JP5673963B2 - ポジ型レジスト組成物及びマイクロレンズの製造方法 - Google Patents

ポジ型レジスト組成物及びマイクロレンズの製造方法 Download PDF

Info

Publication number
JP5673963B2
JP5673963B2 JP2011551818A JP2011551818A JP5673963B2 JP 5673963 B2 JP5673963 B2 JP 5673963B2 JP 2011551818 A JP2011551818 A JP 2011551818A JP 2011551818 A JP2011551818 A JP 2011551818A JP 5673963 B2 JP5673963 B2 JP 5673963B2
Authority
JP
Japan
Prior art keywords
component
formula
group
methyl
resist composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011551818A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2011093188A1 (ja
Inventor
昇志郎 湯川
昇志郎 湯川
慎哉 荒瀬
荒瀬  慎哉
武山 敏明
敏明 武山
勇樹 遠藤
勇樹 遠藤
健夫 毛呂
健夫 毛呂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to JP2011551818A priority Critical patent/JP5673963B2/ja
Publication of JPWO2011093188A1 publication Critical patent/JPWO2011093188A1/ja
Application granted granted Critical
Publication of JP5673963B2 publication Critical patent/JP5673963B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0012Arrays characterised by the manufacturing method
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D405/00Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/02Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
    • C07D405/06Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a carbon chain containing only aliphatic carbon atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D405/00Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011551818A 2010-01-26 2011-01-19 ポジ型レジスト組成物及びマイクロレンズの製造方法 Active JP5673963B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011551818A JP5673963B2 (ja) 2010-01-26 2011-01-19 ポジ型レジスト組成物及びマイクロレンズの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010014505 2010-01-26
JP2010014505 2010-01-26
JP2011551818A JP5673963B2 (ja) 2010-01-26 2011-01-19 ポジ型レジスト組成物及びマイクロレンズの製造方法
PCT/JP2011/050854 WO2011093188A1 (fr) 2010-01-26 2011-01-19 Composition de réserve de type positif et procédé pour produire une microlentille

Publications (2)

Publication Number Publication Date
JPWO2011093188A1 JPWO2011093188A1 (ja) 2013-06-06
JP5673963B2 true JP5673963B2 (ja) 2015-02-18

Family

ID=44319178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011551818A Active JP5673963B2 (ja) 2010-01-26 2011-01-19 ポジ型レジスト組成物及びマイクロレンズの製造方法

Country Status (7)

Country Link
US (1) US8722311B2 (fr)
EP (1) EP2530524B1 (fr)
JP (1) JP5673963B2 (fr)
KR (1) KR101852523B1 (fr)
CN (1) CN102725691B (fr)
TW (1) TWI548943B (fr)
WO (1) WO2011093188A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210052452A (ko) 2018-08-30 2021-05-10 닛산 가가쿠 가부시키가이샤 네가티브형 감광성 수지조성물

