JP5675600B2 - レーザ加工システムにおける後方反射の低減法 - Google Patents

レーザ加工システムにおける後方反射の低減法 Download PDF

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JP5675600B2
JP5675600B2 JP2011514747A JP2011514747A JP5675600B2 JP 5675600 B2 JP5675600 B2 JP 5675600B2 JP 2011514747 A JP2011514747 A JP 2011514747A JP 2011514747 A JP2011514747 A JP 2011514747A JP 5675600 B2 JP5675600 B2 JP 5675600B2
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laser beam
incident
lens
incident laser
propagation axis
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Japanese (ja)
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JP2011524259A5 (enExample
JP2011524259A (ja
Inventor
アルパイ，メフメット，イー．
ヨハンセン，ブライアン
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エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
JP2011514747A 2008-06-17 2009-06-16 レーザ加工システムにおける後方反射の低減法 Expired - Fee Related JP5675600B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7325408P 2008-06-17 2008-06-17
US61/073,254 2008-06-17
US12/209,959 US8217302B2 (en) 2008-06-17 2008-09-12 Reducing back-reflections in laser processing systems
US12/209,959 2008-09-12
PCT/US2009/047490 WO2009155280A2 (en) 2008-06-17 2009-06-16 Reducing back-reflections in laser processing systems

Publications (3)

Publication Number Publication Date
JP2011524259A JP2011524259A (ja) 2011-09-01
JP2011524259A5 JP2011524259A5 (enExample) 2014-07-24
JP5675600B2 true JP5675600B2 (ja) 2015-02-25

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JP2011514747A Expired - Fee Related JP5675600B2 (ja) 2008-06-17 2009-06-16 レーザ加工システムにおける後方反射の低減法

Country Status (6)

Country Link
US (1) US8217302B2 (enExample)
JP (1) JP5675600B2 (enExample)
KR (1) KR20110017385A (enExample)
CN (1) CN102057544B (enExample)
TW (1) TW201000951A (enExample)
WO (1) WO2009155280A2 (enExample)

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US8662160B2 (en) 2008-08-20 2014-03-04 Foro Energy Inc. Systems and conveyance structures for high power long distance laser transmission
US9360631B2 (en) 2008-08-20 2016-06-07 Foro Energy, Inc. Optics assembly for high power laser tools
US9267330B2 (en) 2008-08-20 2016-02-23 Foro Energy, Inc. Long distance high power optical laser fiber break detection and continuity monitoring systems and methods
US9027668B2 (en) 2008-08-20 2015-05-12 Foro Energy, Inc. Control system for high power laser drilling workover and completion unit
US9080425B2 (en) 2008-10-17 2015-07-14 Foro Energy, Inc. High power laser photo-conversion assemblies, apparatuses and methods of use
US9347271B2 (en) 2008-10-17 2016-05-24 Foro Energy, Inc. Optical fiber cable for transmission of high power laser energy over great distances
EP2315904B1 (en) 2008-08-20 2019-02-06 Foro Energy Inc. Method and system for advancement of a borehole using a high power laser
US9138786B2 (en) 2008-10-17 2015-09-22 Foro Energy, Inc. High power laser pipeline tool and methods of use
US10301912B2 (en) * 2008-08-20 2019-05-28 Foro Energy, Inc. High power laser flow assurance systems, tools and methods
US9669492B2 (en) 2008-08-20 2017-06-06 Foro Energy, Inc. High power laser offshore decommissioning tool, system and methods of use
US9719302B2 (en) 2008-08-20 2017-08-01 Foro Energy, Inc. High power laser perforating and laser fracturing tools and methods of use
US9664012B2 (en) 2008-08-20 2017-05-30 Foro Energy, Inc. High power laser decomissioning of multistring and damaged wells
US9242309B2 (en) 2012-03-01 2016-01-26 Foro Energy Inc. Total internal reflection laser tools and methods
US9244235B2 (en) 2008-10-17 2016-01-26 Foro Energy, Inc. Systems and assemblies for transferring high power laser energy through a rotating junction
US9089928B2 (en) 2008-08-20 2015-07-28 Foro Energy, Inc. Laser systems and methods for the removal of structures
US8878095B2 (en) 2010-12-17 2014-11-04 Electro Scientific Industries, Inc. Reducing back-reflection in laser micromachining systems
WO2012116153A1 (en) 2011-02-24 2012-08-30 Foro Energy, Inc. High power laser-mechanical drilling bit and methods of use
EP2715887A4 (en) * 2011-06-03 2016-11-23 Foro Energy Inc PASSIVELY COOLED HIGH ENERGY LASER FIBER ROBUST OPTICAL CONNECTORS AND METHODS OF USE
US10481339B2 (en) 2011-06-03 2019-11-19 Foro Energy, Inc. High average power optical fiber cladding mode stripper, methods of making and uses
JP5643936B2 (ja) * 2011-06-29 2014-12-24 フルウチ化学株式会社 コリメータおよびコリメータ付き光アイソレータ
US10221687B2 (en) 2015-11-26 2019-03-05 Merger Mines Corporation Method of mining using a laser
DE102018205545A1 (de) * 2018-04-12 2019-10-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung, Laserbearbeitungsmaschine und Verfahren zum Bearbeiten eines Werkstücks
JP7303053B2 (ja) * 2019-07-17 2023-07-04 ファナック株式会社 調整補助具及びレーザ溶接装置
JP7753730B2 (ja) * 2021-08-31 2025-10-15 セイコーエプソン株式会社 レーザー干渉計
JP7694299B2 (ja) * 2021-09-24 2025-06-18 セイコーエプソン株式会社 レーザー干渉計
TWI788076B (zh) 2021-10-29 2022-12-21 財團法人工業技術研究院 光纖模組及其製法
US20240405867A1 (en) * 2023-06-01 2024-12-05 Qualcomm Incorporated Utilizing curved focal planes for optical wireless communication

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JPS58162348A (ja) * 1982-03-23 1983-09-27 Toshiba Corp レ−ザ−印刷装置
JPS59155805A (ja) * 1983-02-24 1984-09-05 Olympus Optical Co Ltd 光学繊維束を像伝送系として用いた光学系
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Also Published As

Publication number Publication date
US20090308852A1 (en) 2009-12-17
CN102057544A (zh) 2011-05-11
TW201000951A (en) 2010-01-01
KR20110017385A (ko) 2011-02-21
JP2011524259A (ja) 2011-09-01
WO2009155280A2 (en) 2009-12-23
CN102057544B (zh) 2013-01-23
WO2009155280A3 (en) 2010-03-11
US8217302B2 (en) 2012-07-10

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