KR101442447B1 - 브레이징 방법 및 브레이징 구조 - Google Patents

브레이징 방법 및 브레이징 구조 Download PDF

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Publication number
KR101442447B1
KR101442447B1 KR1020137018884A KR20137018884A KR101442447B1 KR 101442447 B1 KR101442447 B1 KR 101442447B1 KR 1020137018884 A KR1020137018884 A KR 1020137018884A KR 20137018884 A KR20137018884 A KR 20137018884A KR 101442447 B1 KR101442447 B1 KR 101442447B1
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KR
South Korea
Prior art keywords
brazing
welding
insulating substrate
cooler
heating element
Prior art date
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Expired - Fee Related
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KR1020137018884A
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English (en)
Korean (ko)
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KR20130118922A (ko
Inventor
게이스케 야스다
유우지 스기노
Original Assignee
도요타지도샤가부시키가이샤
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing of heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
KR1020137018884A 2011-01-20 2011-08-04 브레이징 방법 및 브레이징 구조 Expired - Fee Related KR101442447B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011009756A JP5568026B2 (ja) 2011-01-20 2011-01-20 ろう付け方法及びろう付け構造
JPJP-P-2011-009756 2011-01-20
PCT/JP2011/067843 WO2012098720A1 (ja) 2011-01-20 2011-08-04 ろう付け方法及びろう付け構造

Publications (2)

Publication Number Publication Date
KR20130118922A KR20130118922A (ko) 2013-10-30
KR101442447B1 true KR101442447B1 (ko) 2014-09-23

Family

ID=46515364

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137018884A Expired - Fee Related KR101442447B1 (ko) 2011-01-20 2011-08-04 브레이징 방법 및 브레이징 구조

Country Status (6)

Country Link
US (1) US9238275B2 (https=)
EP (1) EP2666573B1 (https=)
JP (1) JP5568026B2 (https=)
KR (1) KR101442447B1 (https=)
CN (1) CN103228388B (https=)
WO (1) WO2012098720A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2234153B1 (en) * 2007-11-26 2019-07-03 Showa Denko K.K. Liquid-cooled type cooling device
JP5724710B2 (ja) * 2011-07-21 2015-05-27 三菱電機株式会社 プレート積層型冷却器
US9472488B2 (en) * 2012-04-16 2016-10-18 Fuji Electric Co., Ltd. Semiconductor device and cooler thereof
JP5694278B2 (ja) * 2012-11-21 2015-04-01 三菱電機株式会社 電力変換装置
WO2015198893A1 (ja) * 2014-06-24 2015-12-30 三菱電機株式会社 冷却装置
DE102014215892A1 (de) * 2014-08-11 2016-02-11 Schaeffler Technologies AG & Co. KG Kühldeckel zum Kühlen von Leistungsendstufenmodulen, Leistungselektronik mit dem Kühldeckel und Hybridmodul mit der Leistungselektronik
GB2536051A (en) * 2015-03-06 2016-09-07 Hiflux Ltd Heatsink
JP6661524B2 (ja) * 2016-12-13 2020-03-11 株式会社ケーヒン 熱交換器
US10431475B2 (en) * 2017-05-15 2019-10-01 Intel Corporation Cold plate with dam isolation
JP6663899B2 (ja) * 2017-11-29 2020-03-13 本田技研工業株式会社 冷却装置
EP3703117B1 (en) 2019-02-28 2022-11-23 Audi Ag Electric power converter device with improved integration of cooler frame
CN110670799B (zh) * 2019-10-10 2021-11-09 李居强 带腔体的结构板及其制作方法
JP7552290B2 (ja) * 2020-11-25 2024-09-18 日本軽金属株式会社 接合部材及びその製造方法
JP7459163B2 (ja) * 2022-04-19 2024-04-01 三菱電機株式会社 半導体装置およびその製造方法
CN118342061A (zh) * 2022-08-18 2024-07-16 飒羽辰工程科技(上海)有限公司 风电塔筒内附件的可控相变紧固方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09275170A (ja) * 1996-04-03 1997-10-21 Fuji Electric Co Ltd 半導体装置

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US3214564A (en) * 1963-05-27 1965-10-26 Gen Motors Corp Method of joining metals
FR2547757B1 (fr) * 1983-06-27 1986-10-17 Sciaky Sa Procede et installation de soudage par point a faisceau laser
JP4323706B2 (ja) 2000-10-25 2009-09-02 電気化学工業株式会社 セラミック体と銅板の接合方法
CA2371641A1 (en) 2001-02-14 2002-08-14 Ats Automation Tooling Systems Inc. Folded fin heat sink assembly
JP2002341196A (ja) * 2001-05-21 2002-11-27 Mitsubishi Chemicals Corp 半導体レーザモジュールにおける光ファイバ及び構成部材間の固定方法
JP4168114B2 (ja) 2001-09-28 2008-10-22 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体
JP3818223B2 (ja) 2002-06-14 2006-09-06 株式会社デンソー タンク
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JP2006341304A (ja) 2005-06-10 2006-12-21 Tanaka Kikai Kogyo Kk 異種金属接合法
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Also Published As

Publication number Publication date
CN103228388A (zh) 2013-07-31
JP2012148326A (ja) 2012-08-09
US9238275B2 (en) 2016-01-19
KR20130118922A (ko) 2013-10-30
EP2666573A4 (en) 2015-10-21
JP5568026B2 (ja) 2014-08-06
CN103228388B (zh) 2015-09-09
WO2012098720A1 (ja) 2012-07-26
US20130228322A1 (en) 2013-09-05
EP2666573A1 (en) 2013-11-27
EP2666573B1 (en) 2017-01-11

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