JP5584301B2 - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

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Publication number
JP5584301B2
JP5584301B2 JP2012532249A JP2012532249A JP5584301B2 JP 5584301 B2 JP5584301 B2 JP 5584301B2 JP 2012532249 A JP2012532249 A JP 2012532249A JP 2012532249 A JP2012532249 A JP 2012532249A JP 5584301 B2 JP5584301 B2 JP 5584301B2
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Japan
Prior art keywords
epoxy resin
sample
resin composition
color
spd
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Expired - Fee Related
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JP2012532249A
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English (en)
Japanese (ja)
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JP2013506733A5 (enExample
JP2013506733A (ja
Inventor
エフ．イートン ロバート
ウェルズ カーター ジェイムズ
ベッカーダイト ジョン
Original Assignee
ダウ グローバル テクノロジーズ エルエルシー
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Publication of JP2013506733A5 publication Critical patent/JP2013506733A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2012532249A 2009-09-30 2010-09-29 エポキシ樹脂組成物 Expired - Fee Related JP5584301B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24700609P 2009-09-30 2009-09-30
US61/247,006 2009-09-30
PCT/US2010/050615 WO2011041340A1 (en) 2009-09-30 2010-09-29 Epoxy resin compositions

Publications (3)

Publication Number Publication Date
JP2013506733A JP2013506733A (ja) 2013-02-28
JP2013506733A5 JP2013506733A5 (enExample) 2013-11-14
JP5584301B2 true JP5584301B2 (ja) 2014-09-03

Family

ID=43099534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012532249A Expired - Fee Related JP5584301B2 (ja) 2009-09-30 2010-09-29 エポキシ樹脂組成物

Country Status (7)

Country Link
US (1) US8779034B2 (enExample)
EP (1) EP2483353B1 (enExample)
JP (1) JP5584301B2 (enExample)
KR (1) KR20120094164A (enExample)
CN (1) CN102549069B (enExample)
BR (1) BR112012006361A2 (enExample)
WO (1) WO2011041340A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9464224B2 (en) * 2013-12-18 2016-10-11 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
CN104031589A (zh) * 2014-06-30 2014-09-10 江苏华程光电科技有限公司 热稳定型led密封胶
JP6607009B2 (ja) 2014-12-04 2019-11-20 三菱ケミカル株式会社 テトラメチルビフェノール型エポキシ樹脂、エポキシ樹脂組成物、硬化物及び半導体封止材
KR102252225B1 (ko) * 2015-02-27 2021-05-14 삼성전자주식회사 하나 이상의 통지들을 관리하는 방법 및 이를 위한 전자 장치
CN107134521A (zh) * 2016-02-26 2017-09-05 光宝光电(常州)有限公司 光电半导体装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018262A (en) 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
JPS5933125B2 (ja) 1980-03-17 1984-08-14 信越化学工業株式会社 半導体装置封止用エポキシ樹脂組成物
JPS6126619A (ja) * 1984-07-17 1986-02-05 Daicel Chem Ind Ltd 脂環式エポキシ樹脂配合物
US4686148A (en) * 1985-07-15 1987-08-11 W. R. Grace & Co., Cryovac Div. Vinylidene chloride composition and film made therefrom
WO1989008680A1 (en) 1988-03-07 1989-09-21 The Dow Chemical Company Extrusion formulation package for thermally sensitive resins and polymeric composition containing said package
US5378736A (en) * 1990-05-30 1995-01-03 Daicel Chemical Industries, Ltd. Composition comprising novel alicyclic compound, process for preparation thereof, curable composition, and photo-polymerizable composition
US5135993A (en) 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
JPH05230277A (ja) * 1992-02-17 1993-09-07 Toray Ind Inc 難燃性樹脂組成物および成型体
JPH06207126A (ja) * 1993-01-13 1994-07-26 Daicel Chem Ind Ltd 熱硬化性粉体塗料用樹脂組成物
US5354791A (en) * 1993-10-19 1994-10-11 General Electric Company Epoxy-functional polyester, polycarbonate with metal phosphate
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
JP3056667B2 (ja) * 1995-04-04 2000-06-26 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物
JP3391681B2 (ja) 1998-01-26 2003-03-31 松下電工株式会社 光半導体封止用のエポキシ樹脂組成物および樹脂封止型光半導体装置
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
JP3016428B2 (ja) * 1998-09-28 2000-03-06 ダイセル化学工業株式会社 新規な脂環式化合物からなる組成物およびその製造方法
US6512031B1 (en) 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
JP4550956B2 (ja) * 1999-08-10 2010-09-22 新日本製鐵株式会社 防食塗料および耐食性に優れる塗装金属板
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
JP4301785B2 (ja) * 2002-09-04 2009-07-22 丸善石油化学株式会社 トリシクロペンタジエンジエポキシド
TW200415197A (en) 2002-10-03 2004-08-16 Nippon Kayaku Kk Epoxy resin composition for optical semiconductor package
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
US7923073B2 (en) 2004-11-10 2011-04-12 Dow Global Technologies Llc Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom
JP4701726B2 (ja) * 2005-01-20 2011-06-15 Ｄｉｃ株式会社 ガラスペーパー
US8048819B2 (en) 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
JP5063025B2 (ja) 2006-04-14 2012-10-31 日本化学工業株式会社 深紫外線透過性エポキシ樹脂用硬化促進剤の製造方法
CN102257050B (zh) * 2008-12-18 2013-09-04 陶氏环球技术有限责任公司 含有在脂族上结合的溴的阻燃剂聚合物用的稳定剂

Also Published As

Publication number Publication date
KR20120094164A (ko) 2012-08-23
CN102549069A (zh) 2012-07-04
EP2483353A1 (en) 2012-08-08
US20120184647A1 (en) 2012-07-19
JP2013506733A (ja) 2013-02-28
US8779034B2 (en) 2014-07-15
WO2011041340A1 (en) 2011-04-07
BR112012006361A2 (pt) 2019-09-24
EP2483353B1 (en) 2013-10-30
CN102549069B (zh) 2015-06-10

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