JP2012501284A - 非接触型操作装置および方法 - Google Patents
非接触型操作装置および方法 Download PDFInfo
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- JP2012501284A JP2012501284A JP2011524990A JP2011524990A JP2012501284A JP 2012501284 A JP2012501284 A JP 2012501284A JP 2011524990 A JP2011524990 A JP 2011524990A JP 2011524990 A JP2011524990 A JP 2011524990A JP 2012501284 A JP2012501284 A JP 2012501284A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
110 物品
120、220 流体分配部材
121 中心軸
122、222 第1の流体ポート
140、240 第2の流体ポート
150 コントローラ
160、260 支持アーム
170、270 第1の流体チャネル
176 位置決め部材
180b〜180d 第2の流体チャネル
190a〜190d 第3の流体チャネル
195、295 係止装置
Claims (5)
- 非接触型操作装置(100)であって、
前記操作装置によって操作される物品と流体分配部材(120)との間の間隙を維持しつつ前記物品を引き付けるために、流体を供給してベルヌーイ効果を生じるよう構成された第1の流体ポート(122)と、前記間隙の維持を補助するために流体を供給するよう構成された第2の流体ポートとを有する前記流体分配部材(120)と、
前記間隙の維持を補助するために、少なくとも前記第2の流体ポートを通る流体の流れを制御するよう構成されたコントローラと、
を備え、
前記第1の流体ポートが、(i)前記流体分配部材(120)の中心軸に沿って配設されるか、または(ii)前記流体分配部材(120)の中心軸から径方向に配設され、
前記第2の流体ポートが、(i)前記中心軸の周りに延在する複数の流体ポートのリング、または(ii)前記中心軸の周りに延在する多孔質材料のリングで構成される
ことを特徴とする非接触型操作装置。 - 第1の流体チャネルおよび第2の流体チャネルを有する支持アームと、
前記支持アームに枢動可能に接続された流体分配部材と、
前記流体分配部材を前記支持アームに対する所望の角度位置に選択的に枢動可能に係止する係止装置であって、前記第2の流体チャネルによって動力を与えられる係止装置と
を備えた非接触型操作装置であって、
前記流体分配部材は、前記第1の流体チャネルと連通した第1の流体ポートを備え、該第1の流体ポートは、前記操作装置によって操作される物品と前記流体分配部材との間の間隙を維持しつつ前記物品を引き付けるために、流体を供給することによってベルヌーイ効果を生じるよう構成される
ことを特徴とする非接触型操作装置。 - 物品を操作する方法であって、
第1の流体ポートおよび第2の流体ポートを有する流体分配部材を備えた非接触型操作装置を設ける工程と、
前記操作装置によって操作される物品と前記流体分配部材との間の間隙を維持しつつ前記物品を引き付けるために、前記第1の流体ポートを通して流体を供給することによってベルヌーイ効果を生じる工程と、
前記間隙の維持または変更を補助するために、少なくとも前記第2の流体ポートを通る流体の流れを修正する工程と、
を備えることを特徴とする方法。 - 前記物品が前記非接触型操作装置に近づくと、(a)前記近づいてくる物品が、前記非接触型操作装置からの第1の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを増加させること、および(b)前記近づいてくる物品が、前記非接触型操作装置からの前記第1の所定の距離より小さい第2の所定の距離以内にあるとき、前記第2の流体ポートを通る前記流体の流れを減少させることの少なくとも一方を行うことにより、(i)前記第1の流体ポートおよび(ii)前記第2の流体ポートの少なくとも一方を通る前記流体の流れを修正する工程
を更に備えることを特徴とする請求項3記載の方法。 - (i)(a)前記間隙の維持を補助するために、前記第1の流体ポートを通る前記流体の流れを同時に調節すること、および(b)前記間隙の維持を補助するために、前記第2の流体ポートを通る前記流体の流れを同時に調節することの少なくとも一方を行いながら、前記物品を移動させるために前記非接触型操作装置を加速する工程と、
(ii)前記間隙の維持を補助するために、前記第2の流体ポートを通る前記流体の流れを同時に調節しながら、所望の位置において前記物品を移動させることを止めるために前記非接触型操作装置を減速する工程と
の少なくとも一方を更に備えることを特徴とする請求項3記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/200,710 | 2008-08-28 | ||
US12/200,710 US8231157B2 (en) | 2008-08-28 | 2008-08-28 | Non-contact manipulating devices and methods |
PCT/US2009/004845 WO2010024888A2 (en) | 2008-08-28 | 2009-08-26 | Non-contact manipulating devices and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012501284A true JP2012501284A (ja) | 2012-01-19 |
JP5639059B2 JP5639059B2 (ja) | 2014-12-10 |
Family
ID=41722178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011524990A Expired - Fee Related JP5639059B2 (ja) | 2008-08-28 | 2009-08-26 | 非接触型操作装置および方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8231157B2 (ja) |
JP (1) | JP5639059B2 (ja) |
