JP5683163B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5683163B2 JP5683163B2 JP2010171078A JP2010171078A JP5683163B2 JP 5683163 B2 JP5683163 B2 JP 5683163B2 JP 2010171078 A JP2010171078 A JP 2010171078A JP 2010171078 A JP2010171078 A JP 2010171078A JP 5683163 B2 JP5683163 B2 JP 5683163B2
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- insulating film
- semiconductor substrate
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- diffusion region
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- 239000004065 semiconductor Substances 0.000 title claims description 50
- 239000000758 substrate Substances 0.000 claims description 60
- 238000009792 diffusion process Methods 0.000 claims description 36
- 238000002955 isolation Methods 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 230000015556 catabolic process Effects 0.000 description 18
- 229910004298 SiO 2 Inorganic materials 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000011810 insulating material Substances 0.000 description 14
- 230000005684 electric field Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
図1A及び図1Bは、本発明の実施の形態に係るLDMOSトランジスタ1の構造を示している。図1Bは平面図であり、図1Aは図1B中の線A−A’に沿った断面図である。LDMOSトランジスタ1は、半導体基板10、素子分離構造20、ソース拡散領域31、ドレイン拡散領域32、基板コンタクト33、フィールドドレイン部40、ゲート絶縁膜50、及びゲート電極60を備えている。
図2に示されるように、ゲート電極60にゲート電圧Vg=0Vが印加され、ソース拡散領域31にソース電圧Vs=0Vが印加され、ドレイン拡散領域32にドレイン電圧Vd=68.3Vが印加される場合を考える。この時、ゲート電極60とドレイン拡散領域32との間に介在するフィールドドレイン部40には、電界が集中しやすい。フィールドドレイン部40における電界集中による強電界は、フィールドドレイン部40と半導体基板10との間の界面においてインパクトイオン化を発生しやすくする。インパクトイオン化とは、電界により加速された電子と結晶格子との衝突により、多数の電子・正孔対が発生する現象である。このようなインパクトイオン化により発生する電子・正孔対は、ドレイン・基板間耐圧BVdsの向上の妨げとなる。
以下、本実施の形態に係るLDMOSトランジスタ1の製造方法を説明する。
10 半導体基板
11 p−ウェル
12 n−ウェル
20 素子分離構造
31 ソース拡散領域
32 ドレイン拡散領域
33 基板コンタクト
40 フィールドドレイン部
41 第1絶縁膜
42 第2絶縁膜
50 ゲート絶縁膜
60 ゲート電極
Claims (4)
- 半導体基板と、
前記半導体基板上にゲート絶縁膜を介して形成されたゲート電極と、
前記ゲート電極の両側の前記半導体基板中にそれぞれ前記ゲート電極から離間して形成されたソース拡散領域及びドレイン拡散領域と、
絶縁体であるフィールドドレイン部であって、前記半導体基板の内部において、前記ドレイン拡散領域から前記ソース拡散領域の方向に前記ドレイン拡散領域の一端から前記ゲート電極の一部にかけて介在する前記フィールドドレイン部と
を備え、
前記フィールドドレイン部は、
前記半導体基板と接触する第1絶縁膜と、
前記第1絶縁膜上に形成され、前記第1絶縁膜よりも高い誘電率を有する第2絶縁膜と
を備え、
前記ゲート絶縁膜の材料は、前記第1絶縁膜の材料と同じであり、
前記第2絶縁膜の膜厚は、前記第1絶縁膜の膜厚よりも厚く、
前記半導体基板の面方向に対して、前記フィールドドレイン部は、前記ドレイン拡散領域よりも広く形成されていると共に、前記ソース拡散領域よりも広く形成されている
半導体装置。 - 請求項1に記載の半導体装置であって、
前記半導体基板は、シリコン基板であり、
前記第1絶縁膜は、シリコン酸化膜であり、
前記第2絶縁膜は、シリコン窒化膜である
半導体装置。 - 請求項1または2に記載の半導体装置であって、
更に、前記半導体基板中に形成された素子分離構造を備え、
前記素子分離構造は、前記第2絶縁膜よりも誘電率が低い第3絶縁膜で形成された
半導体装置。 - 請求項3に記載の半導体装置であって、
前記半導体基板は、シリコン基板であり、
前記第1絶縁膜及び前記第3絶縁膜は、シリコン酸化膜であり、
前記第2絶縁膜は、シリコン窒化膜である
半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010171078A JP5683163B2 (ja) | 2010-07-29 | 2010-07-29 | 半導体装置 |
US13/189,860 US8581340B2 (en) | 2010-07-29 | 2011-07-25 | Semiconductor device of which breakdown voltage is improved |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010171078A JP5683163B2 (ja) | 2010-07-29 | 2010-07-29 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2012033648A JP2012033648A (ja) | 2012-02-16 |
JP5683163B2 true JP5683163B2 (ja) | 2015-03-11 |
Family
