JP5688881B2 - 照明装置および検出装置を有するセンサシステム - Google Patents
照明装置および検出装置を有するセンサシステム Download PDFInfo
- Publication number
- JP5688881B2 JP5688881B2 JP2009044343A JP2009044343A JP5688881B2 JP 5688881 B2 JP5688881 B2 JP 5688881B2 JP 2009044343 A JP2009044343 A JP 2009044343A JP 2009044343 A JP2009044343 A JP 2009044343A JP 5688881 B2 JP5688881 B2 JP 5688881B2
- Authority
- JP
- Japan
- Prior art keywords
- wavelength
- sensor system
- active region
- semiconductor
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001514 detection method Methods 0.000 title claims description 26
- 238000005286 illumination Methods 0.000 title claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 100
- 239000000463 material Substances 0.000 claims description 27
- 230000004297 night vision Effects 0.000 claims description 7
- 238000013139 quantization Methods 0.000 claims description 5
- 239000002096 quantum dot Substances 0.000 claims description 3
- 230000003595 spectral effect Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 16
- 239000000758 substrate Substances 0.000 description 12
- 238000011161 development Methods 0.000 description 5
- 230000018109 developmental process Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 3
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910005540 GaP Inorganic materials 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229910005542 GaSb Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 1
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 1
- 150000001495 arsenic compounds Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- -1 phosphorus compound Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/20—Detecting, e.g. by using light barriers using multiple transmitters or receivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2036—Broad area lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3095—Tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4018—Lasers electrically in series
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
Description
Claims (15)
- 照明装置(1,3)と検出装置(D)とを有するセンサシステム(S)において、
前記照明装置を構成して、第1波長のレーザビーム(L11,L12)と、第1波長とは異なる第2波長のレーザビーム(L21,L22)とを放射するようにし、
前記検出装置を構成して、第1波長および第2波長の電磁ビームが検出されるようにし、
前記センサシステム(S)は半導体レーザダイオード(1)を含んでおり、
− 該半導体レーザダイオードは、第1活性領域(11)と第2活性領域(12)とを有しており、
− 当該の第1活性領域および第2活性領域は、前記半導体レーザダイオードの半導体層列(10)に含まれており、かつ上下に積層されており、
− 第1活性領域(11)は、半導体レーザダイオードの動作時に第1波長のレーザビーム(L11,L12)を放射し、
− 第2活性領域(12)は、半導体レーザダイオードの動作時に第2波長のレーザビーム(L21,L22)を放射し、
前記の第1活性領域(11)および第2活性領域(12)は1つずつの量子井戸構造を有しており、
当該量子井戸構造は、層厚および/または量子化の次元が異なり、
前記の半導体層列(10)には、前記第1活性領域(11)と前記第2活性領域(12)との間にトンネルダイオード(130)が含まれており、
前記第1活性領域(11)および前記第2活性領域(12)の両方は、前記トンネルダイオード(130)によって電気的に直列接続されており、
前記レーザダイオード(1)は、3つまたはそれ以上の活性領域(11,12)を有しており、当該の複数の活性領域は、第1波長(L11,L12)のレーザビームを放射する、
ことを特徴とするセンサシステム(S)。 - 前記活性領域の数は最大で10である、
請求項1に記載のセンサシステム(S)。 - 前記の活性領域(11,12)のうちの一方の活性領域は、量子点または量子線を有しており、他方の活性領域は量子箱を有する、
請求項1または2に記載のセンサシステム(S)。 - 最も長い波長と最も短い波長との間の差分は、200nm以下である、
請求項1から3までのいずれか1項に記載のセンサシステム(S)。 - 前記半導体層列は、屈折率調整形のリブ導波器を形成するためにウェブとして構造化されている、
請求項1から4までのいずれか1項に記載のセンサシステム(S)。 - 前記半導体層列にはブラインド層(115)が含まれており、
当該ブラインド層は、前記ウェブの長手方向に延在するストライプ状の開口部(1151)を有しており、
当該開口部は横方向に絶縁領域(1152)によって包囲されている、
請求項5に記載のセンサシステム(S)。 - 前記のストライプ状の開口部(1151)は、1ないし10μmの幅を有する、
