JP5570196B2 - インダクタ内蔵部品 - Google Patents
インダクタ内蔵部品 Download PDFInfo
- Publication number
- JP5570196B2 JP5570196B2 JP2009280580A JP2009280580A JP5570196B2 JP 5570196 B2 JP5570196 B2 JP 5570196B2 JP 2009280580 A JP2009280580 A JP 2009280580A JP 2009280580 A JP2009280580 A JP 2009280580A JP 5570196 B2 JP5570196 B2 JP 5570196B2
- Authority
- JP
- Japan
- Prior art keywords
- planar coil
- coil layer
- power supply
- semiconductor chip
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims description 120
- 239000002184 metal Substances 0.000 claims description 120
- 230000005291 magnetic effect Effects 0.000 claims description 86
- 230000004907 flux Effects 0.000 claims description 82
- 239000004065 semiconductor Substances 0.000 claims description 77
- 230000002265 prevention Effects 0.000 claims description 43
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- 239000010941 cobalt Substances 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 75
- 239000003990 capacitor Substances 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 230000000149 penetrating effect Effects 0.000 description 6
- 101000793686 Homo sapiens Azurocidin Proteins 0.000 description 5
- 230000005294 ferromagnetic effect Effects 0.000 description 5
- 238000009499 grossing Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000005307 ferromagnetism Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009280580A JP5570196B2 (ja) | 2009-12-10 | 2009-12-10 | インダクタ内蔵部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009280580A JP5570196B2 (ja) | 2009-12-10 | 2009-12-10 | インダクタ内蔵部品 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014128866A Division JP5890475B2 (ja) | 2014-06-24 | 2014-06-24 | インダクタ内蔵部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011124373A JP2011124373A (ja) | 2011-06-23 |
| JP2011124373A5 JP2011124373A5 (enrdf_load_stackoverflow) | 2012-12-06 |
| JP5570196B2 true JP5570196B2 (ja) | 2014-08-13 |
Family
ID=44287977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009280580A Active JP5570196B2 (ja) | 2009-12-10 | 2009-12-10 | インダクタ内蔵部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5570196B2 (enrdf_load_stackoverflow) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5565750B2 (ja) * | 2010-04-12 | 2014-08-06 | 株式会社村田製作所 | 電子モジュール |
| JP2013069169A (ja) * | 2011-09-22 | 2013-04-18 | Mitsumi Electric Co Ltd | 操作入力装置及びそれを備える電子機器 |
| KR20130046254A (ko) * | 2011-10-27 | 2013-05-07 | 삼성전기주식회사 | 인덕터 |
| JP5902503B2 (ja) * | 2012-02-16 | 2016-04-13 | 株式会社日本自動車部品総合研究所 | プリントコイル |
| KR101431983B1 (ko) | 2013-08-19 | 2014-08-20 | 삼성전기주식회사 | 무선 전력 전송용 코일형 유닛, 무선 전력 전송장치, 전자기기 및 무선전력 전송용 코일형 유닛의 제조방법 |
| KR101630091B1 (ko) * | 2014-12-24 | 2016-06-13 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
| KR101630090B1 (ko) * | 2014-12-24 | 2016-06-13 | 삼성전기주식회사 | 적층 전자부품 및 그 제조방법 |
| US10026546B2 (en) | 2016-05-20 | 2018-07-17 | Qualcomm Incorported | Apparatus with 3D wirewound inductor integrated within a substrate |
| JP6597576B2 (ja) * | 2016-12-08 | 2019-10-30 | 株式会社村田製作所 | インダクタ、および、ｄｃ−ｄｃコンバータ |
| JP6477991B2 (ja) | 2016-12-12 | 2019-03-06 | 株式会社村田製作所 | Ｌｃデバイス、ｌｃデバイスの製造方法 |
| JP6590327B2 (ja) * | 2018-02-22 | 2019-10-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | コイル部品 |
| KR102029577B1 (ko) | 2018-03-27 | 2019-10-08 | 삼성전기주식회사 | 코일 부품 |
| JP2020115616A (ja) * | 2019-01-17 | 2020-07-30 | 太陽誘電株式会社 | フィルタおよびマルチプレクサ |
| JP2020202255A (ja) * | 2019-06-07 | 2020-12-17 | 株式会社デンソー | 電子装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677053A (ja) * | 1992-08-26 | 1994-03-18 | Tdk Corp | 複合部品 |
| JPH06260361A (ja) * | 1993-03-03 | 1994-09-16 | Nippon Steel Corp | 薄型電源用インダクタの製造方法 |
| JP3347452B2 (ja) * | 1993-03-15 | 2002-11-20 | 株式会社東芝 | 電源用磁気素子およびｄｃ−ｄｃコンバータ |
| JPH10125830A (ja) * | 1996-10-24 | 1998-05-15 | Hitachi Ltd | 高周波モジュールおよびその製造方法 |
| JP2005101417A (ja) * | 2003-09-26 | 2005-04-14 | Nec Tokin Corp | Ｄｃ−ｄｃ電源装置の製造方法 |
| JP2007028838A (ja) * | 2005-07-20 | 2007-02-01 | Citizen Electronics Co Ltd | 電源回路装置 |
-
2009
- 2009-12-10 JP JP2009280580A patent/JP5570196B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011124373A (ja) | 2011-06-23 |
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