JP5619554B2 - 搬送手段の高さ移動量設定方法 - Google Patents
搬送手段の高さ移動量設定方法 Download PDFInfo
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- JP5619554B2 JP5619554B2 JP2010217110A JP2010217110A JP5619554B2 JP 5619554 B2 JP5619554 B2 JP 5619554B2 JP 2010217110 A JP2010217110 A JP 2010217110A JP 2010217110 A JP2010217110 A JP 2010217110A JP 5619554 B2 JP5619554 B2 JP 5619554B2
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- 238000003384 imaging method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
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- 238000013459 approach Methods 0.000 description 3
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- 238000010586 diagram Methods 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 2
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- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
Description
圧力計64からの検出信号に基づいて、圧力計64の検出圧力(P1)が、設定された所定の設定圧力(P0)以下か否かをチェックする。ステップS4において、圧力計64からの検出圧力(P1)が設定圧力(P0)以下でない場合には、制御部23は吸引パッド43の吸引保持面43aがワークWの上面に密着していない、あるいは吸引保持可能な距離まで接近していないと判断し、ステップS3に戻って、ステップS3およびステップS4を繰り返し実行する。
2 基台
3 チャックテーブル
4 研削ユニット
6,7 カセット
11,12 カセット載置部
13 搬入搬出アーム
14 ワーク位置検出部
15 洗浄部
16 ワーク供給部
17 ワーク回収部
21 開口部
22 支柱部
23 制御部
24 移動板
25 防水カバー
27 吸着面
31 多節リンク機構
32 保持部
35 支持テーブル
36 撮像部
41 回動軸
42 旋回アーム
43 吸引パッド
43a 吸引保持面
51 洗浄テーブル
52 開口部
53 支持部
54 研削ユニット移動機構
55 ガイドレール
57 ボールねじ
58 駆動モータ
59 研削ホイール
64 圧力計
65 吸引部
66 支持アーム
71 オリエンテーションフラット
W ワーク
Claims (1)
- ワークを保持する保持手段と、
前記保持手段に保持された前記ワークを研削加工する加工手段と、
前記ワークを支持する支持テーブルを有し、前記保持手段に前記ワークを搬入する前に前記ワークの位置を検出する検出手段と、
前記支持テーブルに支持された前記ワークを吸引保持する吸引パッドと、前記吸引パッドを鉛直方向に移動させる移動部と、前記吸引パッドに負圧を作用させる吸引部と、前記吸引パッドに作用させる負圧を検出する圧力計と、を有する搬送手段と、を有する研削装置において、
前記支持テーブルに支持された前記ワークを前記搬送手段が搬出する際の前記吸引パッドの高さ移動量をワークの板厚の変更又はメンテナンス時に設定する設定方法であって、
前記吸引パッドを前記支持テーブル上の待機位置に位置付ける位置付け工程と、
前記吸引パッドに負圧を発生させる負圧発生工程と、
前記位置付け工程と前記負圧発生工程との後に前記吸引パッドに発生した負圧の値を読み取りながら前記吸引パッドを降下させる降下工程と、
前記降下工程の最中に、前記吸引パッドが前記支持テーブルに支持されたワークまたは前記支持テーブルに接近することによって前記吸引パッドに発生した負圧があらかじめ設定した閾値を超えた際の前記吸引パッドの高さ位置を記録する記録工程と、
前記記録工程で記録した前記吸引パッドの高さ位置に基づいて前記支持テーブルに支持された前記ワークを前記搬送手段が搬出する際の前記吸引パッドの前記待機位置から前記記録工程で記録した前記吸引パッドの高さ位置までの高さ移動量を設定する設定工程と、
を含むことを特徴とする搬送手段の高さ移動量設定方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010217110A JP5619554B2 (ja) | 2010-09-28 | 2010-09-28 | 搬送手段の高さ移動量設定方法 |
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---|---|---|---|
JP2010217110A JP5619554B2 (ja) | 2010-09-28 | 2010-09-28 | 搬送手段の高さ移動量設定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012071376A JP2012071376A (ja) | 2012-04-12 |
JP5619554B2 true JP5619554B2 (ja) | 2014-11-05 |
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JP2010217110A Active JP5619554B2 (ja) | 2010-09-28 | 2010-09-28 | 搬送手段の高さ移動量設定方法 |
Country Status (1)
Country | Link |
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JP (1) | JP5619554B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6563325B2 (ja) * | 2015-12-14 | 2019-08-21 | 株式会社ディスコ | ピックアップ装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2781846B2 (ja) * | 1993-11-11 | 1998-07-30 | 大日本スクリーン製造株式会社 | 半導体ウェハカセットの基準位置決定方法 |
JP2003266266A (ja) * | 2002-03-20 | 2003-09-24 | Disco Abrasive Syst Ltd | 半導体ウエーハの搬送装置 |
-
2010
- 2010-09-28 JP JP2010217110A patent/JP5619554B2/ja active Active
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JP2012071376A (ja) | 2012-04-12 |
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