JP5675110B2 - 分離線または目標破断線に沿った非対称的なエネルギ導入を使用して構成部分を製造するための方法 - Google Patents
分離線または目標破断線に沿った非対称的なエネルギ導入を使用して構成部分を製造するための方法 Download PDFInfo
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- JP5675110B2 JP5675110B2 JP2009551195A JP2009551195A JP5675110B2 JP 5675110 B2 JP5675110 B2 JP 5675110B2 JP 2009551195 A JP2009551195 A JP 2009551195A JP 2009551195 A JP2009551195 A JP 2009551195A JP 5675110 B2 JP5675110 B2 JP 5675110B2
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- energy
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
Claims (11)
- 構成部分を製造するための方法であって、まず、熱的な処理ステップまたは方法ステップで、目標破断線を、エネルギ導入によって局所的に加熱し、引き続き冷却媒体で衝撃的に冷却して、構成部分にこの熱交番によって目標破断線に沿った意図的な亀裂形成または材料弱化を生じさせることにより、構成部分の少なくとも1つの表面に少なくとも1つの目標破断線を形成する形式の方法において、目標破断線に沿ったエネルギ導入をあらゆる箇所で非対称的に行い、目標破断線のあらゆる箇所を、適当な短い時間間隔を置いて、互いに異なる強さの少なくとも2回のエネルギ導入により負荷し、こうしてエネルギ分配を、所望の亀裂形成または材料弱化に適合させ、形成したい目標破断線のあらゆる箇所で、まず大きなエネルギ導入を行い、これにより表面の一種の裂け目付けを行い、形成したい目標破断線の深さを、その後に、弱いエネルギ導入によって生ぜしめることを特徴とする、構成部分を製造するための方法。
- エネルギ導入の交番を、連続的または段階的に実施する、請求項1記載の方法。
- エネルギ導入を、レーザまたは赤外線源を介して実施する、請求項1または2記載の方法。
- エネルギ導入を、レンズ系またはミラー系、またはレンズ系とミラー系との組合せを介して行い、レンズ系またはミラー系の調節によってエネルギ導入を制御する、請求項1から3までのいずれか1項記載の方法。
- エネルギ導入を、少なくとも2つのレーザまたは赤外線源により実施して、少なくとも1つの2ビーム法を使用する、請求項1から4までのいずれか1項記載の方法。
- エネルギ導入を、エネルギ導入の周波数および/または波長の変更により制御する、請求項1から5までのいずれか1項記載の方法。
- 形成したい目標破断線にマスクを載着させ、エネルギ導入を該マスクの変更または移動により制御する、請求項1から6までのいずれか1項記載の方法。
- 構成部分に、該構成部分自体の材料と同じか、または異なる吸収能力の材料を有する少なくとも1つの領域をコーティングして、エネルギ導入をこの層の吸収能により制御する、請求項1から7までのいずれか1項記載の方法。
- エネルギ導入を、構成部分の、形成したい目標破断線と、エネルギ源との間の等しい間隔か、または互いに異なる可変の間隔によって制御する、請求項1から8までのいずれか1項記載の方法。
- エネルギ導入が、1つまたは複数の側から基板に作用する、請求項1から9までのいずれか1項記載の方法。
- 前記構成部材は、セラミックである、請求項1から10までのいずれか1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007010126.2 | 2007-02-28 | ||
DE102007010126 | 2007-02-28 | ||
PCT/EP2008/052365 WO2008104560A1 (de) | 2007-02-28 | 2008-02-27 | Verfahren zum herstellen eines bauteils unter verwendung einer asymmetrischen energieeinleitung entlang der trenn- oder sollbruchlinie |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010520083A JP2010520083A (ja) | 2010-06-10 |
JP5675110B2 true JP5675110B2 (ja) | 2015-02-25 |
Family
ID=39494536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009551195A Expired - Fee Related JP5675110B2 (ja) | 2007-02-28 | 2008-02-27 | 分離線または目標破断線に沿った非対称的なエネルギ導入を使用して構成部分を製造するための方法 |
Country Status (12)
Country | Link |
---|---|
US (1) | US20100320249A1 (ja) |
EP (1) | EP2131994B1 (ja) |
JP (1) | JP5675110B2 (ja) |
CN (1) | CN101678510B (ja) |
DE (1) | DE102008000418A1 (ja) |
DK (1) | DK2131994T3 (ja) |
ES (1) | ES2436775T3 (ja) |
PL (1) | PL2131994T3 (ja) |
PT (1) | PT2131994E (ja) |
SI (1) | SI2131994T1 (ja) |
TW (1) | TWI466836B (ja) |
WO (1) | WO2008104560A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012103176B3 (de) | 2012-04-12 | 2013-05-29 | Jenoptik Automatisierungstechnik Gmbh | Vorrichtung und Verfahren zum Einbringen von Trennrissen in ein Substrat |
EP3299112A1 (en) * | 2016-09-21 | 2018-03-28 | Etxe-Tar, S.A. | Method of and system for welding using an energy beam scanned repeatedly in two dimensions |
DE102020105650A1 (de) | 2020-03-03 | 2021-09-09 | Frank Carsten Herzog | Strahllenkeinrichtung zum Lenken wenigstens eines Energiestrahls entlang einer Oberfläche |
Family Cites Families (24)
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US3709414A (en) * | 1970-09-15 | 1973-01-09 | Ppg Industries Inc | Directional control for thermal severing of glass |
DE3145278C2 (de) * | 1981-11-14 | 1985-02-14 | Schott-Zwiesel-Glaswerke Ag, 8372 Zwiesel | Verfahren zum berührungslosen Abtragen von Material von der Oberfläche eines Glasgegenstandes und Vorrichtung zur Durchführung des Verfahrens |
