JP2011251450A5 - - Google Patents

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Publication number
JP2011251450A5
JP2011251450A5 JP2010126332A JP2010126332A JP2011251450A5 JP 2011251450 A5 JP2011251450 A5 JP 2011251450A5 JP 2010126332 A JP2010126332 A JP 2010126332A JP 2010126332 A JP2010126332 A JP 2010126332A JP 2011251450 A5 JP2011251450 A5 JP 2011251450A5
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JP
Japan
Prior art keywords
laminate
circuit board
printed circuit
copper foil
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010126332A
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English (en)
Japanese (ja)
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JP2011251450A (ja
JP5624368B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010126332A priority Critical patent/JP5624368B2/ja
Priority claimed from JP2010126332A external-priority patent/JP5624368B2/ja
Publication of JP2011251450A publication Critical patent/JP2011251450A/ja
Publication of JP2011251450A5 publication Critical patent/JP2011251450A5/ja
Application granted granted Critical
Publication of JP5624368B2 publication Critical patent/JP5624368B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010126332A 2010-06-01 2010-06-01 積層体 Expired - Fee Related JP5624368B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010126332A JP5624368B2 (ja) 2010-06-01 2010-06-01 積層体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010126332A JP5624368B2 (ja) 2010-06-01 2010-06-01 積層体

Publications (3)

Publication Number Publication Date
JP2011251450A JP2011251450A (ja) 2011-12-15
JP2011251450A5 true JP2011251450A5 (https=) 2013-07-18
JP5624368B2 JP5624368B2 (ja) 2014-11-12

Family

ID=45415799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010126332A Expired - Fee Related JP5624368B2 (ja) 2010-06-01 2010-06-01 積層体

Country Status (1)

Country Link
JP (1) JP5624368B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014105890A1 (en) * 2012-12-26 2014-07-03 Akron Polymer Systems, Inc. Aromatic polyamide films for solvent resistant flexible substrates
EP2916628A1 (en) * 2014-03-07 2015-09-09 Taiflex Scientific Co., Ltd. Cover layer with high thermal resistance and high reflectivity for a printed circuit board
US20150257296A1 (en) * 2014-03-07 2015-09-10 Taiflex Scientific Co., Ltd. Cover layer with high thermal resistance and high reflectivity for a printed circuit board
KR102109787B1 (ko) * 2016-12-27 2020-05-12 주식회사 엘지화학 플라스틱 적층 필름
JP7164945B2 (ja) 2017-11-14 2022-11-02 ニチハ株式会社 補修用シール、補修用シールの製造方法及び補修構造
TWI671571B (zh) * 2018-03-27 2019-09-11 同泰電子科技股份有限公司 用於背光模組的封裝結構
CN110845846B (zh) * 2019-11-06 2021-08-17 无锡顺铉新材料有限公司 一种白色聚酰亚胺复合薄膜及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084110A (ja) * 2000-12-14 2003-03-19 Mitsui Chemicals Inc 反射体、サイドライド型バックライト型装置および反射体基板
KR100825526B1 (ko) * 2003-05-21 2008-04-25 히다치 가세고교 가부시끼가이샤 프라이머, 수지 부착 도체박, 적층판 및 적층판의 제조방법
JP4704011B2 (ja) * 2004-11-04 2011-06-15 株式会社ピーアイ技術研究所 金属複合フィルム
JP5343562B2 (ja) * 2006-07-31 2013-11-13 日立化成株式会社 耐熱性樹脂ペースト
JP2008168439A (ja) * 2007-01-09 2008-07-24 Toyobo Co Ltd 金属白色ポリイミド積層体とその製造方法
US8042976B2 (en) * 2007-11-30 2011-10-25 Taiyo Holdings Co., Ltd. White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
JP2009263404A (ja) * 2008-04-22 2009-11-12 Toray Ind Inc ペースト組成物およびそれを用いた樹脂組成物
US9339992B2 (en) * 2009-03-31 2016-05-17 Mitsui Chemicals, Inc. Low-thermal-expansion block polyimide, precursor thereof, and use thereof

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