JP5676563B2 - エポキシ樹脂組成物及び硬化物 - Google Patents
エポキシ樹脂組成物及び硬化物 Download PDFInfo
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- JP5676563B2 JP5676563B2 JP2012505621A JP2012505621A JP5676563B2 JP 5676563 B2 JP5676563 B2 JP 5676563B2 JP 2012505621 A JP2012505621 A JP 2012505621A JP 2012505621 A JP2012505621 A JP 2012505621A JP 5676563 B2 JP5676563 B2 JP 5676563B2
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- JP
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- epoxy resin
- resin composition
- curing
- epoxy
- curing agent
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- AMCGWKMFBGHJTF-UHFFFAOYSA-O C1OC1C(CC1)CC(C2OC2)C1C1[OH+]C1 Chemical compound C1OC1C(CC1)CC(C2OC2)C1C1[OH+]C1 AMCGWKMFBGHJTF-UHFFFAOYSA-O 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
本発明のエポキシ樹脂組成物は、エポキシ樹脂、及びエポキシ樹脂用硬化剤を必須成分とし、且つこれら必須成分を樹脂成分の主成分とする。本発明のエポキシ樹脂組成物は無機充填材を含むことができ、この場合は、上記必須成分と無機充填材を主成分とする。
本発明のエポキシ樹脂組成物は、式(1)で表されるエポキシ樹脂の構造に特徴があり、エポキシ基とシクロヘキサンとがエーテル結合を介さないで結合することで、低粘度性に優れ、かつ耐熱性、低熱膨張性等に優れた硬化物を与える。従って、エポキシ樹脂用硬化剤等の添加物の種類及び添加量は、適宜の条件が使用できる。
下記に示すエポキシ樹脂、硬化剤及び硬化促進剤を用い、表1及び表2に示す配合割合で混練してエポキシ樹脂組成物を調製した。表1〜2中のカッコは重量部を表す。
硬化剤成分として、PN(フェノールノボラック樹脂、荒川化学製、タマノール758;OH当量103、軟化点 82℃)、MH−700(4-メチルヘキサヒドロ無水フタル酸/ヘキサヒドロ無水フタル酸混合物(70/30)、新日本理化株式会社製 リカシッド MH-700)及びEC-100(1−メチル−3,5−ジエチル−2,4−ジアミノベンゼンと1−メチル−3,5−ジエチル−2,6−ジアミノベンゼンの混合物、アルベマール日本株式会社製 エタキュアー100)を用いた。
硬化促進剤成分として、2E4MZ(2−エチル−4−メチルイミダゾール)を用いた。
フィラーとして、電気化学工業(株)製の球状溶融シリカFB−60(平均粒径21μm)及びFB−35(平均粒径12μm)、(株)アドマテックス製の球状溶融シリカSO−C3(平均粒径0.9μm)及びSO−C2(平均粒径0.5μm)の4種類を混合して使用した。混合比は、重量比で、20:50:10:20とした。
Claims (6)
- エポキシ樹脂用硬化剤が、アミン類、酸無水物類、多価フェノール類、イミダゾール類、ジシアンジアミド類、及び有機酸ヒドラジッド類から選ばれる少なくとも1種の化合物であることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- エポキシ樹脂用硬化剤として、アミノ基を複数有するポリアミン、フェノール性ヒドロキシ基を複数有する多価ヒドロキシ化合物及び酸無水物類から選ばれる少なくとも1種の化合物を含有し、更に硬化促進剤として、三級アミン類、イミダゾール類、ジシアンジアミド類、及び有機ホスフィン類から選ばれる少なくとも1種の化合物を含有することを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 電気・電子部品封止用であることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 請求項1に記載のエポキシ樹脂組成物を硬化してなることを特徴とするエポキシ樹脂硬化物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012505621A JP5676563B2 (ja) | 2010-03-18 | 2011-03-08 | エポキシ樹脂組成物及び硬化物 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010062457 | 2010-03-18 | ||
JP2010062457 | 2010-03-18 | ||
JP2012505621A JP5676563B2 (ja) | 2010-03-18 | 2011-03-08 | エポキシ樹脂組成物及び硬化物 |
PCT/JP2011/055302 WO2011114935A1 (ja) | 2010-03-18 | 2011-03-08 | エポキシ樹脂組成物及び硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2011114935A1 JPWO2011114935A1 (ja) | 2013-06-27 |
JP5676563B2 true JP5676563B2 (ja) | 2015-02-25 |
Family
ID=44649033
Family Applications (1)
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JP2012505621A Expired - Fee Related JP5676563B2 (ja) | 2010-03-18 | 2011-03-08 | エポキシ樹脂組成物及び硬化物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5676563B2 (ja) |
TW (1) | TWI507439B (ja) |
WO (1) | WO2011114935A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012020661A1 (ja) * | 2010-08-09 | 2012-02-16 | 新日鐵化学株式会社 | エポキシ樹脂組成物及び硬化物 |
WO2012108305A1 (ja) * | 2011-02-10 | 2012-08-16 | 新日鐵化学株式会社 | エポキシアクリレート、アクリル系硬化性組成物、硬化物及びその製造法 |
EP2912028A1 (en) * | 2012-10-26 | 2015-09-02 | Dow Global Technologies LLC | Curable compositions comprising 1,3-dioxiranylcyclopentane epoxide compounds and thermosets prepared therefrom |
WO2014066717A1 (en) * | 2012-10-26 | 2014-05-01 | Dow Global Technologies Llc | Novel epoxide compounds: 1,3-dioxiranylcyclopentane derivatives |
KR102475977B1 (ko) * | 2021-01-19 | 2022-12-09 | 한국화학연구원 | 삼관능성 지환족 에폭시 화합물을 포함하는 에폭시 수지 제조용 조성물 및 이를 이용한 경화물 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3251861A (en) * | 1966-05-17 | Di- and triepoxtoe derivatives of trivinylcyclohexane | ||
JPH103084A (ja) * | 1996-06-18 | 1998-01-06 | Sumitomo Bakelite Co Ltd | 液晶表示素子用シール材組成物及びそれを用いた液晶表示素子 |
JP2007197647A (ja) * | 2005-12-27 | 2007-08-09 | Sumitomo Electric Ind Ltd | 液状熱硬化性樹脂組成物、および接合材 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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NL269250A (ja) * | 1960-10-03 | |||
CN1946795B (zh) * | 2003-11-21 | 2010-06-23 | 洛德公司 | 晶片用双阶段底部填充胶 |
-
2011
- 2011-03-08 JP JP2012505621A patent/JP5676563B2/ja not_active Expired - Fee Related
- 2011-03-08 WO PCT/JP2011/055302 patent/WO2011114935A1/ja active Application Filing
- 2011-03-09 TW TW100107896A patent/TWI507439B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3251861A (en) * | 1966-05-17 | Di- and triepoxtoe derivatives of trivinylcyclohexane | ||
JPH103084A (ja) * | 1996-06-18 | 1998-01-06 | Sumitomo Bakelite Co Ltd | 液晶表示素子用シール材組成物及びそれを用いた液晶表示素子 |
JP2007197647A (ja) * | 2005-12-27 | 2007-08-09 | Sumitomo Electric Ind Ltd | 液状熱硬化性樹脂組成物、および接合材 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2011114935A1 (ja) | 2013-06-27 |
TW201202291A (en) | 2012-01-16 |
TWI507439B (zh) | 2015-11-11 |
WO2011114935A1 (ja) | 2011-09-22 |
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