JP5641202B2 - インターポーザ、モジュールおよびこれを備えた電子機器 - Google Patents

インターポーザ、モジュールおよびこれを備えた電子機器 Download PDF

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Publication number
JP5641202B2
JP5641202B2 JP2010130266A JP2010130266A JP5641202B2 JP 5641202 B2 JP5641202 B2 JP 5641202B2 JP 2010130266 A JP2010130266 A JP 2010130266A JP 2010130266 A JP2010130266 A JP 2010130266A JP 5641202 B2 JP5641202 B2 JP 5641202B2
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JP
Japan
Prior art keywords
substrate
interposer
wiring
semiconductor chip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010130266A
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English (en)
Japanese (ja)
Other versions
JP2011258654A5 (enrdf_load_stackoverflow
JP2011258654A (ja
Inventor
朗 秋葉
朗 秋葉
伸也 盛田
伸也 盛田
池田　浩一
浩一 池田
俊 御手洗
俊 御手洗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2010130266A priority Critical patent/JP5641202B2/ja
Priority to US12/847,240 priority patent/US20110032685A1/en
Priority to CN201010241077XA priority patent/CN101996979B/zh
Priority to TW99125503A priority patent/TWI441307B/zh
Priority to EP20100008048 priority patent/EP2284888A3/en
Publication of JP2011258654A publication Critical patent/JP2011258654A/ja
Publication of JP2011258654A5 publication Critical patent/JP2011258654A5/ja
Application granted granted Critical
Publication of JP5641202B2 publication Critical patent/JP5641202B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Variable-Direction Aerials And Aerial Arrays (AREA)
JP2010130266A 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器 Expired - Fee Related JP5641202B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器
US12/847,240 US20110032685A1 (en) 2009-08-07 2010-07-30 Interposer, module, and electronics device including the same
CN201010241077XA CN101996979B (zh) 2009-08-07 2010-07-30 中介层、包括该中介层的模块及电子装置
TW99125503A TWI441307B (zh) 2009-08-07 2010-07-30 內插器、模組及包括該內插器之電子裝置
EP20100008048 EP2284888A3 (en) 2009-08-07 2010-08-02 Interposer, module and electronics device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Publications (3)

Publication Number Publication Date
JP2011258654A JP2011258654A (ja) 2011-12-22
JP2011258654A5 JP2011258654A5 (enrdf_load_stackoverflow) 2013-07-11
JP5641202B2 true JP5641202B2 (ja) 2014-12-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010130266A Expired - Fee Related JP5641202B2 (ja) 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Country Status (1)

Country Link
JP (1) JP5641202B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6434494B2 (ja) * 2014-03-10 2018-12-05 三菱重工業株式会社 マルチチップモジュール、オンボードコンピュータ、センサインターフェース基板、及びマルチチップモジュール製造方法
WO2018057026A1 (en) 2016-09-26 2018-03-29 Nair Vijay K Die with embedded communication cavity
JP7367381B2 (ja) * 2019-08-20 2023-10-24 富士通株式会社 パッケージ基板及び電子機器
CN115298813A (zh) * 2020-03-31 2022-11-04 索尼半导体解决方案公司 半导体装置
US20240145901A1 (en) * 2021-03-11 2024-05-02 Sony Semiconductor Solutions Corporation Semiconductor device and electronic device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106956A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体装置及びその製造方法
JP2002374028A (ja) * 2001-06-15 2002-12-26 Kyocera Corp 配線基板
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法
JP4979213B2 (ja) * 2005-08-31 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 回路基板、回路基板の製造方法および回路装置

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Publication number Publication date
JP2011258654A (ja) 2011-12-22

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