JP5660145B2 - 硬化性組成物、硬化物および光半導体装置 - Google Patents

硬化性組成物、硬化物および光半導体装置 Download PDF

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Publication number
JP5660145B2
JP5660145B2 JP2013007112A JP2013007112A JP5660145B2 JP 5660145 B2 JP5660145 B2 JP 5660145B2 JP 2013007112 A JP2013007112 A JP 2013007112A JP 2013007112 A JP2013007112 A JP 2013007112A JP 5660145 B2 JP5660145 B2 JP 5660145B2
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Japan
Prior art keywords
group
curable composition
cured product
polysiloxane
compound
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JP2013007112A
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English (en)
Japanese (ja)
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JP2013231160A (ja
Inventor
佑太 後藤
佑太 後藤
康二 中西
康二 中西
哲也 根本
哲也 根本
博幸 野村
博幸 野村
長谷川　公一
公一 長谷川
玉木　研太郎
研太郎 玉木
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JSR Corp
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JSR Corp
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Publication date
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Priority to JP2013007112A priority Critical patent/JP5660145B2/ja
Priority to TW102110411A priority patent/TWI513766B/zh
Priority to KR1020130035075A priority patent/KR20130112761A/ko
Publication of JP2013231160A publication Critical patent/JP2013231160A/ja
Application granted granted Critical
Publication of JP5660145B2 publication Critical patent/JP5660145B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
JP2013007112A 2012-04-03 2013-01-18 硬化性組成物、硬化物および光半導体装置 Active JP5660145B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013007112A JP5660145B2 (ja) 2012-04-03 2013-01-18 硬化性組成物、硬化物および光半導体装置
TW102110411A TWI513766B (zh) 2012-04-03 2013-03-25 硬化性組成物、硬化物以及光半導體裝置
KR1020130035075A KR20130112761A (ko) 2012-04-03 2013-04-01 경화성 조성물, 경화물 및 광반도체 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012084723 2012-04-03
JP2012084723 2012-04-03
JP2013007112A JP5660145B2 (ja) 2012-04-03 2013-01-18 硬化性組成物、硬化物および光半導体装置

Publications (2)

Publication Number Publication Date
JP2013231160A JP2013231160A (ja) 2013-11-14
JP5660145B2 true JP5660145B2 (ja) 2015-01-28

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JP2013007112A Active JP5660145B2 (ja) 2012-04-03 2013-01-18 硬化性組成物、硬化物および光半導体装置

Country Status (2)

Country Link
JP (1) JP5660145B2 (zh)
TW (1) TWI513766B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015136820A1 (ja) * 2014-03-12 2015-09-17 横浜ゴム株式会社 硬化性樹脂組成物
WO2020206626A1 (en) * 2019-04-10 2020-10-15 Henkel Ag & Co. Kgaa Thermally conductive silicone potting composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4503271B2 (ja) * 2003-11-28 2010-07-14 東レ・ダウコーニング株式会社 シリコーン積層体の製造方法
JP4961828B2 (ja) * 2006-05-12 2012-06-27 ソニー株式会社 ナノ粒子−樹脂複合材料の製造方法
JP5667740B2 (ja) * 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
KR101251553B1 (ko) * 2010-01-18 2013-04-08 한국과학기술원 엘이디 봉지재용 실록산 수지 조성물
JP5524017B2 (ja) * 2010-10-08 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
KR20140034122A (ko) * 2010-12-08 2014-03-19 다우 코닝 코포레이션 봉지재의 형성에 적합한 금속 산화물 나노입자 함유 실록산 조성물
KR101334349B1 (ko) * 2011-12-15 2013-11-29 한국과학기술연구원 가열 경화성 실록산 봉지재 조성물

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Publication number Publication date
TW201341472A (zh) 2013-10-16
TWI513766B (zh) 2015-12-21
JP2013231160A (ja) 2013-11-14

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