JP5554617B2 - 保持テーブル - Google Patents

保持テーブル Download PDF

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Publication number
JP5554617B2
JP5554617B2 JP2010091201A JP2010091201A JP5554617B2 JP 5554617 B2 JP5554617 B2 JP 5554617B2 JP 2010091201 A JP2010091201 A JP 2010091201A JP 2010091201 A JP2010091201 A JP 2010091201A JP 5554617 B2 JP5554617 B2 JP 5554617B2
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JP
Japan
Prior art keywords
workpiece
holding table
work
suction
rotation support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010091201A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011222800A (ja
Inventor
秀次 新田
剛史 鳥飼
直功 瓜田
輔 山中
克治 根岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2010091201A priority Critical patent/JP5554617B2/ja
Priority to TW100105997A priority patent/TWI515819B/zh
Priority to CN201110090406.XA priority patent/CN102214550B/zh
Publication of JP2011222800A publication Critical patent/JP2011222800A/ja
Application granted granted Critical
Publication of JP5554617B2 publication Critical patent/JP5554617B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2010091201A 2010-04-12 2010-04-12 保持テーブル Active JP5554617B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010091201A JP5554617B2 (ja) 2010-04-12 2010-04-12 保持テーブル
TW100105997A TWI515819B (zh) 2010-04-12 2011-02-23 Keep the table
CN201110090406.XA CN102214550B (zh) 2010-04-12 2011-04-11 保持工作台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010091201A JP5554617B2 (ja) 2010-04-12 2010-04-12 保持テーブル

Publications (2)

Publication Number Publication Date
JP2011222800A JP2011222800A (ja) 2011-11-04
JP5554617B2 true JP5554617B2 (ja) 2014-07-23

Family

ID=44745812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010091201A Active JP5554617B2 (ja) 2010-04-12 2010-04-12 保持テーブル

Country Status (3)

Country Link
JP (1) JP5554617B2 (zh)
CN (1) CN102214550B (zh)
TW (1) TWI515819B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4577100A (en) * 1983-12-27 1986-03-18 United Technologies Corporation Temperature compensated optical pressure sensor
JP5662744B2 (ja) * 2010-09-10 2015-02-04 東京応化工業株式会社 保持装置
JP5976312B2 (ja) * 2011-12-22 2016-08-23 株式会社ディスコ ウェーハ保持装置
CN104603926B (zh) * 2012-08-29 2017-03-01 夏普株式会社 基板处理装置和液晶显示面板制造装置
JP2015170617A (ja) * 2014-03-04 2015-09-28 東京エレクトロン株式会社 液処理装置
JP6382568B2 (ja) * 2014-05-09 2018-08-29 株式会社ディスコ レーザー加工装置
JP6494451B2 (ja) * 2015-07-06 2019-04-03 株式会社ディスコ チャックテーブル及び洗浄装置
JP6994852B2 (ja) * 2017-06-30 2022-01-14 株式会社ディスコ レーザー加工装置及びレーザー加工方法
JP6944830B2 (ja) * 2017-07-21 2021-10-06 東京エレクトロン株式会社 ワーク保持機構及びワーク処理システム
KR20200036001A (ko) 2017-08-10 2020-04-06 하마마츠 포토닉스 가부시키가이샤 미러 장치
CN108470851B (zh) * 2018-03-26 2020-03-06 京东方科技集团股份有限公司 基板处理方法和基板处理装置
JP7186356B2 (ja) * 2019-01-16 2022-12-09 株式会社東京精密 ウェーハチャック及びウェーハ保持装置
TWI706928B (zh) * 2020-01-15 2020-10-11 鴻鎷科技有限公司 精密陶瓷工作台
CN113524062A (zh) * 2020-04-16 2021-10-22 鸿鎷科技有限公司 精密陶瓷工作台
CN112157724A (zh) * 2020-09-22 2021-01-01 安徽中科春谷激光产业技术研究院有限公司 一种激光切割较薄材料防振动工作吸台
JP2022147550A (ja) * 2021-03-23 2022-10-06 株式会社東京精密 ワーク保持装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11239991A (ja) * 1997-12-22 1999-09-07 Shipley Far East Kk 物体の保持装置及びそれを用いる物体の保持方法
JP2002164314A (ja) * 2000-11-27 2002-06-07 Dainippon Screen Mfg Co Ltd 回転支持板およびそれを用いた基板処理装置
JP2002203783A (ja) * 2001-10-18 2002-07-19 Tokyo Electron Ltd 処理方法及び処理装置
TW594297B (en) * 2002-07-19 2004-06-21 Hitachi Ind Co Ltd Substrate assembling device
JP4705450B2 (ja) * 2005-03-11 2011-06-22 株式会社ディスコ ウェーハの保持機構
JP2009043771A (ja) * 2007-08-06 2009-02-26 Disco Abrasive Syst Ltd チャックテーブル機構および被加工物の保持方法
JP2010283286A (ja) * 2009-06-08 2010-12-16 Disco Abrasive Syst Ltd ワーク保持装置

Also Published As

Publication number Publication date
CN102214550A (zh) 2011-10-12
TWI515819B (zh) 2016-01-01
JP2011222800A (ja) 2011-11-04
CN102214550B (zh) 2015-11-04
TW201145444A (en) 2011-12-16

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