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100017758A (ko) * 2007-05-17 2010-02-16 닛산 가가쿠 고교 가부시키 가이샤 감광성 수지 및 마이크로 렌즈의 제조 방법
US8912295B2 (en) * 2009-02-10 2014-12-16 Nissan Chemical Industries, Ltd. Long chain alkylene group-containing epoxy compound
US8778597B2 (en) * 2010-01-26 2014-07-15 Nissan Chemical Industries, Ltd. Long-chain alkylene-containing curable epoxy resin composition
DE102010028062A1 (de) * 2010-04-22 2011-10-27 Evonik Degussa Gmbh Verfahren zur Herstellung vernetzter organischer Polymere
US20130172522A1 (en) * 2010-08-05 2013-07-04 Nissan Chemical Industries, Ltd. Epoxy compound with nitrogen-containing ring
CN103068823A (zh) 2010-08-05 2013-04-24 日产化学工业株式会社 具有氰脲酸骨架的环氧化合物的制造方法
KR101252063B1 (ko) 2011-08-25 2013-04-12 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
JP6124013B2 (ja) * 2011-09-29 2017-05-10 日産化学工業株式会社 光硬化性樹脂組成物
JP2015502919A (ja) * 2011-11-01 2015-01-29 コリア インスティチュート オブ インダストリアル テクノロジー アルコキシシリル基を有するイソシアヌレートエポキシ化合物、その製造方法、それを含む組成物、該組成物の硬化物及び該組成物の用途
US9902803B2 (en) 2012-03-14 2018-02-27 Korea Institute Of Industrial Technology Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group
EP2835373B1 (fr) 2012-04-02 2019-09-11 Korea Institute of Industrial Technology Composé époxy présentant un groupe alcoxysilyle, composition et matériau durci le comprenant, son utilisation et procédé de préparation du composé époxy présentant un groupe alcoxysilyle
KR101863111B1 (ko) 2012-07-06 2018-06-01 한국생산기술연구원 노볼락계 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
JP6315205B2 (ja) * 2012-10-25 2018-04-25 日産化学工業株式会社 エポキシ化合物の製造方法
JP6384678B2 (ja) * 2013-10-21 2018-09-05 日産化学株式会社 ポジ型感光性樹脂組成物
KR20150068899A (ko) * 2013-12-12 2015-06-22 제이엔씨 주식회사 포지티브형 감광성 조성물
ES2632783T3 (es) 2014-12-19 2017-09-15 Evonik Degussa Gmbh Sistemas de redes de cubierta para láminas de encapsulación que comprenden compuestos de bis-(alquenilamidas)
CN104892586B (zh) * 2015-05-31 2017-05-10 黄山华惠科技有限公司 制备异氰脲酸三缩水甘油酯的新方法
KR20190056088A (ko) * 2017-11-16 2019-05-24 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물 및 이로부터 제조된 경화막
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체
CN114945611A (zh) * 2020-02-03 2022-08-26 太阳油墨制造株式会社 固化性组合物、其干膜和固化物

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695386A (ja) * 1992-09-11 1994-04-08 Tosoh Corp マイクロレンズ用ポジ型感光材料
JPH08325481A (ja) * 1994-11-28 1996-12-10 Nissan Chem Ind Ltd 粉体塗料用樹脂組成物
WO2003029898A1 (fr) * 2001-09-27 2003-04-10 Clariant International Ltd. Composition de resine photosensible
JP2006154779A (ja) * 2004-10-29 2006-06-15 Jsr Corp ポジ型感光性絶縁樹脂組成物およびその硬化物
JP2008007782A (ja) * 2006-06-27 2008-01-17 Lumination Llc オプトエレクトロニックデバイス
JP2008065303A (ja) * 2006-08-10 2008-03-21 Shin Etsu Chem Co Ltd レジスト下層膜材料及びパターン形成方法
JP2010001424A (ja) * 2008-06-23 2010-01-07 Dic Corp エポキシ化合物及びエポキシ硬化物
WO2010007915A1 (fr) * 2008-07-16 2010-01-21 日産化学工業株式会社 Composition de produit de réserve de type positif et procédé de fabrication de microlentille
WO2010092947A1 (fr) * 2009-02-10 2010-08-19 日産化学工業株式会社 Composé époxydé contenant un groupe alkylène à longue chaîne
JP2010266487A (ja) * 2009-05-12 2010-11-25 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、硬化膜、パターン硬化膜の製造方法及び電子部品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101264A (en) 1988-03-31 1992-03-31 Mitsui Petrochemical Ind. Light-emitting or receiving device with smooth and hard encapsulant resin
JPH01251745A (ja) * 1988-03-31 1989-10-06 Mitsui Petrochem Ind Ltd 発光または受光装置および発光または受光素子用封止剤
JPH04166944A (ja) * 1990-10-31 1992-06-12 Mitsubishi Kasei Corp 感光性樹脂組成物
AU701183B2 (en) * 1994-11-28 1999-01-21 Nissan Chemical Industries Ltd. Resin composition for powder coating
SE9704643D0 (sv) * 1997-12-12 1997-12-12 Astra Ab Inhalation apparatus and method
TWI263867B (en) * 2002-04-18 2006-10-11 Nissan Chemical Ind Ltd Positively photosensitive resin composition and method of pattern formation
EP1806618B1 (fr) * 2004-10-29 2010-06-09 JSR Corporation Composition de résine isolante photosensible positive et produit durci formé à partir de celle-ci
US20070295956A1 (en) 2006-06-27 2007-12-27 Gelcore Llc Optoelectronic device
US20070299162A1 (en) 2006-06-27 2007-12-27 Gelcore Llc Optoelectronic device
US20070295983A1 (en) 2006-06-27 2007-12-27 Gelcore Llc Optoelectronic device
US7745104B2 (en) * 2006-08-10 2010-06-29 Shin-Etsu Chemical Co., Ltd. Bottom resist layer composition and patterning process using the same
JP4973876B2 (ja) * 2007-08-22 2012-07-11 信越化学工業株式会社 パターン形成方法及びこれに用いるパターン表面コート材
CN101878240B (zh) * 2007-11-29 2012-11-28 日产化学工业株式会社 含二氧化硅的环氧固化剂及环氧树脂固化体

