JP5636188B2 - 導体および半導体の製造方法 - Google Patents
導体および半導体の製造方法 Download PDFInfo
- Publication number
- JP5636188B2 JP5636188B2 JP2009520002A JP2009520002A JP5636188B2 JP 5636188 B2 JP5636188 B2 JP 5636188B2 JP 2009520002 A JP2009520002 A JP 2009520002A JP 2009520002 A JP2009520002 A JP 2009520002A JP 5636188 B2 JP5636188 B2 JP 5636188B2
- Authority
- JP
- Japan
- Prior art keywords
- sintering
- sintering method
- voltage
- nanoparticles
- powder material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2203/00—Controlling
- B22F2203/11—Controlling temperature, temperature profile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/8184—Sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83214406P | 2006-07-21 | 2006-07-21 | |
US60/832,144 | 2006-07-21 | ||
PCT/FI2007/050416 WO2008009779A1 (en) | 2006-07-21 | 2007-07-05 | Method for manufacturing conductors and semiconductors |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013166793A Division JP2014040661A (ja) | 2006-07-21 | 2013-08-09 | 導体および半導体の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009544838A JP2009544838A (ja) | 2009-12-17 |
JP2009544838A5 JP2009544838A5 (de) | 2014-10-23 |
JP5636188B2 true JP5636188B2 (ja) | 2014-12-03 |
Family
ID=38956584
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009520002A Expired - Fee Related JP5636188B2 (ja) | 2006-07-21 | 2007-07-05 | 導体および半導体の製造方法 |
JP2013166793A Pending JP2014040661A (ja) | 2006-07-21 | 2013-08-09 | 導体および半導体の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013166793A Pending JP2014040661A (ja) | 2006-07-21 | 2013-08-09 | 導体および半導体の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9011762B2 (de) |
EP (1) | EP2050319A4 (de) |
JP (2) | JP5636188B2 (de) |
CN (1) | CN101518164B (de) |
WO (1) | WO2008009779A1 (de) |
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US8283724B2 (en) * | 2007-02-26 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device, and method for manufacturing the same |
FI122011B (fi) | 2007-06-08 | 2011-07-15 | Teknologian Tutkimuskeskus Vtt | Menetelmä elektroniikkamoduulin tuottamiseksi, välituote elektroniikkamoduulin valmistamiseksi, muistielementti, painettu elektroniikkatuote, anturilaite sekä RFID-tunniste |
FI122644B (fi) | 2007-06-08 | 2012-04-30 | Teknologian Tutkimuskeskus Vtt | Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen |
FI122009B (fi) * | 2007-06-08 | 2011-07-15 | Teknologian Tutkimuskeskus Vtt | Nanopartikkeleihin perustuvat rakenteet ja menetelmä niiden valmistamiseksi |
FI122014B (fi) * | 2007-06-08 | 2011-07-15 | Teknologian Tutkimuskeskus Vtt | Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi |
EP2411560A1 (de) * | 2009-03-24 | 2012-02-01 | Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd. | Verfahren zum sintern von nanopartikeln bei niedrigen temperaturen |
NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
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FI20096341A0 (fi) * | 2009-12-16 | 2009-12-16 | Valtion Teknillinen | Ohjelmoitavissa oleva tulostettu sähköinen koodi, menetelmä sen valmistamiseksi sekä ohjelmointilaite |
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WO2012085084A2 (en) * | 2010-12-21 | 2012-06-28 | Condalign As | Method for forming conductive structures in a solar cell |
US9920207B2 (en) | 2012-06-22 | 2018-03-20 | C3Nano Inc. | Metal nanostructured networks and transparent conductive material |
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WO2004103043A1 (ja) | 2003-05-16 | 2004-11-25 | Harima Chemicals, Inc. | 銅微粒子焼結体型の微細形状導電体の形成方法、該方法を応用した銅微細配線ならびに銅薄膜の形成方法 |
CN100488339C (zh) * | 2003-05-16 | 2009-05-13 | 播磨化成株式会社 | 形成微细铜颗粒烧结产物类的微细形状导电体的方法 |
WO2005025787A1 (ja) | 2003-09-12 | 2005-03-24 | National Institute Of Advanced Industrial Science And Technology | 微細な液滴の形状で噴射し、積層塗布可能な金属ナノ粒子分散液 |
JP4157468B2 (ja) * | 2003-12-12 | 2008-10-01 | 日立電線株式会社 | 配線基板 |
JP4909740B2 (ja) | 2003-12-18 | 2012-04-04 | ダイソル・リミテッド | ナノ微粒子層の電解工学のための方法 |
US20050136638A1 (en) | 2003-12-18 | 2005-06-23 | 3M Innovative Properties Company | Low temperature sintering nanoparticle compositions |
DE102004020497B8 (de) * | 2004-04-26 | 2006-06-14 | Infineon Technologies Ag | Verfahren zur Herstellung von Durchkontaktierungen und Halbleiterbauteil mit derartigen Durchkontaktierungen |
EP1780732B1 (de) | 2004-06-23 | 2009-04-01 | Harima Chemicals, Inc. | Leitfähige metallpaste |
JP4496026B2 (ja) | 2004-07-09 | 2010-07-07 | ハリマ化成株式会社 | 金属銅微粒子の製造方法 |
JP4535797B2 (ja) | 2004-07-21 | 2010-09-01 | ハリマ化成株式会社 | 金属微粒子焼結体型の薄膜導電体層の形成方法、該方法を応用した金属配線ならびに金属薄膜の形成方法 |
JP4325523B2 (ja) * | 2004-09-28 | 2009-09-02 | パナソニック株式会社 | 配線基板とそれを用いた電子機器およびその製造方法 |
WO2006076603A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
JP5753338B2 (ja) | 2005-07-01 | 2015-07-22 | ナショナル ユニヴァーシティー オブ シンガポール | 導電性複合材料 |
-
2007
- 2007-07-05 WO PCT/FI2007/050416 patent/WO2008009779A1/en active Application Filing
- 2007-07-05 JP JP2009520002A patent/JP5636188B2/ja not_active Expired - Fee Related
- 2007-07-05 EP EP07788791A patent/EP2050319A4/de not_active Withdrawn
- 2007-07-05 US US12/374,179 patent/US9011762B2/en not_active Expired - Fee Related
- 2007-07-05 CN CN200780034311.8A patent/CN101518164B/zh not_active Expired - Fee Related
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2013
- 2013-08-09 JP JP2013166793A patent/JP2014040661A/ja active Pending
Also Published As
Publication number | Publication date |
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EP2050319A4 (de) | 2010-12-08 |
CN101518164A (zh) | 2009-08-26 |
EP2050319A1 (de) | 2009-04-22 |
CN101518164B (zh) | 2014-11-12 |
JP2014040661A (ja) | 2014-03-06 |
WO2008009779A1 (en) | 2008-01-24 |
JP2009544838A (ja) | 2009-12-17 |
US9011762B2 (en) | 2015-04-21 |
US20090301769A1 (en) | 2009-12-10 |
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