請求項6に記載のセンサシステム(S)。 - 前記の第1活性領域(11)および第2活性領域(12)は1つずつの量子井戸構造を有しており、
当該量子井戸構造は、材料組成が異なっている、
請求項1から7までのいずれか1項に記載のセンサシステム(S)。 - 前記の照明装置(1,3)を構成して、赤外線のスペクトル領域にてレーザビームが放射されるようにした、
請求項1から8までのいずれか1項に記載のセンサシステム(S)。 - 前記の第1波長および/または第2波長は、800nm以上1000nm以下の値を有する、
請求項9に記載のセンサシステム(S)。 - 前記の第1波長と第2波長との間の差分は、20nm以上である、
請求項1から10までのいずれか1項に記載のセンサシステム(S)。 - 前記センサシステム(S)は、間隔および/または速度の測定のために構成されている、
請求項1から11までのいずれか1項に記載のセンサシステム(S)。 - 請求項1から12までのいずれか1項に記載のセンサシステム(S)を有する衝突警報システム。
- 請求項1から12までのいずれか1項に記載のセンサシステム(S)を有する暗視装置。
- 前記検出装置(D)には、半導体画像センサまたは残光増幅器が含まれている、
請求項14に記載の暗視装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008011865.6 | 2008-02-29 | ||
DE102008011865 | 2008-02-29 | ||
DE102008022941.5 | 2008-05-09 | ||
DE102008022941A DE102008022941A1 (de) | 2008-02-29 | 2008-05-09 | Sensorsystem mit einer Beleuchtungseinrichtung und einer Detektoreinrichtung |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009210577A JP2009210577A (ja) | 2009-09-17 |
JP2009210577A5 JP2009210577A5 (ja) | 2012-01-12 |
JP5688881B2 true JP5688881B2 (ja) | 2015-03-25 |
Family
ID=40911443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009044343A Active JP5688881B2 (ja) | 2008-02-29 | 2009-02-26 | 照明装置および検出装置を有するセンサシステム |
Country Status (3)
Country | Link |
---|---|
US (1) | US8115909B2 (ja) |
JP (1) | JP5688881B2 (ja) |
DE (1) | DE102008022941A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010038186A1 (de) * | 2010-10-14 | 2012-04-19 | Sick Ag | Optoelektronischer Sensor mit Linienanordnung von Einzelemittern |
DE102014107960A1 (de) * | 2014-06-05 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US9575341B2 (en) * | 2014-06-28 | 2017-02-21 | Intel Corporation | Solid state LIDAR circuit with waveguides tunable to separate phase offsets |
DE102014226291A1 (de) | 2014-12-17 | 2016-06-23 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung und Verfahren zum Warnen vor Oberflächenschäden an Fahrzeugen |
WO2017010176A1 (ja) * | 2015-07-14 | 2017-01-19 | コニカミノルタ株式会社 | レーザレーダ装置 |
WO2017132704A1 (en) | 2016-01-31 | 2017-08-03 | Velodyne Lidar, Inc. | Lidar based 3-d imaging with far-field illumination overlap |
DE102016013510B4 (de) * | 2016-04-18 | 2019-03-14 | Kastriot Merlaku | Scheinwerfer-System für Fahrzeuge aller Art, mit mindestens einem Leuchtmittel und eine Kamera für die Fahrbahn-Erfassung |
US10761195B2 (en) | 2016-04-22 | 2020-09-01 | OPSYS Tech Ltd. | Multi-wavelength LIDAR system |
US11016178B2 (en) | 2017-03-13 | 2021-05-25 | OPSYS Tech Ltd. | Eye-safe scanning LIDAR system |
CN115015883A (zh) | 2017-07-28 | 2022-09-06 | 欧普赛斯技术有限公司 | 具有小角发散度的vcsel阵列lidar发送器 |
CN111356934B (zh) | 2017-11-15 | 2024-03-12 | 欧普赛斯技术有限公司 | 噪声自适应固态lidar系统 |
KR102634880B1 (ko) | 2018-04-01 | 2024-02-08 | 옵시스 테크 엘티디 | 잡음 적응형 솔리드-스테이트 lidar 시스템 |
DE102019102499A1 (de) * | 2019-01-31 | 2020-08-06 | Forschungsverbund Berlin E.V. | Vorrichtung zur Erzeugung von Laserstrahlung |
CN113692540A (zh) | 2019-04-09 | 2021-11-23 | 欧普赛斯技术有限公司 | 带激光控制的固态lidar发送器 |
DE102019206675A1 (de) * | 2019-05-09 | 2020-11-12 | Robert Bosch Gmbh | Sendeeinheit zur Emission von Strahlung in eine Umgebung, LIDAR-Sensor mit einer Sendeeinheit und Verfahren zur Ansteuerung einer Sendeeinheit |
