201145444 六、發明說明： c發明所屬技術領域】 發明領域 本發明係有關於一種用以對例如半導體晶圓等薄板狀 工作件施行各種加工或處理之裝置所具備之工作件的 ^ ° ,、、 C -¾. ^hr ί 發明背景 半導體元件係經過於半導體晶圓之表面被分割預定線 所區劃之多數矩形領域，形成1CaLSI等之電子電路 接著，對該晶圓之裏面施行研削•研磨等必要之處理後，) 將分割預定線切斷，切割成各個元件（半導體晶片〉之尚。 而得。分減元件後之洗淨水洗淨，除去切^= 產生之切顧等後，噴灑高壓空氣，以進行乾燥處理(參照 專利文獻1等）’並轉移到下一接合製程等。 日日w之切割或洗淨、乾燥之製程中，會產生靜電而發 生晶圓帶電之情況。例如以切削板之切削進行切割時，將 切削水供給到晶圓以潤滑或冷卻，且因該切削水接觸時產 生之摩擦等而使晶圓帶電。又，洗淨、乾燥時，由於朝支 持於旋轉之台上之晶圓賴洗淨水或高壓空氣，因此該等 洗淨水或高壓空氣等接觸到晶圓時會產生摩擦而帶電。Λ 所謂晶圓帶電係指具有到放電之可能性，因發生放電 而流通於元件中之電在容許量以上時，會產生靜電破壞而 元件受到損害’結果元件之品質降低且變得*能使用。因 201145444 =了 ’上述專利文獻1中提出在洗淨晶 圓等工 夺喷灑具有除電效果且經離子化之空氣以除去靜電。 先行技術文獻 [專利文獻1]曰本專利公開公報特開第2〇〇4 327613號 公報 【發明内容】 發明概要 發明欲解決之課題 m 丨。王虱之嘴灑係用以快速除去工作件 之靜電以抑制靜電破壞之手段，但本來電荷就難以 貯子於工作件而抑制帶電量，結果若可施行抑細電子移 產生之放電如此根本的對策，則可比上 破壞抑止對策更具效果。 之㈣ 因此本發明之目的即在於提供—種保持台，其係在對 2、 作件％仃加工或處理時，可抑制摩擦造成之靜 《生而使電荷難以貯存於卫作件，減少帶電量，藉此 有效地抑制靜電破壞。 解決課題之方法 本發明係將負壓傳達到卫作件之内面且用以吸 之保持台，其特徽灰友V勺人士 ’、寺 負壓傳件支持部，係具有將 負傳達到用以支持工作件之支持面之吸附部，且由 絕緣性之構件所形成；旋轉支持部，係將該工作件支持邻 旋轉地支持；輕量化空間，係形成於該旋轉支持邹斑 工作件支持部之間；及吸引路徑，輕前述吸附部與產^ 201145444 負壓之負廢源連通 __， 間連通。。 則述吸引路徑不與前述輕量化空 本發明之保持台中 面，藉由吸附部而，工作件係載工作件支持部之支持 部。而且，藉由旋轉=面，負壓’藉此支持於工作件支持 旋轉之狀態下，對^持部’工作件在，經由工作件支持部 根據本發明，：作件施行預定之加工或處理等。 較於工作件支持部為支持部具有絕緣性，因此相 持部與之間之絕 心兄’可加大工作件與旋轉支 作件之帶電量，其:因此’可縮小因摩擦而貯存於工 靜電破壞。又，工^ &可有效地抑制帶電造成工作件之 量化空間，因部與旋轉支持部之間形«輕 部之厚度，即絕緣轉量增加’而可加大工作件支持 本發明中，使工 路輕係未與輕量化空間夺p之吸附部發生負璧之吸引 間連通時，恐有工作件〃令’吸路捏與輕量化空 形’而對工作件造成不C空間例凹下之變 經未連通於輕量化空間，因此二2發明中’吸引路 之開口之狀態，前述膠帶而切於環狀框架 狀檀架之内周之間之對肩作件之外周與前述環 溝，前述物遊包含設置:前:::勝帶之位置的環狀 作成具體的形態。 