JP2012078253A5 - - Google Patents

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Publication number
JP2012078253A5
JP2012078253A5 JP2010225051A JP2010225051A JP2012078253A5 JP 2012078253 A5 JP2012078253 A5 JP 2012078253A5 JP 2010225051 A JP2010225051 A JP 2010225051A JP 2010225051 A JP2010225051 A JP 2010225051A JP 2012078253 A5 JP2012078253 A5 JP 2012078253A5
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JP
Japan
Prior art keywords
heat
temperature sensor
sensitive element
pair
sensor according
Prior art date
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Granted
Application number
JP2010225051A
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English (en)
Japanese (ja)
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JP2012078253A (ja
JP5707081B2 (ja
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Priority to JP2010225051A priority Critical patent/JP5707081B2/ja
Priority claimed from JP2010225051A external-priority patent/JP5707081B2/ja
Publication of JP2012078253A publication Critical patent/JP2012078253A/ja
Publication of JP2012078253A5 publication Critical patent/JP2012078253A5/ja
Application granted granted Critical
Publication of JP5707081B2 publication Critical patent/JP5707081B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010225051A 2010-10-04 2010-10-04 非接触形温度センサ Active JP5707081B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010225051A JP5707081B2 (ja) 2010-10-04 2010-10-04 非接触形温度センサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010225051A JP5707081B2 (ja) 2010-10-04 2010-10-04 非接触形温度センサ

Publications (3)

Publication Number Publication Date
JP2012078253A JP2012078253A (ja) 2012-04-19
JP2012078253A5 true JP2012078253A5 (enExample) 2013-11-14
JP5707081B2 JP5707081B2 (ja) 2015-04-22

Family

ID=46238660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010225051A Active JP5707081B2 (ja) 2010-10-04 2010-10-04 非接触形温度センサ

Country Status (1)

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JP (1) JP5707081B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101578087B1 (ko) * 2014-04-22 2015-12-17 (주) 래트론 열시정수 감소를 위한 온도센서 구조체
JP6282526B2 (ja) * 2014-05-19 2018-02-21 株式会社芝浦電子 非接触型温度センサ
JP6502588B2 (ja) 2017-05-01 2019-04-17 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置
WO2020032021A1 (ja) 2018-08-10 2020-02-13 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置
CN110174187B (zh) * 2019-05-24 2024-01-23 国家电网有限公司 加热器专用检测工具
WO2025041736A1 (ja) * 2023-08-22 2025-02-27 Ｓｅｍｉｔｅｃ株式会社 非接触形温度センサ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6325339U (enExample) * 1986-08-01 1988-02-19
JPH07159254A (ja) * 1993-12-08 1995-06-23 Ishizuka Denshi Kk 非接触形温度センサ

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