JP5568026B2 - ろう付け方法及びろう付け構造 - Google Patents

ろう付け方法及びろう付け構造 Download PDF

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Publication number
JP5568026B2
JP5568026B2 JP2011009756A JP2011009756A JP5568026B2 JP 5568026 B2 JP5568026 B2 JP 5568026B2 JP 2011009756 A JP2011009756 A JP 2011009756A JP 2011009756 A JP2011009756 A JP 2011009756A JP 5568026 B2 JP5568026 B2 JP 5568026B2
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JP
Japan
Prior art keywords
brazing
welding
top plate
insulating substrate
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011009756A
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English (en)
Japanese (ja)
Other versions
JP2012148326A (ja
JP2012148326A5 (https=
Inventor
啓輔 保田
裕司 杉野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Toyota Motor Corp
Original Assignee
Denso Corp
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2011009756A priority Critical patent/JP5568026B2/ja
Application filed by Denso Corp, Toyota Motor Corp filed Critical Denso Corp
Priority to CN201180057687.7A priority patent/CN103228388B/zh
Priority to US13/882,861 priority patent/US9238275B2/en
Priority to EP11856499.6A priority patent/EP2666573B1/en
Priority to KR1020137018884A priority patent/KR101442447B1/ko
Priority to PCT/JP2011/067843 priority patent/WO2012098720A1/ja
Publication of JP2012148326A publication Critical patent/JP2012148326A/ja
Publication of JP2012148326A5 publication Critical patent/JP2012148326A5/ja
Application granted granted Critical
Publication of JP5568026B2 publication Critical patent/JP5568026B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing of heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
JP2011009756A 2011-01-20 2011-01-20 ろう付け方法及びろう付け構造 Expired - Fee Related JP5568026B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011009756A JP5568026B2 (ja) 2011-01-20 2011-01-20 ろう付け方法及びろう付け構造
US13/882,861 US9238275B2 (en) 2011-01-20 2011-08-04 Brazing method and brazed structure
EP11856499.6A EP2666573B1 (en) 2011-01-20 2011-08-04 Brazing method and brazed structure
KR1020137018884A KR101442447B1 (ko) 2011-01-20 2011-08-04 브레이징 방법 및 브레이징 구조
CN201180057687.7A CN103228388B (zh) 2011-01-20 2011-08-04 钎焊方法以及钎焊构造
PCT/JP2011/067843 WO2012098720A1 (ja) 2011-01-20 2011-08-04 ろう付け方法及びろう付け構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011009756A JP5568026B2 (ja) 2011-01-20 2011-01-20 ろう付け方法及びろう付け構造

Publications (3)

Publication Number Publication Date
JP2012148326A JP2012148326A (ja) 2012-08-09
JP2012148326A5 JP2012148326A5 (https=) 2013-08-29
JP5568026B2 true JP5568026B2 (ja) 2014-08-06

Family

ID=46515364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011009756A Expired - Fee Related JP5568026B2 (ja) 2011-01-20 2011-01-20 ろう付け方法及びろう付け構造

Country Status (6)

Country Link
US (1) US9238275B2 (https=)
EP (1) EP2666573B1 (https=)
JP (1) JP5568026B2 (https=)
KR (1) KR101442447B1 (https=)
CN (1) CN103228388B (https=)
WO (1) WO2012098720A1 (https=)

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EP2234153B1 (en) * 2007-11-26 2019-07-03 Showa Denko K.K. Liquid-cooled type cooling device
JP5724710B2 (ja) * 2011-07-21 2015-05-27 三菱電機株式会社 プレート積層型冷却器
US9472488B2 (en) * 2012-04-16 2016-10-18 Fuji Electric Co., Ltd. Semiconductor device and cooler thereof
JP5694278B2 (ja) * 2012-11-21 2015-04-01 三菱電機株式会社 電力変換装置
WO2015198893A1 (ja) * 2014-06-24 2015-12-30 三菱電機株式会社 冷却装置
DE102014215892A1 (de) * 2014-08-11 2016-02-11 Schaeffler Technologies AG & Co. KG Kühldeckel zum Kühlen von Leistungsendstufenmodulen, Leistungselektronik mit dem Kühldeckel und Hybridmodul mit der Leistungselektronik
GB2536051A (en) * 2015-03-06 2016-09-07 Hiflux Ltd Heatsink
JP6661524B2 (ja) * 2016-12-13 2020-03-11 株式会社ケーヒン 熱交換器
US10431475B2 (en) * 2017-05-15 2019-10-01 Intel Corporation Cold plate with dam isolation
JP6663899B2 (ja) * 2017-11-29 2020-03-13 本田技研工業株式会社 冷却装置
EP3703117B1 (en) 2019-02-28 2022-11-23 Audi Ag Electric power converter device with improved integration of cooler frame
CN110670799B (zh) * 2019-10-10 2021-11-09 李居强 带腔体的结构板及其制作方法
JP7552290B2 (ja) * 2020-11-25 2024-09-18 日本軽金属株式会社 接合部材及びその製造方法
JP7459163B2 (ja) * 2022-04-19 2024-04-01 三菱電機株式会社 半導体装置およびその製造方法
CN118342061A (zh) * 2022-08-18 2024-07-16 飒羽辰工程科技(上海)有限公司 风电塔筒内附件的可控相变紧固方法

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JP4323706B2 (ja) 2000-10-25 2009-09-02 電気化学工業株式会社 セラミック体と銅板の接合方法
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Also Published As

Publication number Publication date
CN103228388A (zh) 2013-07-31
JP2012148326A (ja) 2012-08-09
US9238275B2 (en) 2016-01-19
KR20130118922A (ko) 2013-10-30
EP2666573A4 (en) 2015-10-21
CN103228388B (zh) 2015-09-09
WO2012098720A1 (ja) 2012-07-26
US20130228322A1 (en) 2013-09-05
KR101442447B1 (ko) 2014-09-23
EP2666573A1 (en) 2013-11-27
EP2666573B1 (en) 2017-01-11

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