JP2022534500A (ja) | 2019-05-30 | 2022-08-01 | オプシス テック リミテッド | アクチュエータを使用する眼に安全な長距離lidarシステム |
JP7438564B2 (ja) | 2019-06-10 | 2024-02-27 | オプシス テック リミテッド | 眼に安全な長距離固体lidarシステム |
DE102020208790A1 (de) | 2020-07-15 | 2022-01-20 | Robert Bosch Gesellschaft mit beschränkter Haftung | Lidar-Sensor |
CN112461352A (zh) * | 2020-12-08 | 2021-03-09 | 苏州亮芯光电科技有限公司 | 基于量子阱二极管的同质集成光电子装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6450587A (en) * | 1987-08-21 | 1989-02-27 | Seiko Epson Corp | Multi wavelength integrated semiconductor laser |
US4996430A (en) | 1989-10-02 | 1991-02-26 | The United States Of America As Represented By The Secretary Of The Army | Object detection using two channel active optical sensors |
DE4042730B4 (de) | 1990-03-10 | 2007-10-11 | Daimlerchrysler Ag | Anordnung zur Verbesserung der Sicht in Fahrzeugen |
JPH04372187A (ja) * | 1991-06-20 | 1992-12-25 | Canon Inc | 半導体装置及びその駆動方法 |
US5212706A (en) | 1991-12-03 | 1993-05-18 | University Of Connecticut | Laser diode assembly with tunnel junctions and providing multiple beams |
JPH0815434A (ja) * | 1994-06-23 | 1996-01-19 | Nikon Corp | 距離測定装置 |
US5684309A (en) | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
KR100644933B1 (ko) | 1997-01-09 | 2006-11-15 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물반도체소자 |
US5831277A (en) | 1997-03-19 | 1998-11-03 | Northwestern University | III-nitride superlattice structures |
WO1999039405A2 (de) | 1998-01-30 | 1999-08-05 | Osram Opto Semiconductors Gmbh & Co. Ohg | Halbleiterlaser-chip |
DE19840049C5 (de) * | 1998-09-02 | 2007-11-08 | Leica Geosystems Ag | Vorrichtung zur optischen Distanzmessung |
JP2000349387A (ja) * | 1999-06-02 | 2000-12-15 | Sony Corp | 半導体レーザ装置及びその作製方法 |
DE19935998B4 (de) * | 1999-07-30 | 2007-10-18 | Osram Opto Semiconductors Gmbh | Mehrfach-Halbleiterlaserstruktur mit schmaler Wellenlängenverteilung |
JP3950590B2 (ja) * | 1999-08-31 | 2007-08-01 | ローム株式会社 | 半導体レーザおよびその製法 |
DE19955747A1 (de) | 1999-11-19 | 2001-05-23 | Osram Opto Semiconductors Gmbh | Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur |
JP3868353B2 (ja) * | 2002-08-27 | 2007-01-17 | 富士通株式会社 | 量子ドットを有する半導体光装置 |
DE102004014041B4 (de) | 2004-03-19 | 2006-04-06 | Martin Spies | Sensor zur Hinderniserkennung |
JP4999038B2 (ja) * | 2004-08-20 | 2012-08-15 | 古河電気工業株式会社 | 半導体装置の製造方法 |
JP4820556B2 (ja) * | 2005-02-02 | 2011-11-24 | 株式会社リコー | 垂直共振器型面発光半導体レーザ装置および光送信モジュールおよび光伝送装置および光スイッチング方法 |
DE102005030451A1 (de) | 2005-06-28 | 2007-01-04 | Deutsche Bahn Ag | Jahreszeitunabhängige Bewertung von Vegetation auf und/oder an Verkehrswegen oder anderen zugänglichen Flächen |
US7325318B2 (en) | 2005-09-22 | 2008-02-05 | Cubic Corporation | Compact multifunction sight |
DE102005055272B4 (de) | 2005-11-17 | 2008-07-31 | Gmc-I Gossen-Metrawatt Gmbh | Verfahren und Vorrichtung zur Ermittlung von Leckströmen in batteriegespeisten Netzen |
US20090078870A1 (en) * | 2006-01-20 | 2009-03-26 | Tetsuya Haruna | Infrared imaging system |
US7544945B2 (en) | 2006-02-06 | 2009-06-09 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Vertical cavity surface emitting laser (VCSEL) array laser scanner |
