JP5620010B2 - 電子デバイス用のユニタリハウジング - Google Patents
電子デバイス用のユニタリハウジング Download PDFInfo
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Description
本発明は、一般的には、電子デバイスに関するものであり、より詳しくは、電子デバイスの密閉ハウジング(筐体)の構造(formation)に関するものである。
ラップトップコンピュータ、メディアプレーヤ、セルラー電話及びその類のようなパーソナルコンピュータ電子デバイスは、より洗練され、消費者に強力で使いやすいものに益々なってきている。これらのデバイスの様々なコンポーネントをより小さいサイズで加工する能力は、依然として電力を必要とするあるいはより一層の電力を必要とし、そのようなデバイスの動作速度及び美観的な魅力は、その傾向への大きな一因となっている。残念なことに、より小型で、より軽量で、かつより強力なポータブルコンピュータデバイスの傾向は、これらのデバイス用のいくつかのコンポーネントの実際の構造について、継続的な設計課題を提示する。このような電子デバイスとそれに対するコンポーネントに関連する設計課題の1つは、デバイス内部の様々な内部デバイスコンポーネントを収容するために使用される外部筺体あるいはハウジングの構造である。
本発明の効果は、自身の外部表面に、製品の明確な継ぎ目あるいは他の人工物を有さない電子デバイスに対する単一のユニタリハウジング(unitary housing)を提供することである。これは、ハウジング内に既に配置されている付属内部部品とともに超音波溶接されているハウジングコンポーネントの使用を少なくとも通じて、自身の外部表面を機械加工及び仕上げ加工することができる単一のユニタリハウジングを1つの要素として形成することができる。
Claims (17)
- 電子デバイスであって、
継ぎ目のないハウジングを備え、
前記継ぎ目のないハウジングは、
その内部に1つ以上の内部電子デバイスコンポーネントを保持するあるいは含むように構成されている開口部を有し、かつ、その少なくとも一部が金属で形成されている金属部分を有する第1のハウジングコンポーネントであって、前記金属部分は、前記開口部に隣接して配置されている第1の金属表面領域を含んでいる、第1のハウジングコンポーネントと、
前記開口部に配置されている内部電子デバイス部品と、
前記開口部に渡って配置されている複数のラミネート金属箔層を含む第2のハウジングコンポーネントであって、前記複数のラミネート金属箔層は、内部に前記開口部が配置されている密閉外部ハウジングを形成するために、1つ以上の超音波接合を介して前記第1の金属表面領域に取り付けられている、第2のハウジングコンポーネントと、
前記開口部内に配置されていて、かつ前記超音波接合中に前記開口部に渡って配置される前記複数のラミネート金属箔層の少なくとも一部を支持するように構成されている支持機構と
を備えることを特徴とする電子デバイス。 - 前記第2のハウジングコンポーネントは、前記第1のハウジングコンポーネントの前記第1の金属表面領域に、前記複数のラミネート金属箔層の1つ目の単一のラミネート金属箔層を超音波接合し、更に、前記複数のラミネート金属箔層の残りのラミネート金属箔層を1つずつ前記第2のハウジングコンポーネントの上部に順番に超音波接合することによって形成される
ことを特徴とする請求項1に記載の電子デバイス。 - 前記第2のハウジングコンポーネントは、前記第1のハウジングコンポーネントに、該第2のハウジングコンポーネントが超音波接合される前に形成される
ことを特徴とする請求項1に記載の電子デバイス。 - 前記第1のハウジングコンポーネントは、複数のラミネート金属箔層を1つずつ超音波接合し、そして、その内部に前記開口部を形成することで作成される
ことを特徴とする請求項1に記載の電子デバイス。 - 前記第1のハウジングコンポーネントと前記第2のハウジングコンポーネントとを組み合わせることで、周囲環境から前記開口部を密閉している
ことを特徴とする請求項1に記載の電子デバイス。 - 前記第1のハウジングコンポーネントと前記第2のハウジングコンポーネントとの少なくとも一方は、前記第1のハウジングコンポーネントと前記第2のハウジングコンポーネントとが互いに超音波接合された後に、更に、仕上げ加工が施されている
ことを特徴とする請求項1に記載の電子デバイス。 - 前記仕上げ加工は、機械加工を含んでいる
ことを特徴とする請求項6に記載の電子デバイス。 - 前記継ぎ目のないハウジングの外部部分は、接続部分を含んでいない
ことを特徴とする請求項1に記載の電子デバイス。 - デバイスの製造方法であって、
その内部に1つ以上の内部電子デバイスコンポーネントを保持するあるいは含むように構成されている開口部を有し、かつ、その少なくとも一部が金属で形成されている金属部分を有する第1のハウジングコンポーネントであって、前記金属部分は、前記開口部に隣接して配置されている金属表面領域を含んでいる、第1のハウジングコンポーネントを選択するステップと、
前記第1のハウジングコンポーネントの前記開口部内に内部電子デバイス部品を設置するステップと、
複数のラミネート金属箔層で、第2のハウジングコンポーネントを形成するステップであって、前記複数のラミネート金属箔層を互いに超音波溶接することを含む、形成するステップと、
前記開口部内に支持機構を配置するステップと、
前記開口部が完全に封入されかつ密閉されるように組み合わされたハウジングを形成するために、前記第1のハウジングコンポーネントの前記金属表面領域と、前記開口部に渡って、前記第2のハウジングコンポーネントを取り付けるステップとを備え、
前記組み合わされたハウジングの外部部分は、継ぎ目を含んでいない