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695386A (ja) * 1992-09-11 1994-04-08 Tosoh Corp マイクロレンズ用ポジ型感光材料
JPH08325481A (ja) * 1994-11-28 1996-12-10 Nissan Chem Ind Ltd 粉体塗料用樹脂組成物
WO2003029898A1 (fr) * 2001-09-27 2003-04-10 Clariant International Ltd. Composition de resine photosensible
JP2006154779A (ja) * 2004-10-29 2006-06-15 Jsr Corp ポジ型感光性絶縁樹脂組成物およびその硬化物
JP2008007782A (ja) * 2006-06-27 2008-01-17 Lumination Llc オプトエレクトロニックデバイス
JP2008065303A (ja) * 2006-08-10 2008-03-21 Shin Etsu Chem Co Ltd レジスト下層膜材料及びパターン形成方法
JP2010001424A (ja) * 2008-06-23 2010-01-07 Dic Corp エポキシ化合物及びエポキシ硬化物
WO2010007915A1 (fr) * 2008-07-16 2010-01-21 日産化学工業株式会社 Composition de produit de réserve de type positif et procédé de fabrication de microlentille
WO2010092947A1 (fr) * 2009-02-10 2010-08-19 日産化学工業株式会社 Composé époxydé contenant un groupe alkylène à longue chaîne
JP2010266487A (ja) * 2009-05-12 2010-11-25 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、硬化膜、パターン硬化膜の製造方法及び電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210052452A (ko) 2018-08-30 2021-05-10 닛산 가가쿠 가부시키가이샤 네가티브형 감광성 수지조성물

Also Published As

Publication number Publication date
WO2011093188A1 (fr) 2011-08-04
US8722311B2 (en) 2014-05-13
JPWO2011093188A1 (ja) 2013-06-06
CN102725691B (zh) 2014-06-11
CN102725691A (zh) 2012-10-10
US20120292487A1 (en) 2012-11-22
TW201144944A (en) 2011-12-16
EP2530524A1 (fr) 2012-12-05
KR20120127609A (ko) 2012-11-22
KR101852523B1 (ko) 2018-04-27
TWI548943B (zh) 2016-09-11
EP2530524A4 (fr) 2015-03-04
EP2530524B1 (fr) 2019-05-29

Similar Documents

Publication Publication Date Title
JP5673963B2 (ja) ポジ型レジスト組成物及びマイクロレンズの製造方法
JP5387861B2 (ja) ポジ型レジスト組成物、マイクロレンズ、固体撮像素子、平坦化膜、液晶表示素子、led表示装置及びパターン形成方法
JP5477595B2 (ja) フルオレン骨格を有する光重合性ポリマーを用いる感光性組成物
JP5093525B2 (ja) 感光性樹脂及びマイクロレンズの製造方法
TW201805723A (zh) 包含具有藉由碳原子間之不飽和鍵之光交聯基之化合物的段差基板被覆組成物
KR101229381B1 (ko) 포지티브형 감광성 수지조성물 및 이에 의해 얻어지는 층간절연막 및 마이크로렌즈
JPH0798502A (ja) ポジ型熱硬化感光材料
JPH07104464A (ja) ポジ型熱硬化感光性組成物
JPH0798501A (ja) 熱硬化ポジ型感光材料

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130718

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140604

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140801

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141203

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141216

R151 Written notification of patent or utility model registration

Ref document number: 5673963

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350