JP5576514B2 - 表面処理銅箔、積層板、プリント配線板及びプリント回路板 - Google Patents

表面処理銅箔、積層板、プリント配線板及びプリント回路板 Download PDF

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Publication number
JP5576514B2
JP5576514B2 JP2013003859A JP2013003859A JP5576514B2 JP 5576514 B2 JP5576514 B2 JP 5576514B2 JP 2013003859 A JP2013003859 A JP 2013003859A JP 2013003859 A JP2013003859 A JP 2013003859A JP 5576514 B2 JP5576514 B2 JP 5576514B2
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Japan
Prior art keywords
copper foil
treated
treated copper
treatment
roughness
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Active
Application number
JP2013003859A
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English (en)
Japanese (ja)
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JP2014133936A (ja
Inventor
英太 新井
亮 福地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2013003859A priority Critical patent/JP5576514B2/ja
Priority to PCT/JP2014/050355 priority patent/WO2014109396A1/ja
Priority to TW103101084A priority patent/TWI526303B/zh
Publication of JP2014133936A publication Critical patent/JP2014133936A/ja
Application granted granted Critical
Publication of JP5576514B2 publication Critical patent/JP5576514B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2013003859A 2013-01-11 2013-01-11 表面処理銅箔、積層板、プリント配線板及びプリント回路板 Active JP5576514B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013003859A JP5576514B2 (ja) 2013-01-11 2013-01-11 表面処理銅箔、積層板、プリント配線板及びプリント回路板
PCT/JP2014/050355 WO2014109396A1 (ja) 2013-01-11 2014-01-10 表面処理銅箔、積層板、キャリア付銅箔、プリント配線板、プリント回路板、電子機器、及びプリント配線板の製造方法
TW103101084A TWI526303B (zh) 2013-01-11 2014-01-10 Surface-treated copper foil, laminated board, carrier copper foil, printed wiring board, printed circuit board, electronic machine and printed wiring board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013003859A JP5576514B2 (ja) 2013-01-11 2013-01-11 表面処理銅箔、積層板、プリント配線板及びプリント回路板

Publications (2)

Publication Number Publication Date
JP2014133936A JP2014133936A (ja) 2014-07-24
JP5576514B2 true JP5576514B2 (ja) 2014-08-20

Family

ID=51167040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013003859A Active JP5576514B2 (ja) 2013-01-11 2013-01-11 表面処理銅箔、積層板、プリント配線板及びプリント回路板

Country Status (3)

Country Link
JP (1) JP5576514B2 (zh)
TW (1) TWI526303B (zh)
WO (1) WO2014109396A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6687409B2 (ja) * 2016-02-09 2020-04-22 福田金属箔粉工業株式会社 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法
JP7055049B2 (ja) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295800B2 (ja) * 2002-05-13 2009-07-15 三井金属鉱業株式会社 電解銅箔
JP2004238647A (ja) * 2003-02-04 2004-08-26 Furukawa Techno Research Kk 平滑化銅箔とその製造方法
JP4161304B2 (ja) * 2003-02-04 2008-10-08 古河サーキットフォイル株式会社 高周波回路用金属箔
JP4354955B2 (ja) * 2004-02-17 2009-10-28 日鉱金属株式会社 黒化処理面又は層を有する銅箔
JP2006222185A (ja) * 2005-02-09 2006-08-24 Furukawa Circuit Foil Kk ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板

Also Published As

Publication number Publication date
JP2014133936A (ja) 2014-07-24
TW201438890A (zh) 2014-10-16
WO2014109396A1 (ja) 2014-07-17
TWI526303B (zh) 2016-03-21

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