KR (2) | KR101508033B1 (ja) |
CN (1) | CN102132394B (ja) |
TW (1) | TWI376300B (ja) |
WO (1) | WO2010024888A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014165217A (ja) * | 2013-02-21 | 2014-09-08 | Tokyo Electron Ltd | 基板搬送装置および剥離システム |
JP2017085177A (ja) * | 2017-02-10 | 2017-05-18 | 東京エレクトロン株式会社 | 基板搬送装置および剥離システム |
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KR100859835B1 (ko) * | 2008-05-13 | 2008-09-23 | 한국뉴매틱(주) | 비접촉식 진공패드 |
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JP5877954B2 (ja) * | 2011-03-07 | 2016-03-08 | 株式会社ゼビオス | 非接触浮上搬送機能を有する基板処理装置 |
JP2013030654A (ja) * | 2011-07-29 | 2013-02-07 | Kimihiro Eguchi | 基板保持機構、半導体基板の分離処理装置および半導体基板の分離方法 |
KR101190809B1 (ko) | 2011-08-12 | 2012-10-12 | 이성일 | 정밀한 노즐 갭 유지가 가능한 비접촉 진공패드 |
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JP6489471B2 (ja) * | 2014-11-27 | 2019-03-27 | パナソニックIpマネジメント株式会社 | 吸着加熱ヘッド |
JP6468848B2 (ja) * | 2015-01-13 | 2019-02-13 | 株式会社ディスコ | 搬送装置 |
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-
2008
- 2008-08-28 US US12/200,710 patent/US8231157B2/en not_active Expired - Fee Related
-
2009
- 2009-08-26 CN CN200980133609.3A patent/CN102132394B/zh not_active Expired - Fee Related
- 2009-08-26 JP JP2011524990A patent/JP5639059B2/ja not_active Expired - Fee Related
- 2009-08-26 WO PCT/US2009/004845 patent/WO2010024888A2/en active Application Filing
- 2009-08-26 KR KR1020117006836A patent/KR101508033B1/ko active IP Right Grant
- 2009-08-26 TW TW098128744A patent/TWI376300B/zh not_active IP Right Cessation
- 2009-08-26 KR KR1020147018880A patent/KR101483406B1/ko active IP Right Grant
-
2012
- 2012-04-16 US US13/447,802 patent/US8590953B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002043400A (ja) * | 2000-07-24 | 2002-02-08 | Hiroshi Akashi | 回転支持装置 |
JP2002280439A (ja) * | 2001-03-15 | 2002-09-27 | Hiroshi Akashi | 搬送装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014165217A (ja) * | 2013-02-21 | 2014-09-08 | Tokyo Electron Ltd | 基板搬送装置および剥離システム |
US9679798B2 (en) | 2013-02-21 | 2017-06-13 | Tokyo Electron Limited | Substrate conveyance apparatus and substrate peeling system |
JP2017085177A (ja) * | 2017-02-10 | 2017-05-18 | 東京エレクトロン株式会社 | 基板搬送装置および剥離システム |
Also Published As
Publication number | Publication date |
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US8231157B2 (en) | 2012-07-31 |
TWI376300B (en) | 2012-11-11 |
CN102132394A (zh) | 2011-07-20 |
WO2010024888A3 (en) | 2010-05-20 |
US8590953B2 (en) | 2013-11-26 |
KR101483406B1 (ko) | 2015-01-16 |
KR101508033B1 (ko) | 2015-04-07 |
TW201026458A (en) | 2010-07-16 |
CN102132394B (zh) | 2014-04-23 |
US20120201645A1 (en) | 2012-08-09 |
WO2010024888A2 (en) | 2010-03-04 |
US20100052345A1 (en) | 2010-03-04 |
KR20140092937A (ko) | 2014-07-24 |
KR20110055691A (ko) | 2011-05-25 |
JP5639059B2 (ja) | 2014-12-10 |
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