | 2024-11-19 | Semitec Corporation | Temperature sensor and device equipped with temperature sensor |
| WO2025041736A1 (ja) * | 2023-08-22 | 2025-02-27 | Ｓｅｍｉｔｅｃ株式会社 | 非接触形温度センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012078253A (ja) | 2012-04-19 |
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