JP5652381B2 - 表面加工方法及び装置 - Google Patents

表面加工方法及び装置 Download PDF

Info

Publication number
JP5652381B2
JP5652381B2 JP2011259902A JP2011259902A JP5652381B2 JP 5652381 B2 JP5652381 B2 JP 5652381B2 JP 2011259902 A JP2011259902 A JP 2011259902A JP 2011259902 A JP2011259902 A JP 2011259902A JP 5652381 B2 JP5652381 B2 JP 5652381B2
Authority
JP
Japan
Prior art keywords
workpiece
etching
nozzle
processing
supply means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011259902A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012064968A5 (enrdf_load_stackoverflow
JP2012064968A (ja
Inventor
和也 山村
和也 山村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosoh Corp
Original Assignee
Tosoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Corp filed Critical Tosoh Corp
Priority to JP2011259902A priority Critical patent/JP5652381B2/ja
Publication of JP2012064968A publication Critical patent/JP2012064968A/ja
Publication of JP2012064968A5 publication Critical patent/JP2012064968A5/ja
Application granted granted Critical
Publication of JP5652381B2 publication Critical patent/JP5652381B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Surface Treatment Of Glass (AREA)
  • Weting (AREA)
JP2011259902A 2011-11-29 2011-11-29 表面加工方法及び装置 Expired - Fee Related JP5652381B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011259902A JP5652381B2 (ja) 2011-11-29 2011-11-29 表面加工方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011259902A JP5652381B2 (ja) 2011-11-29 2011-11-29 表面加工方法及び装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006014564A Division JP5039939B2 (ja) 2006-01-24 2006-01-24 表面加工方法及び装置

Publications (3)

Publication Number Publication Date
JP2012064968A JP2012064968A (ja) 2012-03-29
JP2012064968A5 JP2012064968A5 (enrdf_load_stackoverflow) 2012-05-17
JP5652381B2 true JP5652381B2 (ja) 2015-01-14

Family

ID=46060285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011259902A Expired - Fee Related JP5652381B2 (ja) 2011-11-29 2011-11-29 表面加工方法及び装置

Country Status (1)

Country Link
JP (1) JP5652381B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200017216A (ko) * 2018-08-08 2020-02-18 주식회사 오럼머티리얼 마스크의 패턴 형성 장치 및 마스크의 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015037035A1 (ja) * 2013-09-12 2015-03-19 国立大学法人東北大学 エッチング方法
WO2015044975A1 (ja) * 2013-09-25 2015-04-02 国立大学法人東北大学 エッチング方法
JP2018049199A (ja) * 2016-09-23 2018-03-29 Hoya株式会社 局所ウェットエッチング装置及びフォトマスク用基板の製造方法
JP7505910B2 (ja) * 2020-04-28 2024-06-25 株式会社ディスコ ウェットエッチング方法、及び、ウェットエッチング装置
CN113955945B (zh) * 2021-10-20 2022-06-28 清华大学 液滴附壁化学加工的石英玻璃回转体工件的表面修饰方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319339A (ja) * 1989-06-16 1991-01-28 Nec Corp エッチング方法及びエッチング装置
JPH1145872A (ja) * 1997-07-25 1999-02-16 Shin Etsu Handotai Co Ltd 半導体基板の平坦化方法および平坦化装置
JP2001203184A (ja) * 2000-01-19 2001-07-27 Matsushita Electric Ind Co Ltd 加工装置及び加工方法
JP2003203897A (ja) * 2002-01-08 2003-07-18 Toshiba Corp ノズル、基板処理装置、基板処理方法、及び基板処理プログラム
JP3932099B2 (ja) * 2002-02-06 2007-06-20 セイコーエプソン株式会社 エッチング方法
US7293571B2 (en) * 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200017216A (ko) * 2018-08-08 2020-02-18 주식회사 오럼머티리얼 마스크의 패턴 형성 장치 및 마스크의 제조 방법
KR102325256B1 (ko) 2018-08-08 2021-11-11 주식회사 오럼머티리얼 마스크의 패턴 형성 장치 및 마스크의 제조 방법

Also Published As

Publication number Publication date
JP2012064968A (ja) 2012-03-29

Similar Documents

Publication Publication Date Title
JP5039939B2 (ja) 表面加工方法及び装置
JP5652381B2 (ja) 表面加工方法及び装置
JP7584819B2 (ja) プラズマエッチング装置用の電極
TWI612389B (zh) 處理基板之方法及裝置
JP6000643B2 (ja) 被加工物の加工方法と、該加工方法によって加工された光学素子、金型及び半導体基板
US8551346B2 (en) Photomask-forming glass substrate and making method
CN108369895B (zh) 单晶半导体晶片和用于生产半导体晶片的方法
JP2004518526A (ja) 損傷の無い表面の造形のための大気圧反応性原子プラズマ加工装置及び方法
JP2004518527A (ja) 表面改質のための大気圧反応性原子プラズマ加工装置及び方法
JP7481128B2 (ja) ウェーハ表面の改質装置および方法
JP6420571B2 (ja) インプリント装置、インプリント方法及び物品の製造方法
JP6075817B1 (ja) 素子製造方法
JP2011125871A (ja) レーザ加工装置
US20150160570A1 (en) Lithography apparatus and article manufacturing method
JP2003275951A (ja) 研磨方法および研磨装置
WO2011046052A1 (ja) 電極板の通気孔形成方法
TW507284B (en) Method and apparatus for polishing
JP5294816B2 (ja) 顕微鏡付吸引型局所マイクロプラズマエッチング装置及び局所マイクロプラズマエッチング方法
JP2002343772A (ja) 局所プラズマエッチング方法
JP2008186961A (ja) 位置合わせ装置、露光装置および位置合わせ方法
CN111095503B (zh) 原子层研磨方法及其研磨装置
JP5548973B2 (ja) エッチング方法及びエッチング装置
JP2019169719A (ja) レーザ加工システム
TWI862832B (zh) Euvl用玻璃基板及其製造方法、以及euvl用光罩基底及其製造方法
WO2023145431A1 (ja) 基板洗浄方法、ガラス基板の製造方法、ｅｕｖｌ用マスクブランクの製造方法、および基板洗浄装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111227

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20111228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120316

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20120502

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20120502

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130322

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130326

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130521

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140509

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140619

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20140619

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20140619

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20140805

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140826

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140929

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141021

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141103

R151 Written notification of patent or utility model registration

Ref document number: 5652381

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees