JP5668636B2 - 回路接続構造体の製造方法 - Google Patents
回路接続構造体の製造方法 Download PDFInfo
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- JP5668636B2 JP5668636B2 JP2011173136A JP2011173136A JP5668636B2 JP 5668636 B2 JP5668636 B2 JP 5668636B2 JP 2011173136 A JP2011173136 A JP 2011173136A JP 2011173136 A JP2011173136 A JP 2011173136A JP 5668636 B2 JP5668636 B2 JP 5668636B2
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- XNTUJOTWIMFEQS-UHFFFAOYSA-N octadecanoyl octadecaneperoxoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCCCCCCCC XNTUJOTWIMFEQS-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
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- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
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- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesive Tapes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Conductive Materials (AREA)
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JP2011173136A JP5668636B2 (ja) | 2010-08-24 | 2011-08-08 | 回路接続構造体の製造方法 |
TW100130042A TWI436709B (zh) | 2010-08-24 | 2011-08-23 | 電路連接構造體及電路連接構造體的製造方法 |
CN2011102511296A CN102417794B (zh) | 2010-08-24 | 2011-08-23 | 电路连接材料、连接方法、连接结构体及制造方法和用途 |
PCT/JP2011/068982 WO2012026470A1 (ja) | 2010-08-24 | 2011-08-23 | 回路接続材料及びこれを用いた回路部材の接続方法 |
KR1020110083861A KR101227358B1 (ko) | 2010-08-24 | 2011-08-23 | 회로 접속 재료, 이것을 이용한 회로 부재의 접속 방법, 회로 접속 구조체, 및 회로 접속 구조체의 제조 방법, 및 접속 재료의 용도 |
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JP2010187456 | 2010-08-24 | ||
JP2011173136A JP5668636B2 (ja) | 2010-08-24 | 2011-08-08 | 回路接続構造体の製造方法 |
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JP5668636B2 true JP5668636B2 (ja) | 2015-02-12 |
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JP (1) | JP5668636B2 (ko) |
KR (1) | KR101227358B1 (ko) |
CN (1) | CN102417794B (ko) |
TW (1) | TWI436709B (ko) |
WO (1) | WO2012026470A1 (ko) |
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JP6065407B2 (ja) * | 2012-04-27 | 2017-01-25 | 日立化成株式会社 | 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法 |
JP6102105B2 (ja) * | 2012-07-19 | 2017-03-29 | 日立化成株式会社 | フィルム状回路接続材料及び回路接続構造体 |
JP6024261B2 (ja) * | 2012-07-26 | 2016-11-16 | 日立化成株式会社 | 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール |
JP6107175B2 (ja) * | 2013-01-29 | 2017-04-05 | 日立化成株式会社 | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
CN103336558B (zh) * | 2013-06-13 | 2016-12-28 | 业成光电(深圳)有限公司 | 电子装置 |
JP6398570B2 (ja) * | 2013-10-09 | 2018-10-03 | 日立化成株式会社 | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
JP6425382B2 (ja) * | 2014-01-08 | 2018-11-21 | デクセリアルズ株式会社 | 接続方法、及び接合体 |
JP6330346B2 (ja) * | 2014-01-29 | 2018-05-30 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法 |
JP6374192B2 (ja) * | 2014-03-25 | 2018-08-15 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
WO2022245957A1 (en) * | 2021-05-20 | 2022-11-24 | Illinois Tool Works Inc. | Air damper with integrated heater |
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JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
AU2001252557A1 (en) * | 2000-04-25 | 2001-11-07 | Hitachi Chemical Co. Ltd. | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
JP4747396B2 (ja) * | 2000-05-17 | 2011-08-17 | 日立化成工業株式会社 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
JP2006199825A (ja) * | 2005-01-20 | 2006-08-03 | Soken Chem & Eng Co Ltd | 異方導電性接着テープおよび配線基板異方導電接着体 |
JP2006173100A (ja) * | 2005-11-18 | 2006-06-29 | Hitachi Chem Co Ltd | 電極の接続方法 |
KR100747336B1 (ko) * | 2006-01-20 | 2007-08-07 | 엘에스전선 주식회사 | 이방성 도전 필름을 이용한 회로기판의 접속 구조체, 이를위한 제조 방법 및 이를 이용한 접속 상태 평가방법 |
JP5052050B2 (ja) * | 2006-06-16 | 2012-10-17 | 日立化成工業株式会社 | 電極接続用接着剤及びこれを用いた微細電極の接続構造 |
CN101794638B (zh) * | 2006-07-21 | 2012-06-06 | 日立化成工业株式会社 | 电路连接材料、电路部件的连接结构及电路部件的连接方法 |
JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
JP5023901B2 (ja) * | 2007-05-23 | 2012-09-12 | 日立化成工業株式会社 | 接着剤組成物、回路接続構造体及び半導体装置 |
JP5029372B2 (ja) * | 2007-09-14 | 2012-09-19 | 日立化成工業株式会社 | 異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法 |
KR101240009B1 (ko) * | 2007-09-19 | 2013-03-06 | 히타치가세이가부시끼가이샤 | 접착제 조성물 및 접합체 |
JP5176139B2 (ja) * | 2008-05-12 | 2013-04-03 | 日立化成株式会社 | 回路接続材料及びそれを用いた回路部材の接続構造 |
JP4862921B2 (ja) * | 2008-07-01 | 2012-01-25 | 日立化成工業株式会社 | 回路接続材料、回路接続構造体及びその製造方法 |
JP5445455B2 (ja) * | 2008-08-04 | 2014-03-19 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
JP2010100840A (ja) * | 2008-09-24 | 2010-05-06 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
JP4900490B2 (ja) * | 2010-01-27 | 2012-03-21 | 日立化成工業株式会社 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
JP2011204898A (ja) * | 2010-03-25 | 2011-10-13 | Hitachi Chem Co Ltd | 接着剤組成物及び回路部材の接続構造体 |
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- 2011-08-23 WO PCT/JP2011/068982 patent/WO2012026470A1/ja active Application Filing
- 2011-08-23 KR KR1020110083861A patent/KR101227358B1/ko active IP Right Grant
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JP2012067281A (ja) | 2012-04-05 |
CN102417794B (zh) | 2013-12-04 |
TW201220995A (en) | 2012-05-16 |
WO2012026470A1 (ja) | 2012-03-01 |
TWI436709B (zh) | 2014-05-01 |
CN102417794A (zh) | 2012-04-18 |
KR101227358B1 (ko) | 2013-01-28 |
KR20120022655A (ko) | 2012-03-12 |
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