JP5648422B2 - 発光装置及びその製造方法 - Google Patents
発光装置及びその製造方法 Download PDFInfo
- Publication number
- JP5648422B2 JP5648422B2 JP2010243812A JP2010243812A JP5648422B2 JP 5648422 B2 JP5648422 B2 JP 5648422B2 JP 2010243812 A JP2010243812 A JP 2010243812A JP 2010243812 A JP2010243812 A JP 2010243812A JP 5648422 B2 JP5648422 B2 JP 5648422B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- light emitting
- emitting element
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010243812A JP5648422B2 (ja) | 2010-10-29 | 2010-10-29 | 発光装置及びその製造方法 |
| EP11186792.5A EP2448028B1 (en) | 2010-10-29 | 2011-10-26 | Light emitting apparatus and production method thereof |
| US13/283,415 US8759124B2 (en) | 2010-10-29 | 2011-10-27 | Light emitting apparatus and production method thereof |
| CN201110337731.1A CN102468410B (zh) | 2010-10-29 | 2011-10-28 | 发光装置及其制造方法 |
| US14/275,331 US9076948B2 (en) | 2010-10-29 | 2014-05-12 | Light emitting apparatus and production method thereof |
| US14/731,290 US9276181B2 (en) | 2010-10-29 | 2015-06-04 | Light emitting apparatus and production method thereof |
| US14/988,319 US10741729B2 (en) | 2010-10-29 | 2016-01-05 | Light emitting apparatus and production method thereof |
| US16/920,243 US11626543B2 (en) | 2010-10-29 | 2020-07-02 | Light emitting apparatus and production method thereof |
| US18/181,962 US11876153B2 (en) | 2010-10-29 | 2023-03-10 | Light emitting apparatus and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010243812A JP5648422B2 (ja) | 2010-10-29 | 2010-10-29 | 発光装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012099545A JP2012099545A (ja) | 2012-05-24 |
| JP2012099545A5 JP2012099545A5 (https=) | 2013-10-24 |
| JP5648422B2 true JP5648422B2 (ja) | 2015-01-07 |
Family
ID=46391158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010243812A Active JP5648422B2 (ja) | 2010-10-29 | 2010-10-29 | 発光装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5648422B2 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6089686B2 (ja) | 2012-12-25 | 2017-03-08 | 日亜化学工業株式会社 | 発光装置 |
| JP6208967B2 (ja) * | 2013-04-03 | 2017-10-04 | アピックヤマダ株式会社 | Led装置の製造方法 |
| JP2014225636A (ja) * | 2013-04-16 | 2014-12-04 | 株式会社ディスコ | 発光デバイス |
| JP6186904B2 (ja) | 2013-06-05 | 2017-08-30 | 日亜化学工業株式会社 | 発光装置 |
| JP6244784B2 (ja) * | 2013-09-30 | 2017-12-13 | 日亜化学工業株式会社 | 発光装置 |
| JP6221864B2 (ja) | 2014-03-17 | 2017-11-01 | 豊田合成株式会社 | 発光装置 |
| JP6805532B2 (ja) * | 2015-06-18 | 2020-12-23 | 日亜化学工業株式会社 | 発光装置 |
| JP6142902B2 (ja) | 2015-07-23 | 2017-06-07 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP6520663B2 (ja) * | 2015-11-27 | 2019-05-29 | 日亜化学工業株式会社 | 素子載置用基板及び発光装置 |
| US10461065B2 (en) | 2015-11-30 | 2019-10-29 | Nichia Corporation | Method of manufacturing light emitting device |
| JP6645213B2 (ja) * | 2016-01-27 | 2020-02-14 | オムロン株式会社 | 発光装置、および発光装置の製造方法 |
| JP2017135253A (ja) * | 2016-01-27 | 2017-08-03 | オムロン株式会社 | 発光装置、および発光装置の製造方法 |
| JP6414141B2 (ja) | 2016-05-31 | 2018-10-31 | 日亜化学工業株式会社 | 発光装置 |
| JP7364858B2 (ja) * | 2019-06-13 | 2023-10-19 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0617259U (ja) * | 1992-08-04 | 1994-03-04 | 株式会社小糸製作所 | モジュールタイプledのモールド構造 |
| JP2006324589A (ja) * | 2005-05-20 | 2006-11-30 | Sharp Corp | Led装置およびその製造方法 |
| US9024340B2 (en) * | 2007-11-29 | 2015-05-05 | Nichia Corporation | Light emitting apparatus and method for producing the same |
| JP5169263B2 (ja) * | 2008-02-01 | 2013-03-27 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
| JP5326705B2 (ja) * | 2009-03-17 | 2013-10-30 | 日亜化学工業株式会社 | 発光装置 |
-
2010
- 2010-10-29 JP JP2010243812A patent/JP5648422B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012099545A (ja) | 2012-05-24 |
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