JP5637974B2 - 基板洗浄装置及び基板洗浄方法 - Google Patents

基板洗浄装置及び基板洗浄方法 Download PDF

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Publication number
JP5637974B2
JP5637974B2 JP2011259432A JP2011259432A JP5637974B2 JP 5637974 B2 JP5637974 B2 JP 5637974B2 JP 2011259432 A JP2011259432 A JP 2011259432A JP 2011259432 A JP2011259432 A JP 2011259432A JP 5637974 B2 JP5637974 B2 JP 5637974B2
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Japan
Prior art keywords
cleaning
substrate
unit
back surface
holding
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Active
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JP2011259432A
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English (en)
Japanese (ja)
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JP2013115207A (ja
Inventor
福田　昌弘
昌弘 福田
明広 久保
明広 久保
昭浩 藤本
昭浩 藤本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011259432A priority Critical patent/JP5637974B2/ja
Priority to KR1020120135225A priority patent/KR101831784B1/ko
Publication of JP2013115207A publication Critical patent/JP2013115207A/ja
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Publication of JP5637974B2 publication Critical patent/JP5637974B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2011259432A 2011-11-28 2011-11-28 基板洗浄装置及び基板洗浄方法 Active JP5637974B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011259432A JP5637974B2 (ja) 2011-11-28 2011-11-28 基板洗浄装置及び基板洗浄方法
KR1020120135225A KR101831784B1 (ko) 2011-11-28 2012-11-27 기판 세정 장치 및 기판 세정 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011259432A JP5637974B2 (ja) 2011-11-28 2011-11-28 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
JP2013115207A JP2013115207A (ja) 2013-06-10
JP5637974B2 true JP5637974B2 (ja) 2014-12-10

Family

ID=48710485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011259432A Active JP5637974B2 (ja) 2011-11-28 2011-11-28 基板洗浄装置及び基板洗浄方法

Country Status (2)

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JP (1) JP5637974B2 (ko)
KR (1) KR101831784B1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101423666B1 (ko) * 2014-04-21 2014-07-25 (주)슈퍼세미콘 진공세정롤러
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
JP2021052166A (ja) 2019-09-17 2021-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
WO2021053995A1 (ja) * 2019-09-17 2021-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置
JP7336967B2 (ja) * 2019-11-21 2023-09-01 東京エレクトロン株式会社 基板処理装置、および基板処理方法
JP2023019211A (ja) * 2021-07-28 2023-02-09 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN117497401A (zh) * 2024-01-02 2024-02-02 宁波润华全芯微电子设备有限公司 一种晶圆背面清洗方法和装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536831U (ja) * 1991-10-14 1993-05-18 株式会社エンヤシステム ウエーハ洗浄装置
JPH10294261A (ja) * 1997-04-18 1998-11-04 Sony Corp レジスト塗布装置
JP2005044874A (ja) * 2003-07-24 2005-02-17 Okamoto Machine Tool Works Ltd 基板およびチャック兼用洗浄装置
JP4983565B2 (ja) * 2006-12-20 2012-07-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP5050945B2 (ja) * 2008-03-13 2012-10-17 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
JP5064331B2 (ja) * 2008-08-11 2012-10-31 東京エレクトロン株式会社 洗浄ブラシ、基板洗浄装置及び基板洗浄方法

Also Published As

Publication number Publication date
JP2013115207A (ja) 2013-06-10
KR101831784B1 (ko) 2018-02-23
KR20130059294A (ko) 2013-06-05

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