CN102057544B - 降低在激光处理系统中的背反射 - Google Patents

降低在激光处理系统中的背反射 Download PDF

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Publication number
CN102057544B
CN102057544B CN2009801211647A CN200980121164A CN102057544B CN 102057544 B CN102057544 B CN 102057544B CN 2009801211647 A CN2009801211647 A CN 2009801211647A CN 200980121164 A CN200980121164 A CN 200980121164A CN 102057544 B CN102057544 B CN 102057544B
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China
Prior art keywords
laser beam
lens
conduction axis
working surface
incoming
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Expired - Fee Related
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CN2009801211647A
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English (en)
Chinese (zh)
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CN102057544A (zh
Inventor
玛密特·E·艾尔帕
布莱恩·强汉森
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
CN2009801211647A 2008-06-17 2009-06-16 降低在激光处理系统中的背反射 Expired - Fee Related CN102057544B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7325408P 2008-06-17 2008-06-17
US61/073,254 2008-06-17
US12/209,959 US8217302B2 (en) 2008-06-17 2008-09-12 Reducing back-reflections in laser processing systems
US12/209,959 2008-09-12
PCT/US2009/047490 WO2009155280A2 (en) 2008-06-17 2009-06-16 Reducing back-reflections in laser processing systems

Publications (2)

Publication Number Publication Date
CN102057544A CN102057544A (zh) 2011-05-11
CN102057544B true CN102057544B (zh) 2013-01-23

Family

ID=41413808

Family Applications (1)

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CN2009801211647A Expired - Fee Related CN102057544B (zh) 2008-06-17 2009-06-16 降低在激光处理系统中的背反射

Country Status (6)

Country Link
US (1) US8217302B2 (enExample)
JP (1) JP5675600B2 (enExample)
KR (1) KR20110017385A (enExample)
CN (1) CN102057544B (enExample)
TW (1) TW201000951A (enExample)
WO (1) WO2009155280A2 (enExample)

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US11590606B2 (en) * 2008-08-20 2023-02-28 Foro Energy, Inc. High power laser tunneling mining and construction equipment and methods of use
US8627901B1 (en) 2009-10-01 2014-01-14 Foro Energy, Inc. Laser bottom hole assembly
US9074422B2 (en) 2011-02-24 2015-07-07 Foro Energy, Inc. Electric motor for laser-mechanical drilling
US8662160B2 (en) 2008-08-20 2014-03-04 Foro Energy Inc. Systems and conveyance structures for high power long distance laser transmission
US9360631B2 (en) 2008-08-20 2016-06-07 Foro Energy, Inc. Optics assembly for high power laser tools
US9267330B2 (en) 2008-08-20 2016-02-23 Foro Energy, Inc. Long distance high power optical laser fiber break detection and continuity monitoring systems and methods
US9027668B2 (en) 2008-08-20 2015-05-12 Foro Energy, Inc. Control system for high power laser drilling workover and completion unit
US9080425B2 (en) 2008-10-17 2015-07-14 Foro Energy, Inc. High power laser photo-conversion assemblies, apparatuses and methods of use
US9347271B2 (en) 2008-10-17 2016-05-24 Foro Energy, Inc. Optical fiber cable for transmission of high power laser energy over great distances
EP2315904B1 (en) 2008-08-20 2019-02-06 Foro Energy Inc. Method and system for advancement of a borehole using a high power laser
US9138786B2 (en) 2008-10-17 2015-09-22 Foro Energy, Inc. High power laser pipeline tool and methods of use
US10301912B2 (en) * 2008-08-20 2019-05-28 Foro Energy, Inc. High power laser flow assurance systems, tools and methods
US9669492B2 (en) 2008-08-20 2017-06-06 Foro Energy, Inc. High power laser offshore decommissioning tool, system and methods of use
US9719302B2 (en) 2008-08-20 2017-08-01 Foro Energy, Inc. High power laser perforating and laser fracturing tools and methods of use
US9664012B2 (en) 2008-08-20 2017-05-30 Foro Energy, Inc. High power laser decomissioning of multistring and damaged wells
US9242309B2 (en) 2012-03-01 2016-01-26 Foro Energy Inc. Total internal reflection laser tools and methods
US9244235B2 (en) 2008-10-17 2016-01-26 Foro Energy, Inc. Systems and assemblies for transferring high power laser energy through a rotating junction
US9089928B2 (en) 2008-08-20 2015-07-28 Foro Energy, Inc. Laser systems and methods for the removal of structures
US8878095B2 (en) 2010-12-17 2014-11-04 Electro Scientific Industries, Inc. Reducing back-reflection in laser micromachining systems
WO2012116153A1 (en) 2011-02-24 2012-08-30 Foro Energy, Inc. High power laser-mechanical drilling bit and methods of use
EP2715887A4 (en) * 2011-06-03 2016-11-23 Foro Energy Inc PASSIVELY COOLED HIGH ENERGY LASER FIBER ROBUST OPTICAL CONNECTORS AND METHODS OF USE
US10481339B2 (en) 2011-06-03 2019-11-19 Foro Energy, Inc. High average power optical fiber cladding mode stripper, methods of making and uses
JP5643936B2 (ja) * 2011-06-29 2014-12-24 フルウチ化学株式会社 コリメータおよびコリメータ付き光アイソレータ
US10221687B2 (en) 2015-11-26 2019-03-05 Merger Mines Corporation Method of mining using a laser
DE102018205545A1 (de) * 2018-04-12 2019-10-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung, Laserbearbeitungsmaschine und Verfahren zum Bearbeiten eines Werkstücks
JP7303053B2 (ja) * 2019-07-17 2023-07-04 ファナック株式会社 調整補助具及びレーザ溶接装置
JP7753730B2 (ja) * 2021-08-31 2025-10-15 セイコーエプソン株式会社 レーザー干渉計
JP7694299B2 (ja) * 2021-09-24 2025-06-18 セイコーエプソン株式会社 レーザー干渉計
TWI788076B (zh) 2021-10-29 2022-12-21 財團法人工業技術研究院 光纖模組及其製法
US20240405867A1 (en) * 2023-06-01 2024-12-05 Qualcomm Incorporated Utilizing curved focal planes for optical wireless communication

