JP5639059B2 - 非接触型操作装置および方法 - Google Patents
非接触型操作装置および方法 Download PDFInfo
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- JP5639059B2 JP5639059B2 JP2011524990A JP2011524990A JP5639059B2 JP 5639059 B2 JP5639059 B2 JP 5639059B2 JP 2011524990 A JP2011524990 A JP 2011524990A JP 2011524990 A JP2011524990 A JP 2011524990A JP 5639059 B2 JP5639059 B2 JP 5639059B2
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- fluid
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- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
110 物品
120、220 流体分配部材
121 中心軸
122、222 第1の流体ポート
140、240 第2の流体ポート
150 コントローラ
160、260 支持アーム
170、270 第1の流体チャネル
176 位置決め部材
180b〜180d 第2の流体チャネル
190a〜190d 第3の流体チャネル
195、295 係止装置
Claims (5)
- 非接触型操作装置(100)であって、
前記操作装置によって操作される物品と流体分配部材(120)との間の間隙を維持しつつ前記物品を引き付けるために、流体を供給してベルヌーイ効果を生じるよう構成された第1の流体ポート(122)と、前記間隙の維持を補助するために流体を供給するよう構成された第2の流体ポートとを有する前記流体分配部材(120)と、
前記間隙の維持を補助するために、前記物品が前記非接触型操作装置に近づくと、(a)前記近づいてくる物品が、前記非接触型操作装置からの第1の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを増加させること、および(b)前記近づいてくる物品が、前記非接触型操作装置からの前記第1の所定の距離より小さい第2の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを減少させることの少なくとも一方を行うことにより、少なくとも前記第2の流体ポートを通る流体の流れを制御するよう構成されたコントローラと、
を備え、
前記第1の流体ポートが、(i)前記流体分配部材(120)の中心軸に沿って配設されるか、または(ii)前記流体分配部材(120)の中心軸から径方向に配設され、
前記第2の流体ポートが、(i)前記中心軸の周りに延在する複数の流体ポートのリング、または(ii)前記中心軸の周りに延在する多孔質材料のリングで構成されることを特徴とする非接触型操作装置。 - 第1の流体チャネルおよび第2の流体チャネルを有する支持アームと、
前記支持アームに枢動可能に接続された流体分配部材と、
前記流体分配部材を前記支持アームに対する所望の角度位置に選択的に枢動可能に係止する係止装置であって、前記第2の流体チャネルによって動力を与えられる係止装置とを備えた非接触型操作装置であって、
前記流体分配部材は、前記第1の流体チャネルと連通した第1の流体ポートを備え、該第1の流体ポートは、前記操作装置によって操作される物品と前記流体分配部材との間の間隙を維持しつつ前記物品を引き付けるために、流体を供給することによってベルヌーイ効果を生じるよう構成されており、
前記第2の流体チャネル内の負圧が前記係止装置に前記支持アームに対する前記流体分配部材の自由な枢動の解除を可能にさせ、前記第2の流体チャネル内の正圧が前記係止装置に前記支持アームに対して前記流体分配材を所望の角度位置で係止させるように、前記係止装置が前記第2の流体チャンネルによって動力を与えられることを特徴とする非接触型操作装置。 - 物品を操作する方法であって、
第1の流体ポートおよび第2の流体ポートを有する流体分配部材を備えた非接触型操作装置を設ける工程と、
前記操作装置によって操作される物品と前記流体分配部材との間の間隙を維持しつつ前記物品を引き付けるために、前記第1の流体ポートを通して流体を供給することによってベルヌーイ効果を生じる工程と、
前記間隙の維持または変更を補助するために、前記物品が前記非接触型操作装置に近づくと、(a)前記近づいてくる物品が、前記非接触型操作装置からの第1の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを増加させること、および(b)前記近づいてくる物品が、前記非接触型操作装置からの前記第1の所定の距離より小さい第2の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを減少させることの少なくとも一方を行うことにより、少なくとも前記第2の流体ポートを通る流体の流れを修正する工程と、
を備えることを特徴とする方法。 - 前記間隙の維持を補助するために、前記第1および第2の流体ポートを通る前記流体の流れの同時の調節を行いながら、前記物品を移動させるために前記非接触型操作装置を移動する工程を更に備えることを特徴とする請求項3記載の方法。
- 前記間隙の維持を補助するために流体を供給するよう構成された第2の流体ポートを有する前記流体分配部材(120)と、
前記間隙の維持を補助するために、前記物品が前記非接触型操作装置に近づくと、(a)前記近づいてくる物品が、前記非接触型操作装置からの第1の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを増加させること、および(b)前記近づいてくる物品が、前記非接触型操作装置からの前記第1の所定の距離より小さい第2の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを減少させることの少なくとも一方を行うことにより、少なくとも前記第2の流体ポートを通る流体の流れを制御するよう構成されたコントローラと、
を更に備えることを特徴とする請求項2記載の非接触型操作装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/200,710 | 2008-08-28 | ||
US12/200,710 US8231157B2 (en) | 2008-08-28 | 2008-08-28 | Non-contact manipulating devices and methods |
PCT/US2009/004845 WO2010024888A2 (en) | 2008-08-28 | 2009-08-26 | Non-contact manipulating devices and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012501284A JP2012501284A (ja) | 2012-01-19 |
JP5639059B2 true JP5639059B2 (ja) | 2014-12-10 |
Family
ID=41722178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011524990A Expired - Fee Related JP5639059B2 (ja) | 2008-08-28 | 2009-08-26 | 非接触型操作装置および方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8231157B2 (ja) |
JP (1) | JP5639059B2 (ja) |
KR (2) | KR101483406B1 (ja) |
CN (1) | CN102132394B (ja) |
TW (1) | TWI376300B (ja) |
WO (1) | WO2010024888A2 (ja) |
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-
2008
- 2008-08-28 US US12/200,710 patent/US8231157B2/en not_active Expired - Fee Related
-
2009
- 2009-08-26 CN CN200980133609.3A patent/CN102132394B/zh not_active Expired - Fee Related
- 2009-08-26 KR KR1020147018880A patent/KR101483406B1/ko active IP Right Grant
- 2009-08-26 JP JP2011524990A patent/JP5639059B2/ja not_active Expired - Fee Related
- 2009-08-26 TW TW098128744A patent/TWI376300B/zh not_active IP Right Cessation
- 2009-08-26 KR KR1020117006836A patent/KR101508033B1/ko active IP Right Grant
- 2009-08-26 WO PCT/US2009/004845 patent/WO2010024888A2/en active Application Filing
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Also Published As
Publication number | Publication date |
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KR101483406B1 (ko) | 2015-01-16 |
TW201026458A (en) | 2010-07-16 |
JP2012501284A (ja) | 2012-01-19 |
KR20140092937A (ko) | 2014-07-24 |
US8590953B2 (en) | 2013-11-26 |
CN102132394A (zh) | 2011-07-20 |
TWI376300B (en) | 2012-11-11 |
KR20110055691A (ko) | 2011-05-25 |
US20120201645A1 (en) | 2012-08-09 |
WO2010024888A3 (en) | 2010-05-20 |
WO2010024888A2 (en) | 2010-03-04 |
US8231157B2 (en) | 2012-07-31 |
KR101508033B1 (ko) | 2015-04-07 |
CN102132394B (zh) | 2014-04-23 |
US20100052345A1 (en) | 2010-03-04 |
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