JP5613491B2 - 端子構造の作製方法 - Google Patents
端子構造の作製方法 Download PDFInfo
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- JP5613491B2 JP5613491B2 JP2010177248A JP2010177248A JP5613491B2 JP 5613491 B2 JP5613491 B2 JP 5613491B2 JP 2010177248 A JP2010177248 A JP 2010177248A JP 2010177248 A JP2010177248 A JP 2010177248A JP 5613491 B2 JP5613491 B2 JP 5613491B2
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- film
- insulating film
- protrusion
- electronic device
- prepreg
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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Description
本実施の形態では、硬化したプリプレグからなる樹脂膜または補強材を含む絶縁膜で覆われている端子構造とその作製方法について説明する。さらに、本実施の形態では、このような構造の端子を備えた電子装置およびその作製方法についても説明する。
本実施の形態では、絶縁膜140に開口143を形成する工程(図2B参照)について説明する。図6および図7は研削装置の構成例を説明する図面であり、図6および図7の研削装置は、絶縁膜140の上面が隆起している部分を優先的に除去することが可能な装置である。
以下、図6の研削装置201の構成、および図2Bの工程での研削装置201の使用方法を説明する。
次に、図7の研削装置202の構成、および図2Bの工程での研削装置202の使用方法を説明する。
本実施の形態では、図1Dに示すプリプレグ130の補強材131に適用できるシート状繊維体について説明する。シート状繊維体でなる補強材131を用いることで、電子装置の強度が高められるので好ましい。
図8Aは、シート状繊維体251の構成例を示す平面図であり、図8Bは、シート状繊維体251の構成例を示す断面図であり、図8Aを線A1−A2で切った断面図である。
硬化されたプリプレグの強度を高めるための1つの手段として、シート状繊維体のバスケットホールを小さくすることが挙げられる。図9にそのような構成例のシート状繊維体252の平面図を示す。図9に示すように、シート状繊維体252は、シート状繊維体251と同様に、一本の経糸261および一本の緯糸262を交互に交差させて織られた平織りの織布である。シート状繊維体252は、シート状繊維体251よりも経糸261と緯糸262の密度が高く、バスケットホール263が狭い。
また、シート状繊維体に適用される織布は、平織りに限定されない。図10にこのようなシート状繊維体の構成例を示す。図10はシート状繊維体253の平面図である。図10に示すように、シート状繊維体253は10本の経糸261と、10本の緯糸262を交互に交差させて織られた織布である。
本実施の形態では、電子装置の一例として、無線通信によりデータの送受信が可能な電子装置の構成、およびその作製方法を説明する。
実施の形態4の電子装置300の作製方法は、突起452を覆う絶縁膜465に開口466を形成する工程を行った後、ガラス基板400を機能回路302から分離する工程を行っている(図17A、図17B参照)。本実施の形態では、これらの工程の順序を逆にした電子装置300の作製方法の一例を説明する。説明には、図20A−図21Bを参照する。
実施の形態4で説明された電子装置300の作製方法は、突起452を覆う絶縁膜465に開口466を形成する工程を行った後、ガラス基板400を機能回路302から分離する工程を行っている(図17A、図17B参照)。ガラス基板400の分離工程の前に、露出された突起452を利用して、機能回路302の検査を行ってもよい。この検査工程で不良と判定された機能回路302は、アンテナ301との接続を行わない。
101 絶縁膜
102 絶縁膜
103 絶縁膜
104 絶縁膜
110 電子素子
111 半導体層
112 導電膜
113 導電膜
114 導電膜
120 突起
121 導電体
130 未硬化のプリプレグ
131 補強材
132 未硬化の樹脂
133 領域
140 絶縁膜
142 硬化された樹脂
143 開口
151 電子装置
152 電子装置
153 電子装置
160 絶縁膜
161 絶縁膜
200 処理基板
201 研削装置
202 研削装置
210 研削定盤
211 回転手段
212 基板保持手段
213 回転手段
214 液体
215 ノズル
220 研削ベルト
221−223 コンベヤローラ
224 ステージ
230 矢印
Claims (5)
- 導電体でなる突起を絶縁表面上に形成することと、
前記絶縁表面および前記突起の表面に、補強材を含み、且つ前記突起の厚さの2倍以下の厚さを有するプリプレグを密着させて、前記プリプレグの上面に前記突起により隆起した部分を形成することと、
前記絶縁表面および前記突起の表面に密着された前記プリプレグを硬化して、前記補強材を含む絶縁膜を形成することと、
前記絶縁膜の上面が隆起している部分を前記補強材と共に除去して、前記絶縁膜に開口を形成することと、を有することを特徴とする端子構造の作製方法。 - 請求項1において、
前記絶縁膜を研削することで、前記絶縁膜に開口を形成することを特徴とする端子構造の作製方法。 - 請求項1または2において、
前記開口を形成した後、前記突起に密接する導電体を形成することを有することを特徴とする端子構造の作製方法。 - 請求項1乃至3において、
前記補強材は、シート状の繊維体であることを特徴とする端子構造の作製方法。 - 請求項1乃至3において、
前記補強材を含む前記プリプレグの代わりに、補強材を含まない未硬化の樹脂膜を硬化することで前記絶縁膜を形成することを特徴とする端子構造の作製方法。
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