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JP2010171078A Expired - Fee Related JP5683163B2 (ja) | 2010-07-29 | 2010-07-29 | 半導体装置 |
Country Status (2)
Country | Link |
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US (1) | US8581340B2 (ja) |
JP (1) | JP5683163B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012099541A (ja) * | 2010-10-29 | 2012-05-24 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法 |
AU2016277536A1 (en) * | 2015-12-21 | 2017-07-06 | The Regents Of The University Of California | Method for efficient intracellular delivery using anisotropic magnetic particles |
JP7040162B2 (ja) * | 2018-03-16 | 2022-03-23 | サンケン電気株式会社 | 半導体装置及びその製造方法 |
CN115602729A (zh) * | 2022-12-13 | 2023-01-13 | 广东省大湾区集成电路与系统应用研究院(Cn) | 横向双扩散金属氧化物半导体器件及制作方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4048649A (en) * | 1976-02-06 | 1977-09-13 | Transitron Electronic Corporation | Superintegrated v-groove isolated bipolar and vmos transistors |
JPS58127380A (ja) * | 1982-01-26 | 1983-07-29 | Seiko Epson Corp | Mos型半導体装置 |
JPH05304205A (ja) * | 1992-04-27 | 1993-11-16 | Toshiba Corp | 半導体装置及びその製造方法 |
JPH0897411A (ja) * | 1994-09-21 | 1996-04-12 | Fuji Electric Co Ltd | 横型高耐圧トレンチmosfetおよびその製造方法 |
JP4288925B2 (ja) * | 2002-10-31 | 2009-07-01 | 富士電機デバイステクノロジー株式会社 | 半導体装置およびその製造方法 |
JP2004172195A (ja) * | 2002-11-18 | 2004-06-17 | Fujitsu Ltd | 半導体装置および半導体集積回路装置 |
KR100493061B1 (ko) * | 2003-06-20 | 2005-06-02 | 삼성전자주식회사 | 비휘발성 메모리가 내장된 단일 칩 데이터 처리 장치 |
JP2005228806A (ja) * | 2004-02-10 | 2005-08-25 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法 |
WO2006082568A2 (en) * | 2005-02-07 | 2006-08-10 | Nxp B.V. | Method of manufacturing a lateral semiconductor device |
WO2006103634A2 (en) | 2005-03-31 | 2006-10-05 | Nxp B.V. | Asymmetric high voltage mos device and method of fabrication |
JP2007142156A (ja) * | 2005-11-18 | 2007-06-07 | Sony Corp | 半導体装置およびその製造方法 |
US7511319B2 (en) * | 2006-02-24 | 2009-03-31 | Freescale Semiconductor, Inc. | Methods and apparatus for a stepped-drift MOSFET |
JP2009170671A (ja) * | 2008-01-16 | 2009-07-30 | Denso Corp | 半導体装置の製造方法およびそれにより製造される半導体装置 |
US8163621B2 (en) * | 2008-06-06 | 2012-04-24 | Globalfoundries Singapore Pte. Ltd. | High performance LDMOS device having enhanced dielectric strain layer |
US8354710B2 (en) * | 2008-08-08 | 2013-01-15 | Infineon Technologies Ag | Field-effect device and manufacturing method thereof |
US8643090B2 (en) * | 2009-03-23 | 2014-02-04 | Infineon Technologies Ag | Semiconductor devices and methods for manufacturing a semiconductor device |
-
2010
- 2010-07-29 JP JP2010171078A patent/JP5683163B2/ja not_active Expired - Fee Related
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2011
- 2011-07-25 US US13/189,860 patent/US8581340B2/en active Active
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Publication number | Publication date |
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US20120025310A1 (en) | 2012-02-02 |
JP2012033648A (ja) | 2012-02-16 |
US8581340B2 (en) | 2013-11-12 |
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