JP5654288B2 - 光モジュール及び高周波モジュール - Google Patents
光モジュール及び高周波モジュール Download PDFInfo
- Publication number
- JP5654288B2 JP5654288B2 JP2010187471A JP2010187471A JP5654288B2 JP 5654288 B2 JP5654288 B2 JP 5654288B2 JP 2010187471 A JP2010187471 A JP 2010187471A JP 2010187471 A JP2010187471 A JP 2010187471A JP 5654288 B2 JP5654288 B2 JP 5654288B2
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- Prior art keywords
- substrate
- optical module
- conductor pattern
- conductor
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims description 170
- 239000004020 conductor Substances 0.000 claims description 250
- 239000000758 substrate Substances 0.000 claims description 247
- 239000000919 ceramic Substances 0.000 claims description 135
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 230000008878 coupling Effects 0.000 description 30
- 238000010168 coupling process Methods 0.000 description 30
- 238000005859 coupling reaction Methods 0.000 description 30
- 230000005540 biological transmission Effects 0.000 description 17
- 238000001465 metallisation Methods 0.000 description 17
- 230000008054 signal transmission Effects 0.000 description 12
- 230000008901 benefit Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 230000005855 radiation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 230000005672 electromagnetic field Effects 0.000 description 5
- 235000011449 Rosa Nutrition 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Light Receiving Elements (AREA)
- Optical Communication System (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010187471A JP5654288B2 (ja) | 2010-08-24 | 2010-08-24 | 光モジュール及び高周波モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010187471A JP5654288B2 (ja) | 2010-08-24 | 2010-08-24 | 光モジュール及び高周波モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012047823A JP2012047823A (ja) | 2012-03-08 |
| JP2012047823A5 JP2012047823A5 (enrdf_load_stackoverflow) | 2013-08-01 |
| JP5654288B2 true JP5654288B2 (ja) | 2015-01-14 |
Family
ID=45902808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010187471A Active JP5654288B2 (ja) | 2010-08-24 | 2010-08-24 | 光モジュール及び高周波モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5654288B2 (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013201473A (ja) * | 2012-03-23 | 2013-10-03 | Sumitomo Electric Ind Ltd | 光受信モジュール |
| US9775245B2 (en) | 2014-03-24 | 2017-09-26 | Photonics Electronics Technology Research Association | Pad-array structure on substrate for mounting IC chip on substrate, and optical module having said pad-array structure |
| JP6229649B2 (ja) | 2014-12-08 | 2017-11-15 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
| JPWO2016129277A1 (ja) * | 2015-02-12 | 2017-11-24 | 古河電気工業株式会社 | フレキシブル基板及び光モジュール |
| JP6430296B2 (ja) | 2015-03-06 | 2018-11-28 | 日本オクラロ株式会社 | 光モジュール |
| JP6430312B2 (ja) * | 2015-03-24 | 2018-11-28 | 日本オクラロ株式会社 | 光モジュール |
| JP6540417B2 (ja) | 2015-09-18 | 2019-07-10 | 富士通オプティカルコンポーネンツ株式会社 | 光伝送装置及び光モジュール |
| JP6958098B2 (ja) * | 2017-08-10 | 2021-11-02 | 住友電気工業株式会社 | 光モジュール |
| JP6939603B2 (ja) * | 2018-01-26 | 2021-09-22 | 住友電気工業株式会社 | 光受信モジュール用パッケージ |
| JP7166874B2 (ja) * | 2018-10-25 | 2022-11-08 | 古河電気工業株式会社 | 光モジュール実装基板および容器実装基板 |
| JP7474145B2 (ja) * | 2020-07-29 | 2024-04-24 | ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 | 光モジュール |
| CN114217390B (zh) * | 2021-12-24 | 2024-02-23 | 苏州浪潮智能科技有限公司 | 光交换机设计方法、光交换机、电子设备及存储介质 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184888A (ja) * | 2000-12-13 | 2002-06-28 | Kyocera Corp | 入出力端子および半導体素子収納用パッケージ |
| JP2003224324A (ja) * | 2002-01-30 | 2003-08-08 | Kyocera Corp | 光半導体素子収納用パッケージおよび光半導体装置 |
| JP2004356340A (ja) * | 2003-05-28 | 2004-12-16 | Kyocera Corp | 半導体素子収納用パッケージおよび半導体装置 |
| JP2005222003A (ja) * | 2004-02-09 | 2005-08-18 | Fujikura Ltd | マウント、光部品、光送受信モジュール及び双方向光通信モジュール |
| JP2007207803A (ja) * | 2006-01-31 | 2007-08-16 | Opnext Japan Inc | 光送信モジュール |
| JP2008166730A (ja) * | 2006-12-04 | 2008-07-17 | Nec Corp | 光モジュールおよび光トランシーバ |
| JP2009004460A (ja) * | 2007-06-19 | 2009-01-08 | Opnext Japan Inc | 光通信モジュールおよび配線パタンの形成方法 |
-
2010
- 2010-08-24 JP JP2010187471A patent/JP5654288B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012047823A (ja) | 2012-03-08 |
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