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US4676592A (en) * 1983-02-24 1987-06-30 Olympus Optical Co., Ltd. Image transmitting optical system using optical fiber bundle
US5796880A (en) * 1996-11-18 1998-08-18 Lucent Technologies Inc. Technique for modulating optical signals in optical communications
US5815278A (en) * 1995-10-25 1998-09-29 University Of Washington Surface plasmon resonance light pipe sensing probe and related interface optics
US7067763B2 (en) * 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby

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JPS58162348A (ja) * 1982-03-23 1983-09-27 Toshiba Corp レ−ザ−印刷装置
JPS6376782A (ja) * 1986-09-19 1988-04-07 Komatsu Ltd レ−ザ加工装置
JPS63194887A (ja) * 1987-02-09 1988-08-12 Fujitsu Ltd レ−ザ加工機ヘツド
US6088153A (en) 1997-06-26 2000-07-11 Scientific-Atlanta, Inc. Multi-functional optical isolator
US6292604B1 (en) 1999-07-16 2001-09-18 Jds Fitel Inc. Optical coupler arrangement
JP2001235701A (ja) * 2000-02-24 2001-08-31 Nippon Sharyo Seizo Kaisha Ltd 高速微細レーザ加工方法およびその装置
US6735462B2 (en) * 2000-12-21 2004-05-11 Raytheon Company Method and apparatus for infrared imaging in small passageways
JP4021680B2 (ja) * 2002-02-22 2007-12-12 サンクス株式会社 レーザ加工装置
DE60200139T2 (de) 2002-06-11 2004-09-30 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Vorrichtung mit reduziertem Verlust durch Rückreflexion
GB2400183A (en) 2003-04-01 2004-10-06 Agilent Technologies Inc Mounting optic fibre and optical waveguide on substrate
JP4716663B2 (ja) * 2004-03-19 2011-07-06 株式会社リコー レーザ加工装置、レーザ加工方法、及び該加工装置又は加工方法により作製された構造体
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4676592A (en) * 1983-02-24 1987-06-30 Olympus Optical Co., Ltd. Image transmitting optical system using optical fiber bundle
US5815278A (en) * 1995-10-25 1998-09-29 University Of Washington Surface plasmon resonance light pipe sensing probe and related interface optics
US5796880A (en) * 1996-11-18 1998-08-18 Lucent Technologies Inc. Technique for modulating optical signals in optical communications
US7067763B2 (en) * 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby

Also Published As

Publication number Publication date
US20090308852A1 (en) 2009-12-17
CN102057544A (zh) 2011-05-11
TW201000951A (en) 2010-01-01
KR20110017385A (ko) 2011-02-21
JP5675600B2 (ja) 2015-02-25
JP2011524259A (ja) 2011-09-01
WO2009155280A2 (en) 2009-12-23
WO2009155280A3 (en) 2010-03-11
US8217302B2 (en) 2012-07-10

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