JP5655017B2 - ワーク吸着固定装置および超音波検査システム - Google Patents

ワーク吸着固定装置および超音波検査システム Download PDF

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Publication number
JP5655017B2
JP5655017B2 JP2012034420A JP2012034420A JP5655017B2 JP 5655017 B2 JP5655017 B2 JP 5655017B2 JP 2012034420 A JP2012034420 A JP 2012034420A JP 2012034420 A JP2012034420 A JP 2012034420A JP 5655017 B2 JP5655017 B2 JP 5655017B2
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Prior art keywords
workpiece
water
suction
fixing device
holding member
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JP2012034420A
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English (en)
Japanese (ja)
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JP2013170902A (ja
Inventor
正勝 村井
正勝 村井
北見　薫
薫 北見
美津男 拵
美津男 拵
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Hitachi Power Solutions Co Ltd
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Hitachi Power Solutions Co Ltd
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Publication date
Application filed by Hitachi Power Solutions Co Ltd filed Critical Hitachi Power Solutions Co Ltd
Priority to JP2012034420A priority Critical patent/JP5655017B2/ja
Priority to TW102102916A priority patent/TWI507684B/zh
Priority to KR1020130017901A priority patent/KR101505417B1/ko
Priority to CN201310053935.1A priority patent/CN103257185B/zh
Publication of JP2013170902A publication Critical patent/JP2013170902A/ja
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Publication of JP5655017B2 publication Critical patent/JP5655017B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/223—Supports, positioning or alignment in fixed situation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2012034420A 2012-02-20 2012-02-20 ワーク吸着固定装置および超音波検査システム Active JP5655017B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012034420A JP5655017B2 (ja) 2012-02-20 2012-02-20 ワーク吸着固定装置および超音波検査システム
TW102102916A TWI507684B (zh) 2012-02-20 2013-01-25 Workpiece adsorption fixtures and ultrasonic inspection systems
KR1020130017901A KR101505417B1 (ko) 2012-02-20 2013-02-20 워크 흡착 고정 장치 및 초음파 검사 시스템
CN201310053935.1A CN103257185B (zh) 2012-02-20 2013-02-20 工件吸附固定装置以及超声波检查系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012034420A JP5655017B2 (ja) 2012-02-20 2012-02-20 ワーク吸着固定装置および超音波検査システム

Publications (2)

Publication Number Publication Date
JP2013170902A JP2013170902A (ja) 2013-09-02
JP5655017B2 true JP5655017B2 (ja) 2015-01-14

Family

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Family Applications (1)

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JP2012034420A Active JP5655017B2 (ja) 2012-02-20 2012-02-20 ワーク吸着固定装置および超音波検査システム

Country Status (4)

Country Link
JP (1) JP5655017B2 (zh)
KR (1) KR101505417B1 (zh)
CN (1) CN103257185B (zh)
TW (1) TWI507684B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101371116B1 (ko) * 2013-12-10 2014-03-10 서울검사 주식회사 자성체 및 비자성체 겸용 수침 초음파 탐상장치
CN105806937B (zh) * 2014-12-30 2019-04-16 中核武汉核电运行技术股份有限公司 一种蒸汽发生器传热管超声检查系统
JP6273055B1 (ja) 2017-01-31 2018-01-31 株式会社日立パワーソリューションズ 位置制御装置、位置制御方法、及び超音波映像システム
CN108895996A (zh) * 2018-06-25 2018-11-27 长沙理工大学 混凝土表面应变计的安装装置
JP6479243B1 (ja) * 2018-07-02 2019-03-06 株式会社日立パワーソリューションズ 超音波映像システム
CN111807695B (zh) * 2020-08-27 2022-04-29 泉州盛协科技有限公司 一种适用于8mm以下厚度的柔性平面玻璃切割工作台

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098358A (ja) * 1983-11-02 1985-06-01 Olympus Optical Co Ltd 超音波顕微鏡用試料台装置
JPS6121963U (ja) * 1984-07-13 1986-02-08 株式会社東芝 水中検査装置
JPS63131803A (ja) * 1986-11-21 1988-06-03 Hitachi Ltd 発電所機器冷却水制御装置
JPH01167655A (ja) * 1987-12-23 1989-07-03 Hitachi Ltd ライニング用スキヤナ
JPH04326057A (ja) * 1991-04-26 1992-11-16 Toshiba Corp 超音波検査方法
JPH05223792A (ja) * 1992-02-17 1993-08-31 Canon Inc 超音波映像装置の被検物体固定機構
JPH08188277A (ja) * 1995-01-09 1996-07-23 Honda Motor Co Ltd 真空吸着装置
JP3146147B2 (ja) * 1996-02-22 2001-03-12 日立建機株式会社 超音波検査用被検体固定装置
US7210354B2 (en) * 1997-06-16 2007-05-01 Puskas William L Sensing system for measuring cavitation
JPH1164302A (ja) * 1997-08-25 1999-03-05 Hitachi Constr Mach Co Ltd 超音波検査装置の試料載置台
JP3290632B2 (ja) * 1999-01-06 2002-06-10 株式会社アルテクス 超音波振動接合装置
TW490559B (en) * 1999-07-30 2002-06-11 Hitachi Construction Machinery Ultrasonic inspection apparatus and ultrasonic detector
JP3855928B2 (ja) * 2002-12-27 2006-12-13 日立エンジニアリング株式会社 水浸超音波探傷装置
TWI223708B (en) * 2003-09-26 2004-11-11 Je-Hua Yang System and method for measuring hydrogen content in metal component
EP1958920A4 (en) * 2005-12-09 2011-06-15 Kyocera Corp FLUIDACTOR, THIS USING HEAT GENERATOR AND ANALYSIS DEVICE
JP2008132541A (ja) 2006-11-27 2008-06-12 Toshiba Mach Co Ltd ロボットハンド吸着装置
CN201637741U (zh) * 2010-04-07 2010-11-17 中生(苏州)医疗仪器有限公司 生化分析仪的流路
CN202033330U (zh) * 2011-03-24 2011-11-09 宁波恒信工程检测有限公司 一种超声波水浸法检测用固定装置
CN202101973U (zh) * 2011-06-08 2012-01-04 南通航运职业技术学院 大口径无缝钢管超声波自动化探伤设备

Also Published As

Publication number Publication date
KR101505417B1 (ko) 2015-03-25
KR20130095685A (ko) 2013-08-28
TW201350846A (zh) 2013-12-16
CN103257185A (zh) 2013-08-21
CN103257185B (zh) 2015-10-28
TWI507684B (zh) 2015-11-11
JP2013170902A (ja) 2013-09-02

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