ことを特徴とする方法。 - 前記取り付けるステップは、前記第2のハウジングコンポーネントを前記第1のハウジングコンポーネントに超音波接合することを含んでいる
ことを特徴とする請求項9に記載の方法。 - 前記内部電子デバイス部品は、その上に前記支持機構を含んでいる
ことを特徴とする請求項10に記載の方法。 - 前記取り付けるステップは、前記第2のハウジングコンポーネントの一部だけを取り付けることを含み、
前記形成するステップは、前記第2のハウジングコンポーネントの一部が前記第1のハウジングコンポーネントに取り付けられた後に実行される
ことを特徴とする請求項11に記載の方法。 - 前記支持機構は、前記取り付けるステップ中に、前記第2のハウジングコンポーネントを支持する
ことを特徴とする請求項12に記載の方法。 - 前記第1のハウジングコンポーネントと前記第2のハウジングコンポーネントとが互いに超音波接合された後に、前記組み合わされたハウジングに対して1つ以上の仕上げ加工手順を実行するステップを更に備える
ことを特徴とする請求項13に記載の方法。 - 前記1つ以上の仕上げ加工手順は、前記組み合わされたハウジングを機械加工することを含んでいる
ことを特徴とする請求項14に記載の方法。 - 前記組み合わされたハウジングの外部部分は、接続部分を含んでいない
ことを特徴とする請求項15に記載の方法。 - 前記デバイスは、電子デバイスである
ことを特徴とする請求項9に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41324510P | 2010-11-12 | 2010-11-12 | |
US61/413,245 | 2010-11-12 | ||
US12/978,117 | 2010-12-23 | ||
US12/978,117 US8730656B2 (en) | 2010-11-12 | 2010-12-23 | Unitary housing for electronic device |
PCT/US2011/059729 WO2012064708A1 (en) | 2010-11-12 | 2011-11-08 | Unitary housing for electronic device |
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JP2013542620A JP2013542620A (ja) | 2013-11-21 |
JP5620010B2 true JP5620010B2 (ja) | 2014-11-05 |
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JP2013538822A Active JP5620010B2 (ja) | 2010-11-12 | 2011-11-08 | 電子デバイス用のユニタリハウジング |
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CN (4) | CN202364506U (ja) |
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WO (1) | WO2012064708A1 (ja) |
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CN105611770A (zh) | 2016-05-25 |
US8730656B2 (en) | 2014-05-20 |
CN202773227U (zh) | 2013-03-06 |
US20120120562A1 (en) | 2012-05-17 |
US20190135188A1 (en) | 2019-05-09 |
US20150305175A1 (en) | 2015-10-22 |
KR20150082681A (ko) | 2015-07-15 |
US10696235B2 (en) | 2020-06-30 |
EP3648154A1 (en) | 2020-05-06 |
US9313906B2 (en) | 2016-04-12 |
US10118560B2 (en) | 2018-11-06 |
AU2011326123A1 (en) | 2013-05-09 |
HK1173317A1 (zh) | 2013-05-10 |
AU2011326123B2 (en) | 2015-04-23 |
KR101546168B1 (ko) | 2015-08-20 |
US20140218850A1 (en) | 2014-08-07 |
CN105611770B (zh) | 2019-07-12 |
KR20130086369A (ko) | 2013-08-01 |
US9095044B2 (en) | 2015-07-28 |
WO2012064708A1 (en) | 2012-05-18 |
US20200269765A1 (en) | 2020-08-27 |
CN102573372A (zh) | 2012-07-11 |
JP2013542620A (ja) | 2013-11-21 |
CN202364506U (zh) | 2012-08-01 |
US11505131B2 (en) | 2022-11-22 |
US20160200257A1 (en) | 2016-07-14 |
TW201242473A (en) | 2012-10-16 |
TWI555453B (zh) | 2016-10-21 |
CN102573372B (zh) | 2015-08-12 |
EP2638569A1 (en) | 2013-09-18 |
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