JP3217385B2 (ja) * | 1991-02-21 | 2001-10-09 | 株式会社小坂研究所 | ガラスパネルの割断方法 |
RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
BE1011208A4 (fr) * | 1997-06-11 | 1999-06-01 | Cuvelier Georges | Procede de decalottage de pieces en verre. |
JP3204307B2 (ja) * | 1998-03-20 | 2001-09-04 | 日本電気株式会社 | レーザ照射方法およびレーザ照射装置 |
US6420678B1 (en) * | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
EP1232038B1 (en) * | 1999-11-24 | 2008-04-23 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
JP2002153984A (ja) * | 2000-11-22 | 2002-05-28 | Seiko Epson Corp | 基板分割方法及びこれを用いた液晶装置の製造方法 |
WO2003008168A1 (fr) * | 2001-07-16 | 2003-01-30 | Mitsuboshi Diamond Industrial Co., Ltd. | Dispositif de rainurage pour substrat constitue de matiere fragile |
RU2206525C2 (ru) * | 2001-07-25 | 2003-06-20 | Кондратенко Владимир Степанович | Способ резки хрупких неметаллических материалов |
TW568809B (en) * | 2001-09-21 | 2004-01-01 | Mitsuboshi Diamond Ind Co Ltd | Method for scribing substrate of brittle material and scriber |
KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
JP4633335B2 (ja) * | 2003-02-12 | 2011-02-16 | 株式会社ディスコ | レーザ加工装置およびレーザ加工方法 |
US7638730B2 (en) * | 2003-03-21 | 2009-12-29 | Rorze Systems Corporation | Apparatus for cutting glass plate |
DE10327360B4 (de) * | 2003-06-16 | 2012-05-24 | Curamik Electronics Gmbh | Verfahren zum Herstellen eines Keramik-Metall-Substrates |
JP2005212364A (ja) * | 2004-01-30 | 2005-08-11 | Shibaura Mechatronics Corp | 脆性材料の割断加工システム及びその方法 |
JP2008503355A (ja) * | 2004-06-21 | 2008-02-07 | アプライド フォトニクス,インク. | 基板材料の切断、分断または分割装置、システムおよび方法 |
EP1803538A1 (en) * | 2004-10-01 | 2007-07-04 | Mitsuboshi Diamond Industrial Co., Ltd. | Brittle material scribing method and scribing apparatus |
DE102005013783B4 (de) * | 2005-03-22 | 2007-08-16 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung |
JP4908936B2 (ja) * | 2005-06-30 | 2012-04-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2007099587A (ja) * | 2005-10-07 | 2007-04-19 | Kyoto Seisakusho Co Ltd | 脆性材料の割断加工方法 |
TWI400167B (zh) * | 2006-05-23 | 2013-07-01 | Ceramtec Ag | 在一工作物中作出變弱部的方法 |
-
2008
- 2008-02-27 CN CN2008800065070A patent/CN101678510B/zh not_active Expired - Fee Related
- 2008-02-27 PL PL08717172T patent/PL2131994T3/pl unknown
- 2008-02-27 US US12/528,125 patent/US20100320249A1/en not_active Abandoned
- 2008-02-27 JP JP2009551195A patent/JP5675110B2/ja not_active Expired - Fee Related
- 2008-02-27 WO PCT/EP2008/052365 patent/WO2008104560A1/de active Application Filing
- 2008-02-27 DK DK08717172T patent/DK2131994T3/da active
- 2008-02-27 PT PT87171724T patent/PT2131994E/pt unknown
- 2008-02-27 TW TW97106750A patent/TWI466836B/zh not_active IP Right Cessation
- 2008-02-27 DE DE200810000418 patent/DE102008000418A1/de not_active Withdrawn
- 2008-02-27 EP EP08717172.4A patent/EP2131994B1/de not_active Not-in-force
- 2008-02-27 SI SI200831103T patent/SI2131994T1/sl unknown
- 2008-02-27 ES ES08717172T patent/ES2436775T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
DE102008000418A1 (de) | 2008-09-04 |
CN101678510B (zh) | 2013-10-30 |
SI2131994T1 (sl) | 2014-03-31 |
WO2008104560A1 (de) | 2008-09-04 |
PL2131994T3 (pl) | 2014-03-31 |
JP2010520083A (ja) | 2010-06-10 |
CN101678510A (zh) | 2010-03-24 |
TW200918474A (en) | 2009-05-01 |
ES2436775T3 (es) | 2014-01-07 |
TWI466836B (zh) | 2015-01-01 |
PT2131994E (pt) | 2013-11-29 |
EP2131994A1 (de) | 2009-12-16 |
DK2131994T3 (da) | 2013-12-02 |
EP2131994B1 (de) | 2013-08-28 |
US20100320249A1 (en) | 2010-12-23 |
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