CN103228388B - 钎焊方法以及钎焊构造 - Google Patents

钎焊方法以及钎焊构造 Download PDF

Info

Publication number
CN103228388B
CN103228388B CN201180057687.7A CN201180057687A CN103228388B CN 103228388 B CN103228388 B CN 103228388B CN 201180057687 A CN201180057687 A CN 201180057687A CN 103228388 B CN103228388 B CN 103228388B
Authority
CN
China
Prior art keywords
brazing
top plate
insulating substrate
cooler
weld marks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180057687.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103228388A (zh
Inventor
保田启辅
杉野裕司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of CN103228388A publication Critical patent/CN103228388A/zh
Application granted granted Critical
Publication of CN103228388B publication Critical patent/CN103228388B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing of heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
CN201180057687.7A 2011-01-20 2011-08-04 钎焊方法以及钎焊构造 Expired - Fee Related CN103228388B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011009756A JP5568026B2 (ja) 2011-01-20 2011-01-20 ろう付け方法及びろう付け構造
JP2011-009756 2011-01-20
PCT/JP2011/067843 WO2012098720A1 (ja) 2011-01-20 2011-08-04 ろう付け方法及びろう付け構造

Publications (2)

Publication Number Publication Date
CN103228388A CN103228388A (zh) 2013-07-31
CN103228388B true CN103228388B (zh) 2015-09-09

Family

ID=46515364

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180057687.7A Expired - Fee Related CN103228388B (zh) 2011-01-20 2011-08-04 钎焊方法以及钎焊构造

Country Status (6)

Country Link
US (1) US9238275B2 (https=)
EP (1) EP2666573B1 (https=)
JP (1) JP5568026B2 (https=)
KR (1) KR101442447B1 (https=)
CN (1) CN103228388B (https=)
WO (1) WO2012098720A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2234153B1 (en) * 2007-11-26 2019-07-03 Showa Denko K.K. Liquid-cooled type cooling device
JP5724710B2 (ja) * 2011-07-21 2015-05-27 三菱電機株式会社 プレート積層型冷却器
US9472488B2 (en) * 2012-04-16 2016-10-18 Fuji Electric Co., Ltd. Semiconductor device and cooler thereof
JP5694278B2 (ja) * 2012-11-21 2015-04-01 三菱電機株式会社 電力変換装置
WO2015198893A1 (ja) * 2014-06-24 2015-12-30 三菱電機株式会社 冷却装置
DE102014215892A1 (de) * 2014-08-11 2016-02-11 Schaeffler Technologies AG & Co. KG Kühldeckel zum Kühlen von Leistungsendstufenmodulen, Leistungselektronik mit dem Kühldeckel und Hybridmodul mit der Leistungselektronik
GB2536051A (en) * 2015-03-06 2016-09-07 Hiflux Ltd Heatsink
JP6661524B2 (ja) * 2016-12-13 2020-03-11 株式会社ケーヒン 熱交換器
US10431475B2 (en) * 2017-05-15 2019-10-01 Intel Corporation Cold plate with dam isolation
JP6663899B2 (ja) * 2017-11-29 2020-03-13 本田技研工業株式会社 冷却装置
EP3703117B1 (en) 2019-02-28 2022-11-23 Audi Ag Electric power converter device with improved integration of cooler frame
CN110670799B (zh) * 2019-10-10 2021-11-09 李居强 带腔体的结构板及其制作方法
JP7552290B2 (ja) * 2020-11-25 2024-09-18 日本軽金属株式会社 接合部材及びその製造方法
JP7459163B2 (ja) * 2022-04-19 2024-04-01 三菱電機株式会社 半導体装置およびその製造方法
CN118342061A (zh) * 2022-08-18 2024-07-16 飒羽辰工程科技(上海)有限公司 风电塔筒内附件的可控相变紧固方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002341196A (ja) * 2001-05-21 2002-11-27 Mitsubishi Chemicals Corp 半導体レーザモジュールにおける光ファイバ及び構成部材間の固定方法
CN1499489A (zh) * 2002-11-07 2004-05-26 �ձ�������ʽ���� 零件连接装置和多个零件形成的连接结构
CN101730935A (zh) * 2007-07-04 2010-06-09 亚金股份有限公司 电子部件封装体的制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214564A (en) * 1963-05-27 1965-10-26 Gen Motors Corp Method of joining metals
FR2547757B1 (fr) * 1983-06-27 1986-10-17 Sciaky Sa Procede et installation de soudage par point a faisceau laser
JPH09275170A (ja) 1996-04-03 1997-10-21 Fuji Electric Co Ltd 半導体装置
JP4323706B2 (ja) 2000-10-25 2009-09-02 電気化学工業株式会社 セラミック体と銅板の接合方法
CA2371641A1 (en) 2001-02-14 2002-08-14 Ats Automation Tooling Systems Inc. Folded fin heat sink assembly
JP4168114B2 (ja) 2001-09-28 2008-10-22 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体
JP3818223B2 (ja) 2002-06-14 2006-09-06 株式会社デンソー タンク
JP2005224832A (ja) * 2004-02-12 2005-08-25 High Energy Accelerator Research Organization 電子加速管の製造方法および製造装置
JP2006341304A (ja) 2005-06-10 2006-12-21 Tanaka Kikai Kogyo Kk 異種金属接合法
JP2007222939A (ja) 2006-01-30 2007-09-06 Hitachi Metals Ltd ロウ材シートおよびその製造方法ならびに電子部品用パッケージ
US8518554B2 (en) 2006-07-04 2013-08-27 Kabushiki Kaisha Toshiba Ceramic metal composite and semiconductor device using the same
US20090068446A1 (en) * 2007-04-30 2009-03-12 United Technologies Corporation Layered structures with integral brazing materials
JP2009168361A (ja) 2008-01-17 2009-07-30 Sanden Corp 熱交換器用チューブ及びその製造方法
JP2010251443A (ja) 2009-04-14 2010-11-04 Toyota Motor Corp 冷却器
WO2012023440A1 (ja) * 2010-08-18 2012-02-23 新日鉄マテリアルズ株式会社 半導体実装用半田ボール及び電子部材
US8960525B2 (en) * 2013-01-31 2015-02-24 General Electric Company Brazing process and plate assembly
US9713851B2 (en) * 2013-09-04 2017-07-25 Apple Inc. Method and system for attaching flexible circuits to a mounting surface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002341196A (ja) * 2001-05-21 2002-11-27 Mitsubishi Chemicals Corp 半導体レーザモジュールにおける光ファイバ及び構成部材間の固定方法
CN1499489A (zh) * 2002-11-07 2004-05-26 �ձ�������ʽ���� 零件连接装置和多个零件形成的连接结构
CN101730935A (zh) * 2007-07-04 2010-06-09 亚金股份有限公司 电子部件封装体的制造方法