化空間中之配管， 再者，本發明所言之，未 J限弋，可舉例如 201145444 矽晶圓等之半導體晶圓、或陶瓷、玻璃、藍寶石（Al2〇3)， 或者於矽系之無機材料基板之上具有導電性元件者等。 根據本發明，可抑制對保持之工作件施行加工或處理 時產生之靜電發生，電荷難以貯存於工作且可縮小帶電 量，藉此可有效地抑制靜電破壞。 圖式簡單說明 第1圖係顯示適用本發明之一實施形態之保持台之旋 轉式之洗淨裝置之立體圖，（a)顯示保持台位於工作件傳遞 位置之狀態，（b)顯示保持台位於洗淨位置之狀態。 第2圖係顯示一實施形態之保持台與保持於該保持台 之工作件的立體圖。 第3圖係一實施形態之保持台之分解立體圖。 第4圖係第2圖之IV-IV截面圖。 第5圖係構成一實施形態之保持台之工作件支持部之 框體之平面圖。 第6(a)圖係將一實施形態之保持台選定為電容器之構 造之態樣之側面圖、（b)係相同構造而框體為導體且未具有 輕量化空間之情況。 第7圖係顯示本發明之其他實施形態之保持台之立體 圖。 第8圖係一實施形態之保持台之分解立體圖。 第9圖係第7圖之IV-IV截面圖。 第10(a)圖係顯示雙重環狀溝及連通該等環狀溝之連通 溝，第10(b)圖係顯示第10(a)圖之10B-10B截面圖。 201145444 【】 較佳實施例之詳細說明 以下’ S兒明本發明之一實施形態。 [1]洗淨裝置 第1圖係顯示適用_實施形態之保持台3〇A之洗淨裝置 1〇。該洗淨裝置1G適合作為用以沖洗已在未圖示之加工裝 、行預定之加工之溥板狀工作件之裝置。第2圖之標號上 :、二在此之工作件。該工作件i係具有電子電路之多數矩 形儿件2形成於表面之圓板狀半導體晶圓。 工作件i之加工裝置可舉例進行切割加工(包含切削刀 片進行之切割、或雷射光照射之_)、使用雷射光之開孔 加工、研削加卫、研磨加工、擴張分割加卫等者。本實施 形態之洗淨裝置10係附隨裝備在此種加工裝置，或者與加 工裝置脫離而為單獨設置。 如第1圖所示，洗淨裝置10係於長方體狀殼體u内收容 上达保持台亀與2個喷嘴21，22而構成者。殼體叫圓筒狀 内壁111與底部112形成洗淨空間12。該洗淨空間 閉口。 、乃 保持台肅之全體為圓板狀，且與洗淨空間12呈同 配设在殼體11内。保持台观係如第2圖所示， 平配置之圓板狀工作件支持部4G與可旋轉地支持工作= 持部40之旋轉支持部5〇。藉由未圖示之馬達 支 部而驅動旋轉之旋轉軸51係由旋轉支持邛如之疋驅動 始瓣下方延伸’旋轉支持部-以旋轉二:： 201145444 紅轉支持部5〇係藉由氣虹等構成之未圖示昇降裝 置，而與該旋轉驅動部一體昇降。 工作件支持部40係如第3圖所示，包含：呈同心狀載置 且固疋於㈣支持部5〇之上面之載體4卜及呈同心狀配設 ;乂框體41之上面之圓板狀吸附部。如第顿所示，於框 體41之外周面之下部形成有鳄部4ΐι。鳄部川之直徑比旋 轉支持。P50之直役小’且旋轉支持部之環狀之外周部則 超出鍔部4U之外側。又，於框_之下面，圆形狀凹處形 成作為輕量化空間43。