JP5606308B2 - 光活性窒素塩基 - Google Patents

光活性窒素塩基 Download PDF

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Publication number
JP5606308B2
JP5606308B2 JP2010501474A JP2010501474A JP5606308B2 JP 5606308 B2 JP5606308 B2 JP 5606308B2 JP 2010501474 A JP2010501474 A JP 2010501474A JP 2010501474 A JP2010501474 A JP 2010501474A JP 5606308 B2 JP5606308 B2 JP 5606308B2
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JP
Japan
Prior art keywords
alkylene
alkyl
substituted
interrupted
unsubstituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2010501474A
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English (en)
Japanese (ja)
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JP2010523515A5 (enExample
JP2010523515A (ja
Inventor
ディートリカー クルト
ミステリ カタリーナ
スチューダー カティア
ユング トゥンヤ
アレキサンダー エンゲルブレヒト ローター
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BASF SE
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BASF SE
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Publication of JP2010523515A5 publication Critical patent/JP2010523515A5/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D487/00Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D487/00Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • C07D487/02Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
    • C07D487/04Ortho-condensed systems
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202Masking pattern being obtained by thermal means, e.g. laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Paints Or Removers (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Indole Compounds (AREA)
JP2010501474A 2007-04-03 2008-03-25 光活性窒素塩基 Expired - Fee Related JP5606308B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07105510 2007-04-03
EP07105510.7 2007-04-03
PCT/EP2008/053456 WO2008119688A1 (en) 2007-04-03 2008-03-25 Photoactivable nitrogen bases

Publications (3)

Publication Number Publication Date
JP2010523515A JP2010523515A (ja) 2010-07-15
JP2010523515A5 JP2010523515A5 (enExample) 2011-11-10
JP5606308B2 true JP5606308B2 (ja) 2014-10-15

Family

ID=38016564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010501474A Expired - Fee Related JP5606308B2 (ja) 2007-04-03 2008-03-25 光活性窒素塩基

Country Status (9)

Country Link
US (3) US9921477B2 (enExample)
EP (1) EP2145231B1 (enExample)
JP (1) JP5606308B2 (enExample)
KR (2) KR101944734B1 (enExample)
CN (1) CN101641643B (enExample)
AT (1) ATE524765T1 (enExample)
CA (1) CA2681201C (enExample)
MX (1) MX2009010309A (enExample)
WO (1) WO2008119688A1 (enExample)

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CN108139665B (zh) 2015-12-22 2022-07-05 卡本有限公司 用于用双重固化树脂的增材制造的双重前体树脂系统
US10501572B2 (en) 2015-12-22 2019-12-10 Carbon, Inc. Cyclic ester dual cure resins for additive manufacturing
WO2017112682A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Fabrication of compound products from multiple intermediates by additive manufacturing with dual cure resins
US10343331B2 (en) 2015-12-22 2019-07-09 Carbon, Inc. Wash liquids for use in additive manufacturing with dual cure resins
US10538031B2 (en) 2015-12-22 2020-01-21 Carbon, Inc. Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products
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CN110062796B (zh) * 2016-10-14 2021-09-03 巴斯夫欧洲公司 可硬化的聚合物组合物
WO2018094131A1 (en) * 2016-11-21 2018-05-24 Carbon, Inc. Method of making three-dimensional object by delivering reactive component for subsequent cure
CN110036342A (zh) 2016-12-05 2019-07-19 阿科玛股份有限公司 引发剂共混物和可用于3d打印的含有此类引发剂共混物的可光固化组合物
WO2018165090A1 (en) 2017-03-09 2018-09-13 Carbon, Inc. Tough, high temperature polymers produced by stereolithography
US10367228B2 (en) * 2017-04-07 2019-07-30 Seeo, Inc. Diester-based polymer electrolytes for high voltage lithium ion batteries
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
US11458673B2 (en) 2017-06-21 2022-10-04 Carbon, Inc. Resin dispenser for additive manufacturing
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Also Published As

Publication number Publication date
CA2681201C (en) 2016-06-14
KR101944734B1 (ko) 2019-02-07
US20180217498A1 (en) 2018-08-02
MX2009010309A (es) 2009-10-16
US20210033972A1 (en) 2021-02-04
CN101641643A (zh) 2010-02-03
JP2010523515A (ja) 2010-07-15
US10928728B2 (en) 2021-02-23
EP2145231B1 (en) 2011-09-14
CN101641643B (zh) 2013-08-07
WO2008119688A1 (en) 2008-10-09
US20100105794A1 (en) 2010-04-29
KR20150005683A (ko) 2015-01-14
ATE524765T1 (de) 2011-09-15
CA2681201A1 (en) 2008-10-09
KR20100016136A (ko) 2010-02-12
KR101514093B1 (ko) 2015-04-21
US9921477B2 (en) 2018-03-20
EP2145231A1 (en) 2010-01-20

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