JP2012078253A5 - - Google Patents

Download PDF

Info

Publication number
JP2012078253A5
JP2012078253A5 JP2010225051A JP2010225051A JP2012078253A5 JP 2012078253 A5 JP2012078253 A5 JP 2012078253A5 JP 2010225051 A JP2010225051 A JP 2010225051A JP 2010225051 A JP2010225051 A JP 2010225051A JP 2012078253 A5 JP2012078253 A5 JP 2012078253A5
Authority
JP
Japan
Prior art keywords
heat
temperature sensor
sensitive element
pair
sensor according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010225051A
Other languages
English (en)
Japanese (ja)
Other versions
JP5707081B2 (ja
JP2012078253A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010225051A priority Critical patent/JP5707081B2/ja
Priority claimed from JP2010225051A external-priority patent/JP5707081B2/ja
Publication of JP2012078253A publication Critical patent/JP2012078253A/ja
Publication of JP2012078253A5 publication Critical patent/JP2012078253A5/ja
Application granted granted Critical
Publication of JP5707081B2 publication Critical patent/JP5707081B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010225051A 2010-10-04 2010-10-04 非接触形温度センサ Active JP5707081B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010225051A JP5707081B2 (ja) 2010-10-04 2010-10-04 非接触形温度センサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010225051A JP5707081B2 (ja) 2010-10-04 2010-10-04 非接触形温度センサ

Publications (3)

Publication Number Publication Date
JP2012078253A JP2012078253A (ja) 2012-04-19
JP2012078253A5 true JP2012078253A5 (enExample) 2013-11-14
JP5707081B2 JP5707081B2 (ja) 2015-04-22

Family

ID=46238660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010225051A Active JP5707081B2 (ja) 2010-10-04 2010-10-04 非接触形温度センサ

Country Status (1)

Country Link
JP (1) JP5707081B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101578087B1 (ko) * 2014-04-22 2015-12-17 (주) 래트론 열시정수 감소를 위한 온도센서 구조체
JP6282526B2 (ja) * 2014-05-19 2018-02-21 株式会社芝浦電子 非接触型温度センサ
US11460353B2 (en) 2017-05-01 2022-10-04 Semitec Corporation Temperature sensor and device equipped with temperature sensor
US12146800B2 (en) 2018-08-10 2024-11-19 Semitec Corporation Temperature sensor and device equipped with temperature sensor
CN110174187B (zh) * 2019-05-24 2024-01-23 国家电网有限公司 加热器专用检测工具
WO2025041736A1 (ja) * 2023-08-22 2025-02-27 Ｓｅｍｉｔｅｃ株式会社 非接触形温度センサ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6325339U (enExample) * 1986-08-01 1988-02-19
JPH07159254A (ja) * 1993-12-08 1995-06-23 Ishizuka Denshi Kk 非接触形温度センサ

Similar Documents

Publication Publication Date Title
JP2012078253A5 (enExample)
ATE540442T1 (de) Batteriepack
JP2015520067A5 (enExample)
US20100237064A1 (en) Electromagnetic module of electronic apparatus and manufacturing process thereof
JP2016040770A (ja) バッテリーパックの温度管理用熱交換プレート
JP2017046215A5 (enExample)
CN114424030A (zh) 低耐热性传感器
CN202632919U (zh) 热敏电阻元件以及电路板
JP2015036689A (ja) 温度感知装置及びホブ
JP5707081B2 (ja) 非接触形温度センサ
CN205748695U (zh) 一种温度采样组件及其电池模组
JP6606581B2 (ja) 半導体の熱伝導及び放熱構造
US20130032588A1 (en) Heating arrangement
CN202310428U (zh) 阻热式壳体降温结构
CN205192650U (zh) 一种温度采样组件及其电池模组
CN103954117A (zh) 一种用于真空烘箱的电加热板
JP3175854U (ja) 放熱体構造
JP2010210177A (ja) 乾燥装置および乾燥方法
US20170089650A1 (en) Flexible heat transfer structure
JP2019107202A (ja) 身体冷暖房装置
JP2013538146A5 (ja) ポリマーフィルムをはめ合い部品に接着する方法
CN221803173U (zh) 测温组件和烹饪设备
CN106646806A (zh) 一种滤光片固定及加热装置与一种光学遥感器
TW202134604A (zh) 低耐熱性感測器的製造方法
CN208364574U (zh) 一种变色示温螺丝模组