JP5646824B2 - クランプアセンブリを用いて円筒状エレメントを処理する装置および方法 - Google Patents

クランプアセンブリを用いて円筒状エレメントを処理する装置および方法 Download PDF

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Publication number
JP5646824B2
JP5646824B2 JP2009128168A JP2009128168A JP5646824B2 JP 5646824 B2 JP5646824 B2 JP 5646824B2 JP 2009128168 A JP2009128168 A JP 2009128168A JP 2009128168 A JP2009128168 A JP 2009128168A JP 5646824 B2 JP5646824 B2 JP 5646824B2
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Japan
Prior art keywords
support
cylindrical
support means
photosensitive
clamping
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Expired - Fee Related
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JP2009128168A
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Japanese (ja)
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JP2009288790A5 (enExample
JP2009288790A (ja
Inventor
ロイトケ ヘルムート
ロイトケ ヘルムート
ベルナード アーノルド カール
ベルナード アーノルド カール
ジョーゼンセン セーレン
ジョーゼンセン セーレン
コッホ アンドレアス
コッホ アンドレアス
エイ.マクミレン ロバート
エイ.マクミレン ロバート
ベスタガード イブ
ベスタガード イブ
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/34Imagewise removal by selective transfer, e.g. peeling away

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Treatment Of Fiber Materials (AREA)
JP2009128168A 2008-05-27 2009-05-27 クランプアセンブリを用いて円筒状エレメントを処理する装置および方法 Expired - Fee Related JP5646824B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13000708P 2008-05-27 2008-05-27
US61/130,007 2008-05-27
US12/431,780 2009-04-29
US12/431,780 US20090297715A1 (en) 2008-05-27 2009-04-29 Apparatus and method for treating a cylindrically-shaped element having a clamp assembly

Publications (3)

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JP2009288790A JP2009288790A (ja) 2009-12-10
JP2009288790A5 JP2009288790A5 (enExample) 2012-06-28
JP5646824B2 true JP5646824B2 (ja) 2014-12-24

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JP2009128168A Expired - Fee Related JP5646824B2 (ja) 2008-05-27 2009-05-27 クランプアセンブリを用いて円筒状エレメントを処理する装置および方法

Country Status (3)

Country Link
US (1) US20090297715A1 (enExample)
EP (1) EP2128705B1 (enExample)
JP (1) JP5646824B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5020015B2 (ja) * 2007-09-28 2012-09-05 富士フイルム株式会社 液体塗布装置及びインクジェット記録装置
US9032877B2 (en) 2011-11-02 2015-05-19 E I Du Pont De Nemours And Company Method and an apparatus having a compressible collar for thermally treating a photosensitive precursor
US10836106B2 (en) * 2019-02-12 2020-11-17 Essentium, Inc. Infrared heating of additive printed part

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Also Published As

Publication number Publication date
US20090297715A1 (en) 2009-12-03
EP2128705A2 (en) 2009-12-02
JP2009288790A (ja) 2009-12-10
EP2128705B1 (en) 2016-03-02
EP2128705A3 (en) 2010-06-30

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