JP5624368B2 - 積層体 - Google Patents
積層体 Download PDFInfo
- Publication number
- JP5624368B2 JP5624368B2 JP2010126332A JP2010126332A JP5624368B2 JP 5624368 B2 JP5624368 B2 JP 5624368B2 JP 2010126332 A JP2010126332 A JP 2010126332A JP 2010126332 A JP2010126332 A JP 2010126332A JP 5624368 B2 JP5624368 B2 JP 5624368B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- aromatic
- polyimide
- laminate
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010126332A JP5624368B2 (ja) | 2010-06-01 | 2010-06-01 | 積層体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010126332A JP5624368B2 (ja) | 2010-06-01 | 2010-06-01 | 積層体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011251450A JP2011251450A (ja) | 2011-12-15 |
| JP2011251450A5 JP2011251450A5 (https=) | 2013-07-18 |
| JP5624368B2 true JP5624368B2 (ja) | 2014-11-12 |
Family
ID=45415799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010126332A Expired - Fee Related JP5624368B2 (ja) | 2010-06-01 | 2010-06-01 | 積層体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5624368B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014105890A1 (en) * | 2012-12-26 | 2014-07-03 | Akron Polymer Systems, Inc. | Aromatic polyamide films for solvent resistant flexible substrates |
| EP2916628A1 (en) * | 2014-03-07 | 2015-09-09 | Taiflex Scientific Co., Ltd. | Cover layer with high thermal resistance and high reflectivity for a printed circuit board |
| US20150257296A1 (en) * | 2014-03-07 | 2015-09-10 | Taiflex Scientific Co., Ltd. | Cover layer with high thermal resistance and high reflectivity for a printed circuit board |
| KR102109787B1 (ko) * | 2016-12-27 | 2020-05-12 | 주식회사 엘지화학 | 플라스틱 적층 필름 |
| JP7164945B2 (ja) | 2017-11-14 | 2022-11-02 | ニチハ株式会社 | 補修用シール、補修用シールの製造方法及び補修構造 |
| TWI671571B (zh) * | 2018-03-27 | 2019-09-11 | 同泰電子科技股份有限公司 | 用於背光模組的封裝結構 |
| CN110845846B (zh) * | 2019-11-06 | 2021-08-17 | 无锡顺铉新材料有限公司 | 一种白色聚酰亚胺复合薄膜及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003084110A (ja) * | 2000-12-14 | 2003-03-19 | Mitsui Chemicals Inc | 反射体、サイドライド型バックライト型装置および反射体基板 |
| KR100825526B1 (ko) * | 2003-05-21 | 2008-04-25 | 히다치 가세고교 가부시끼가이샤 | 프라이머, 수지 부착 도체박, 적층판 및 적층판의 제조방법 |
| JP4704011B2 (ja) * | 2004-11-04 | 2011-06-15 | 株式会社ピーアイ技術研究所 | 金属複合フィルム |
| JP5343562B2 (ja) * | 2006-07-31 | 2013-11-13 | 日立化成株式会社 | 耐熱性樹脂ペースト |
| JP2008168439A (ja) * | 2007-01-09 | 2008-07-24 | Toyobo Co Ltd | 金属白色ポリイミド積層体とその製造方法 |
| US8042976B2 (en) * | 2007-11-30 | 2011-10-25 | Taiyo Holdings Co., Ltd. | White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device |
| JP2009263404A (ja) * | 2008-04-22 | 2009-11-12 | Toray Ind Inc | ペースト組成物およびそれを用いた樹脂組成物 |
| US9339992B2 (en) * | 2009-03-31 | 2016-05-17 | Mitsui Chemicals, Inc. | Low-thermal-expansion block polyimide, precursor thereof, and use thereof |
-
2010
- 2010-06-01 JP JP2010126332A patent/JP5624368B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011251450A (ja) | 2011-12-15 |
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