JP5648422B2 - 発光装置及びその製造方法 - Google Patents

発光装置及びその製造方法 Download PDF

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Publication number
JP5648422B2
JP5648422B2 JP2010243812A JP2010243812A JP5648422B2 JP 5648422 B2 JP5648422 B2 JP 5648422B2 JP 2010243812 A JP2010243812 A JP 2010243812A JP 2010243812 A JP2010243812 A JP 2010243812A JP 5648422 B2 JP5648422 B2 JP 5648422B2
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JP
Japan
Prior art keywords
light
resin
light emitting
emitting element
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010243812A
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English (en)
Japanese (ja)
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JP2012099545A5 (enExample
JP2012099545A (ja
Inventor
智紀 三次
智紀 三次
健司 小関
健司 小関
智陽 鶴羽
智陽 鶴羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2010243812A priority Critical patent/JP5648422B2/ja
Priority to EP11186792.5A priority patent/EP2448028B1/en
Priority to US13/283,415 priority patent/US8759124B2/en
Priority to CN201110337731.1A priority patent/CN102468410B/zh
Publication of JP2012099545A publication Critical patent/JP2012099545A/ja
Publication of JP2012099545A5 publication Critical patent/JP2012099545A5/ja
Priority to US14/275,331 priority patent/US9076948B2/en
Application granted granted Critical
Publication of JP5648422B2 publication Critical patent/JP5648422B2/ja
Priority to US14/731,290 priority patent/US9276181B2/en
Priority to US14/988,319 priority patent/US10741729B2/en
Priority to US16/920,243 priority patent/US11626543B2/en
Priority to US18/181,962 priority patent/US11876153B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2010243812A 2010-10-29 2010-10-29 発光装置及びその製造方法 Active JP5648422B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2010243812A JP5648422B2 (ja) 2010-10-29 2010-10-29 発光装置及びその製造方法
EP11186792.5A EP2448028B1 (en) 2010-10-29 2011-10-26 Light emitting apparatus and production method thereof
US13/283,415 US8759124B2 (en) 2010-10-29 2011-10-27 Light emitting apparatus and production method thereof
CN201110337731.1A CN102468410B (zh) 2010-10-29 2011-10-28 发光装置及其制造方法
US14/275,331 US9076948B2 (en) 2010-10-29 2014-05-12 Light emitting apparatus and production method thereof
US14/731,290 US9276181B2 (en) 2010-10-29 2015-06-04 Light emitting apparatus and production method thereof
US14/988,319 US10741729B2 (en) 2010-10-29 2016-01-05 Light emitting apparatus and production method thereof
US16/920,243 US11626543B2 (en) 2010-10-29 2020-07-02 Light emitting apparatus and production method thereof
US18/181,962 US11876153B2 (en) 2010-10-29 2023-03-10 Light emitting apparatus and production method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010243812A JP5648422B2 (ja) 2010-10-29 2010-10-29 発光装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012099545A JP2012099545A (ja) 2012-05-24
JP2012099545A5 JP2012099545A5 (enExample) 2013-10-24
JP5648422B2 true JP5648422B2 (ja) 2015-01-07

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Family Applications (1)

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JP2010243812A Active JP5648422B2 (ja) 2010-10-29 2010-10-29 発光装置及びその製造方法

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JP (1) JP5648422B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6089686B2 (ja) 2012-12-25 2017-03-08 日亜化学工業株式会社 発光装置
JP6208967B2 (ja) * 2013-04-03 2017-10-04 アピックヤマダ株式会社 Ｌｅｄ装置の製造方法
JP2014225636A (ja) * 2013-04-16 2014-12-04 株式会社ディスコ 発光デバイス
JP6186904B2 (ja) 2013-06-05 2017-08-30 日亜化学工業株式会社 発光装置
JP6244784B2 (ja) * 2013-09-30 2017-12-13 日亜化学工業株式会社 発光装置
JP6221864B2 (ja) 2014-03-17 2017-11-01 豊田合成株式会社 発光装置
JP6805532B2 (ja) * 2015-06-18 2020-12-23 日亜化学工業株式会社 発光装置
JP6142902B2 (ja) 2015-07-23 2017-06-07 日亜化学工業株式会社 発光装置及びその製造方法
JP6520663B2 (ja) 2015-11-27 2019-05-29 日亜化学工業株式会社 素子載置用基板及び発光装置
CN114188460B (zh) 2015-11-30 2025-07-04 日亚化学工业株式会社 发光装置
JP6645213B2 (ja) * 2016-01-27 2020-02-14 オムロン株式会社 発光装置、および発光装置の製造方法
JP2017135253A (ja) * 2016-01-27 2017-08-03 オムロン株式会社 発光装置、および発光装置の製造方法
JP6414141B2 (ja) 2016-05-31 2018-10-31 日亜化学工業株式会社 発光装置
JP7364858B2 (ja) * 2019-06-13 2023-10-19 日亜化学工業株式会社 発光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617259U (ja) * 1992-08-04 1994-03-04 株式会社小糸製作所 モジュールタイプｌｅｄのモールド構造
JP2006324589A (ja) * 2005-05-20 2006-11-30 Sharp Corp Ｌｅｄ装置およびその製造方法
RU2489774C2 (ru) * 2007-11-29 2013-08-10 Нития Корпорейшн Светоизлучающее устройство и способ его изготовления
JP5169263B2 (ja) * 2008-02-01 2013-03-27 日亜化学工業株式会社 発光装置の製造方法及び発光装置
JP5326705B2 (ja) * 2009-03-17 2013-10-30 日亜化学工業株式会社 発光装置

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