JP5609856B2 - 搬送ロボット - Google Patents

搬送ロボット Download PDF

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Publication number
JP5609856B2
JP5609856B2 JP2011278220A JP2011278220A JP5609856B2 JP 5609856 B2 JP5609856 B2 JP 5609856B2 JP 2011278220 A JP2011278220 A JP 2011278220A JP 2011278220 A JP2011278220 A JP 2011278220A JP 5609856 B2 JP5609856 B2 JP 5609856B2
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JP
Japan
Prior art keywords
arm
base
transfer robot
hand
end portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011278220A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013128996A (ja
Inventor
伸征 古川
伸征 古川
勇樹 小原
勇樹 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP2011278220A priority Critical patent/JP5609856B2/ja
Priority to TW101134474A priority patent/TWI491482B/zh
Priority to KR20120110793A priority patent/KR101509292B1/ko
Priority to CN201210377524.3A priority patent/CN103171897B/zh
Priority to US13/647,672 priority patent/US20130272822A1/en
Publication of JP2013128996A publication Critical patent/JP2013128996A/ja
Application granted granted Critical
Publication of JP5609856B2 publication Critical patent/JP5609856B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0054—Cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011278220A 2011-12-19 2011-12-20 搬送ロボット Expired - Fee Related JP5609856B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011278220A JP5609856B2 (ja) 2011-12-20 2011-12-20 搬送ロボット
TW101134474A TWI491482B (zh) 2011-12-20 2012-09-20 搬運機器人
KR20120110793A KR101509292B1 (ko) 2011-12-20 2012-10-05 반송 로봇
CN201210377524.3A CN103171897B (zh) 2011-12-20 2012-10-08 搬运机器人
US13/647,672 US20130272822A1 (en) 2011-12-19 2012-10-09 Transfer robot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011278220A JP5609856B2 (ja) 2011-12-20 2011-12-20 搬送ロボット

Publications (2)

Publication Number Publication Date
JP2013128996A JP2013128996A (ja) 2013-07-04
JP5609856B2 true JP5609856B2 (ja) 2014-10-22

Family

ID=48632190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011278220A Expired - Fee Related JP5609856B2 (ja) 2011-12-19 2011-12-20 搬送ロボット

Country Status (4)

Country Link
JP (1) JP5609856B2 (ko)
KR (1) KR101509292B1 (ko)
CN (1) CN103171897B (ko)
TW (1) TWI491482B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211998A (ja) * 2014-05-07 2015-11-26 セイコーエプソン株式会社 ロボット
JP7154986B2 (ja) * 2018-12-11 2022-10-18 平田機工株式会社 基板搬送装置及び基板搬送システム
US11897139B2 (en) 2021-01-29 2024-02-13 Farobot Inc. Dynamic configuration method based on role assignation and multi-agent plan execution device
TWI812923B (zh) * 2021-02-09 2023-08-21 法博智能移動股份有限公司 基於角色指派的動態配置方法、電子設備及媒體
KR102348259B1 (ko) * 2021-05-31 2022-01-10 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
CN116968071B (zh) * 2023-09-07 2024-03-08 上海广川科技有限公司 一种用于晶圆传输的防滑装置及机械手指

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3881579B2 (ja) * 2002-03-29 2007-02-14 日本電産サンキョー株式会社 アーム駆動装置
JP4524132B2 (ja) * 2004-03-30 2010-08-11 東京エレクトロン株式会社 真空処理装置
KR100773284B1 (ko) * 2004-12-10 2007-11-05 가부시키가이샤 알박 반송 로봇 및 반송 장치
JP4912889B2 (ja) * 2004-12-10 2012-04-11 株式会社アルバック 搬送ロボット及び搬送装置
JP4731267B2 (ja) * 2005-09-29 2011-07-20 日本電産サンキョー株式会社 ロボットのハンドおよびこれを用いたワーク搬送ロボット
WO2008120294A1 (ja) * 2007-03-02 2008-10-09 Daihen Corporation 搬送装置
JP4973267B2 (ja) * 2007-03-23 2012-07-11 東京エレクトロン株式会社 基板搬送装置、基板搬送モジュール、基板搬送方法及び記憶媒体
JP2010171344A (ja) * 2009-01-26 2010-08-05 Tokyo Electron Ltd 真空処理装置
JP5304601B2 (ja) * 2009-11-10 2013-10-02 株式会社安川電機 アーム機構およびそれを備えた真空ロボット
JP5083339B2 (ja) * 2010-02-04 2012-11-28 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法並びに記憶媒体

Also Published As

Publication number Publication date
TW201341288A (zh) 2013-10-16
CN103171897B (zh) 2016-01-20
KR101509292B1 (ko) 2015-04-06
JP2013128996A (ja) 2013-07-04
TWI491482B (zh) 2015-07-11
KR20130071344A (ko) 2013-06-28
CN103171897A (zh) 2013-06-26

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