JP2011258654A5 - - Google Patents

Download PDF

Info

Publication number
JP2011258654A5
JP2011258654A5 JP2010130266A JP2010130266A JP2011258654A5 JP 2011258654 A5 JP2011258654 A5 JP 2011258654A5 JP 2010130266 A JP2010130266 A JP 2010130266A JP 2010130266 A JP2010130266 A JP 2010130266A JP 2011258654 A5 JP2011258654 A5 JP 2011258654A5
Authority
JP
Japan
Prior art keywords
substrate
module
interposer
semiconductor chip
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010130266A
Other languages
English (en)
Japanese (ja)
Other versions
JP5641202B2 (ja
JP2011258654A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010130266A external-priority patent/JP5641202B2/ja
Priority to JP2010130266A priority Critical patent/JP5641202B2/ja
Priority to US12/847,240 priority patent/US20110032685A1/en
Priority to CN201010241077XA priority patent/CN101996979B/zh
Priority to TW99125503A priority patent/TWI441307B/zh
Priority to EP20100008048 priority patent/EP2284888A3/en
Publication of JP2011258654A publication Critical patent/JP2011258654A/ja
Publication of JP2011258654A5 publication Critical patent/JP2011258654A5/ja
Publication of JP5641202B2 publication Critical patent/JP5641202B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010130266A 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器 Expired - Fee Related JP5641202B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器
US12/847,240 US20110032685A1 (en) 2009-08-07 2010-07-30 Interposer, module, and electronics device including the same
CN201010241077XA CN101996979B (zh) 2009-08-07 2010-07-30 中介层、包括该中介层的模块及电子装置
TW99125503A TWI441307B (zh) 2009-08-07 2010-07-30 內插器、模組及包括該內插器之電子裝置
EP20100008048 EP2284888A3 (en) 2009-08-07 2010-08-02 Interposer, module and electronics device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Publications (3)

Publication Number Publication Date
JP2011258654A JP2011258654A (ja) 2011-12-22
JP2011258654A5 true JP2011258654A5 (enrdf_load_stackoverflow) 2013-07-11
JP5641202B2 JP5641202B2 (ja) 2014-12-17

Family

ID=45474558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010130266A Expired - Fee Related JP5641202B2 (ja) 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Country Status (1)

Country Link
JP (1) JP5641202B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6434494B2 (ja) * 2014-03-10 2018-12-05 三菱重工業株式会社 マルチチップモジュール、オンボードコンピュータ、センサインターフェース基板、及びマルチチップモジュール製造方法
WO2018057026A1 (en) 2016-09-26 2018-03-29 Nair Vijay K Die with embedded communication cavity
JP7367381B2 (ja) * 2019-08-20 2023-10-24 富士通株式会社 パッケージ基板及び電子機器
CN115298813A (zh) * 2020-03-31 2022-11-04 索尼半导体解决方案公司 半导体装置
US20240145901A1 (en) * 2021-03-11 2024-05-02 Sony Semiconductor Solutions Corporation Semiconductor device and electronic device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106956A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体装置及びその製造方法
JP2002374028A (ja) * 2001-06-15 2002-12-26 Kyocera Corp 配線基板
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法
JP4979213B2 (ja) * 2005-08-31 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 回路基板、回路基板の製造方法および回路装置

Similar Documents

Publication Publication Date Title
TWI707408B (zh) 天線整合式封裝結構及其製造方法
US20230299462A1 (en) Semiconductor package including antenna substrate and manufacturing method thereof
KR101434003B1 (ko) 반도체 패키지 및 그 제조 방법
JP5521862B2 (ja) 半導体装置の製造方法
US6261868B1 (en) Semiconductor component and method for manufacturing the semiconductor component
CN205725676U (zh) 晶圆级封装装置
CN107968084A (zh) 具有集成天线的半导体封装及其形成方法
CN1802746A (zh) 高频电子器件的封装
TW200945546A (en) Semiconductor device
US20210066265A1 (en) Tunable capacitor arrangements in integrated circuit package substrates
JP2011258654A5 (enrdf_load_stackoverflow)
US9799626B2 (en) Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers
US11621192B2 (en) Inorganic dies with organic interconnect layers and related structures
EP4205233A1 (en) Device, package and/or substrate comprising curved antenna
US10790332B2 (en) Techniques for integrating three-dimensional islands for radio frequency (RF) circuits
JP2012049224A (ja) 実装構造体および実装構造体の製造方法
CN103681627B (zh) 射频装置封装及其制造方法
JP5709352B2 (ja) 背面多層信号ルーティングを有するｍｍｉｃ
TW201104793A (en) Semiconductor device and method of forming inductor over insulating material filled trench in substrate
US10868573B2 (en) Antenna integrated amplifier and transmitter
JP2005110017A (ja) 高周波フィルタモジュール及びその製造方法
JP2010034212A (ja) 高周波セラミックパッケージおよびその作製方法
TWI575679B (zh) 功率模組及其製造方法
US20120261816A1 (en) Device package substrate and method of manufacturing the same
US10840883B2 (en) Inductively-coupled MEMS resonators