DE102007032997A1 (de) | 2007-07-16 | 2009-01-22 | Robert Bosch Gmbh | Fahrerassistenzvorrichtung |
DE102007051167A1 (de) | 2007-09-14 | 2009-03-19 | Osram Opto Semiconductors Gmbh | Halbleiterlaser, Verfahren zur Herstellung und Verwendung |
-
2008
- 2008-05-09 DE DE102008022941A patent/DE102008022941A1/de not_active Withdrawn
-
2009
- 2009-02-26 JP JP2009044343A patent/JP5688881B2/ja active Active
- 2009-02-26 US US12/393,147 patent/US8115909B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE102008022941A1 (de) | 2009-09-03 |
US8115909B2 (en) | 2012-02-14 |
US20090244515A1 (en) | 2009-10-01 |
JP2009210577A (ja) | 2009-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5688881B2 (ja) | 照明装置および検出装置を有するセンサシステム | |
JP5323087B2 (ja) | レーザ光源 | |
US20080197289A1 (en) | Measuring arrangement and measuring system | |
US10243326B2 (en) | Semiconductor laser, light source unit, and laser light irradiation device | |
JP6033406B2 (ja) | 端面放射型の半導体ボディを備えている半導体レーザ光源 | |
JP2007311522A (ja) | 半導体レーザ | |
EP2770592A2 (en) | Semiconductor light emitting element and display device | |
US9451672B2 (en) | Light source and optical coherence tomography apparatus using the same | |
US9203216B2 (en) | Semiconductor laser device | |
JP2005522885A5 (ja) | ||
JP5979897B2 (ja) | スーパールミネッセントダイオード、スーパールミネッセントダイオードを備えたsd−octシステム | |
JP2008172188A (ja) | 多波長量子ドットレーザ素子 | |
US9042416B1 (en) | High-power low-loss GRINSCH laser | |
US20230208110A1 (en) | Semiconductor laser and lidar system and also laser system with the semiconductor laser | |
JP2023554253A (ja) | 発光半導体チップおよび発光半導体チップの製造方法 | |
EP2913903B1 (en) | Device comprising a high brightness broad-area edge-emitting semiconductor laser and method of making the same | |
US8401044B2 (en) | Semiconductor light emitting element, driving method of semiconductor light emitting element, light emitting device, and optical pulse tester using light emitting device | |
US8582617B2 (en) | Semiconductor laser | |
US8605767B2 (en) | Long semiconductor laser cavity in a compact chip | |
CN115461947A (zh) | 半导体激光器和包括半导体激光器的激光系统 | |
US20150138562A1 (en) | Wavelength-variable laser including soa and optical coherence tomography apparatus including the laser | |
US11764546B2 (en) | Semiconductor laser device | |
JP2009070928A (ja) | 面発光ダイオード | |
JP5221180B2 (ja) | 発光素子 | |
KR100630120B1 (ko) | 이종 양자점 구조를 갖는 광대역 반도체 광원 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101227 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111121 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111121 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130110 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130201 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130425 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140106 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140327 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140401 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140704 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150113 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150127 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5688881 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |