JP5614988B2 - 断熱層を備える熱センサ - Google Patents
断熱層を備える熱センサ Download PDFInfo
- Publication number
- JP5614988B2 JP5614988B2 JP2009532796A JP2009532796A JP5614988B2 JP 5614988 B2 JP5614988 B2 JP 5614988B2 JP 2009532796 A JP2009532796 A JP 2009532796A JP 2009532796 A JP2009532796 A JP 2009532796A JP 5614988 B2 JP5614988 B2 JP 5614988B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- substrate
- sensing element
- cap
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/05—Means for preventing contamination of the components of the optical system; Means for preventing obstruction of the radiation path
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/07—Arrangements for adjusting the solid angle of collected radiation, e.g. adjusting or orienting field of view, tracking position or encoding angular position
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0801—Means for wavelength selection or discrimination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/70—Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/584,733 | 2006-10-20 | ||
| US11/584,733 US7692148B2 (en) | 2005-01-26 | 2006-10-20 | Thermal sensor with thermal barrier |
| PCT/EP2007/061091 WO2008046859A1 (en) | 2006-10-20 | 2007-10-17 | Thermal sensor with thermal barrier |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010507082A JP2010507082A (ja) | 2010-03-04 |
| JP2010507082A5 JP2010507082A5 (enExample) | 2010-12-02 |
| JP5614988B2 true JP5614988B2 (ja) | 2014-10-29 |
Family
ID=38799394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009532796A Expired - Fee Related JP5614988B2 (ja) | 2006-10-20 | 2007-10-17 | 断熱層を備える熱センサ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7692148B2 (enExample) |
| EP (1) | EP2076743B1 (enExample) |
| JP (1) | JP5614988B2 (enExample) |
| CN (1) | CN101563592B (enExample) |
| WO (1) | WO2008046859A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7807972B2 (en) * | 2005-01-26 | 2010-10-05 | Analog Devices, Inc. | Radiation sensor with cap and optical elements |
| US8487260B2 (en) * | 2005-01-26 | 2013-07-16 | Analog Devices, Inc. | Sensor |
| US7718967B2 (en) * | 2005-01-26 | 2010-05-18 | Analog Devices, Inc. | Die temperature sensors |
| TW200807652A (en) * | 2006-04-20 | 2008-02-01 | Koninkl Philips Electronics Nv | Thermal isolation of electronic devices in submount used for LEDs lighting applications |
| US8523427B2 (en) * | 2008-02-27 | 2013-09-03 | Analog Devices, Inc. | Sensor device with improved sensitivity to temperature variation in a semiconductor substrate |
| US8848374B2 (en) * | 2010-06-30 | 2014-09-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects |
| FR2966595B1 (fr) * | 2010-10-26 | 2013-01-25 | Commissariat Energie Atomique | Dispositif de detection d'un rayonnement electromagnetique. |
| JP6152377B2 (ja) * | 2011-05-03 | 2017-06-21 | ヴィシェイ デール エレクトロニクス エルエルシー | 電気部品用ヒートスプレッダ |
| US8816280B2 (en) | 2012-03-21 | 2014-08-26 | Analog Devices, Inc. | Infrared sensor |
| RU2518250C1 (ru) * | 2012-11-27 | 2014-06-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) | Тепловой приемник |
| US9719867B2 (en) | 2013-05-30 | 2017-08-01 | Kla-Tencor Corporation | Method and system for measuring heat flux |
| EP3035015B1 (en) * | 2014-12-15 | 2017-04-12 | Melexis Technologies NV | Ir sensor for ir sensing based on power control |
| WO2016129293A1 (ja) | 2015-02-09 | 2016-08-18 | 三菱電機株式会社 | 電磁波検出器、及びガス分析装置 |
| HUE066244T2 (hu) | 2015-08-07 | 2024-07-28 | Vishay Dale Electronics Llc | Formázott testtel rendelkezõ villamos eszköz nagyfeszültségû alkalmazásokhoz és annak gyártási eljárása |
| DE102015217290A1 (de) * | 2015-09-10 | 2017-03-16 | Robert Bosch Gmbh | Mikroelektronische Anordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Anordnung |
| US20170083063A1 (en) * | 2015-09-21 | 2017-03-23 | Qualcomm Incorporated | Circuits and methods providing temperature mitigation for computing devices using in-package sensor |
| JP7008019B2 (ja) * | 2015-11-27 | 2022-01-25 | ハイマン・ゼンゾル・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | ウェハレベルパッケージ内の熱赤外線センサアレイ |
| DE102017206385A1 (de) * | 2017-04-13 | 2018-10-18 | Robert Bosch Gmbh | Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit |
| DE102017206388A1 (de) * | 2017-04-13 | 2018-10-18 | Robert Bosch Gmbh | Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit |
| CN109917941A (zh) * | 2017-12-13 | 2019-06-21 | 南昌欧菲显示科技有限公司 | 压力感应模组、触控显示屏和触控电子设备 |
| CN108640079B (zh) * | 2018-04-26 | 2020-06-23 | 上海烨映电子技术有限公司 | 一种真空封装结构及其封装方法 |
| CN108982905B (zh) * | 2018-07-27 | 2021-09-07 | 杭州电子科技大学 | 集流量传感器为一体的可降气体流速的mems缓冲结构 |
| DE102018120061A1 (de) * | 2018-08-17 | 2020-02-20 | Infineon Technologies Ag | Ein Detektormodul für einen photoakustischen Gassensor |
| EP3705885A1 (en) * | 2019-03-06 | 2020-09-09 | ams AG | Sensor device and method for operating a sensor device |
| CN112345111B (zh) * | 2020-09-28 | 2023-06-23 | 中国电子科技集团公司第二十九研究所 | 一种大功率热源芯片及其制备方法 |
| CN112614930B (zh) * | 2020-11-18 | 2022-10-04 | 浙江先导热电科技股份有限公司 | 一种特殊位置的传感器热电模块 |
| KR20230051392A (ko) * | 2021-10-08 | 2023-04-18 | 삼성전자주식회사 | 윈도우 어셈블리와 이를 포함하는 이미징 시스템 및 그 제조방법과 이미징 시스템을 포함하는 전자장치 |
| CN119438332A (zh) * | 2023-07-28 | 2025-02-14 | 杭州先途电子有限公司 | 参比探头和气体检测装置 |
| CN120417582B (zh) * | 2025-07-02 | 2025-09-09 | 上海芯龙半导体技术股份有限公司 | 一种光电器件封装结构及其制作方法 |
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| US7326932B2 (en) * | 2005-01-26 | 2008-02-05 | Analog Devices, Inc. | Sensor and cap arrangement |
| US7435964B2 (en) * | 2005-01-26 | 2008-10-14 | Analog Devices, Inc. | Thermal sensor with increased sensitivity |
| US8487260B2 (en) * | 2005-01-26 | 2013-07-16 | Analog Devices, Inc. | Sensor |
-
2006
- 2006-10-20 US US11/584,733 patent/US7692148B2/en not_active Expired - Lifetime
-
2007
- 2007-10-17 WO PCT/EP2007/061091 patent/WO2008046859A1/en not_active Ceased
- 2007-10-17 JP JP2009532796A patent/JP5614988B2/ja not_active Expired - Fee Related
- 2007-10-17 CN CN2007800469563A patent/CN101563592B/zh not_active Expired - Fee Related
- 2007-10-17 EP EP07821456.6A patent/EP2076743B1/en not_active Not-in-force
Also Published As
| Publication number | Publication date |
|---|---|
| EP2076743B1 (en) | 2014-03-05 |
| JP2010507082A (ja) | 2010-03-04 |
| CN101563592B (zh) | 2011-05-18 |
| CN101563592A (zh) | 2009-10-21 |
| WO2008046859A1 (en) | 2008-04-24 |
| US20070120060A1 (en) | 2007-05-31 |
| EP2076743A1 (en) | 2009-07-08 |
| US7692148B2 (en) | 2010-04-06 |
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