Also Published As

Publication number Publication date
CN103228388A (zh) 2013-07-31
JP2012148326A (ja) 2012-08-09
US9238275B2 (en) 2016-01-19
KR20130118922A (ko) 2013-10-30
EP2666573A4 (en) 2015-10-21
JP5568026B2 (ja) 2014-08-06
WO2012098720A1 (ja) 2012-07-26
US20130228322A1 (en) 2013-09-05
KR101442447B1 (ko) 2014-09-23
EP2666573A1 (en) 2013-11-27
EP2666573B1 (en) 2017-01-11

Similar Documents

Publication Publication Date Title
CN103228388B (zh) 钎焊方法以及钎焊构造
JP5740036B1 (ja) 平面型ヒートパイプ
JP4775327B2 (ja) 半導体装置の製造方法
CN103000559B (zh) 半导体芯片的定位夹具以及半导体装置的制造方法
KR101956983B1 (ko) 파워 모듈 및 그 제조 방법
JP2019195009A (ja) 半導体モジュール及び半導体モジュールの製造方法
WO2017195625A1 (ja) 半導体装置および半導体装置の製造方法
JP5077536B2 (ja) 半導体装置の製造方法
CN114078793B (zh) 冷却装置、冷却装置的制造方法
JP2012227362A (ja) ヒートシンク付パワーモジュール用基板ユニットおよびその製造方法
JP2012252935A (ja) 電力用半導体装置
JP2019133965A (ja) 半導体装置及びその製造方法
JP2012135768A (ja) ろう付け方法及びろう付け構造
JP5549678B2 (ja) 半導体装置およびその製造方法
JP6422726B2 (ja) 回路基板付きヒートシンク及びその製造方法
JP2019021680A (ja) 半導体装置の製造方法
KR101099052B1 (ko) 냉각 판 및 그 제조방법
JP7693601B2 (ja) レーザ溶接方法
JP4396568B2 (ja) ハンダ付け構造体の製造方法
JP2024081014A (ja) レーザ溶接方法、構造物
JP2023154736A (ja) レーザ溶接方法及び冷却器
WO2017208941A1 (ja) 半導体装置及びその製造方法
CN116190242A (zh) 激光焊接方法及冷却器
WO2025229791A1 (ja) 冷却器
CN118417652A (zh) 加热装置及焊料接合完毕对象物的制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150909

CF01 Termination of patent right due to non-payment of annual fee