另—方面，於框_之上面留有外 周，’彖σΜ12以形成圆形凹處413，吸附部π則設置成嵌合於 該凹處413。 ，構成工作件支持部40之框體41係由具有絕緣性之材料 所形成m兄下之絕緣⑽料可舉代表鐵氟龍(登錄商 標）等氟樹脂、或聚祕樹脂、多孔質狀陶究等。又，吸附 部42係由具有無數氣孔之多孔f體構成，使用氧蝴Ai2〇3) 等之陶竞(絕緣體）。又，用以支持卫作件支持部⑼之旋轉支 持部5〇係_或残崎金屬構叙導體所形成。 吸附部42佔工作件支持部4〇之上面之大部分，其直徑 係設定與X作件1之直徑相同或略小。該吸附部42之上面成 為吸附且支持工作件1之支持面421。吸附部42之厚度與框 體41之凹處413之深度相同，因此嵌合於凹處413之吸附部 42之上面與框體41之外周緣部412之上面係齊平的，設定為 水平。又，上述輕量化空間43之直徑係設定比工作件丨之直 徑大。 8 201145444 工作件切部幾藉由嵌合於包含 定於㈣切物。固定環⑽直徑與旋轉支持部5〇之直 徑相同，且於固定環60之内周面之下部形成有與鳄部如嵌 合之％狀凹處61。旋轉支持部5〇之上述外周物於周方向 上隔有間隔而形成有複數之螺孔5〇2。而且在比固定環歡 環狀凹處61更外周側形成钱應於·地之螺栓μ之貫 通孔62。 固定環_在貫觀a對應於旋轉支持料之螺孔 502之狀態下，環狀凹處61後合於框體w之鳄部川，並且 將通過貫軌62之螺栓65检人_支持部％之螺孔5〇2且 栓固，藉此固定於旋轉支持部5〇。藉此，工作件支持部4〇 在被固定環60與旋轉支持部5〇挾入之狀態下固定。在該固 定狀態下，輕量化空間43被框體41與旋轉支持部5〇固定。 由於框體41非由螺栓65直接栓固於旋轉支持部5〇，而是以 固定環60被夾入而固定，因此即使框體41為樹脂亦不會使 框體41歪斜而可予以固定。 如上所述’工作件支持部4〇固定於旋轉支持部5〇上而 構成之保持台30A係如第4圖所示，形成有使吸附部42與負 壓源（真空泵等）80連通之吸引路徑7〇a。吸引路徑70A包 含：形成於旋轉軸51之中心而與負壓源80連通之第1吸引路 棱71、由第1吸引路徑71之上端分歧後呈放射狀形成於旋轉 支持部50之内部’且朝旋轉支持部5〇之上面開口之複數第2 吸引路徑72、及呈放射狀形成於框體41之内部，且連通各 201145444 第2吸？I路徑72之開口 72!與吸附部之複數第3吸引路徑 3如第4圖及第5圖所示，第3吸引路徑乃係在對應於凹處 卜周之位置、成為第3吸引路徑73之交錯點之位置 严士應於凹處413之中心之位s，形成有朝凹處413開口之 1上述輕里化空間43未連通於吸引路徑7〇A，且成 為在保持台30A内密閉之空間。 …7、 /、乐1吸引路徑71係以配管81連通，負壓源g 運轉時’經由配管81、第卜及引通路7卜第2吸引路徑72 吸引路徑73而吸附部42内之空氣被吸引，吸附部似; 負壓傳達到支持面42卜藉由該負壓作用，載置於3 持面42丨之工作件丨會吸附於支持面42i且受支持。 *藉由上述昇降機構，保持台3GA定位於第丨⑷圖所示： 喊體U之開口 121附近之工作件傳遞位置、與由工作件_ 位置下降之如第1(b)圖所示之洗淨空間12内之洗淨位置。 如第1圖所示之上述2個噴嘴21、22係其中一方作則 =洗淨水之洗淨水噴嘴、另—者作為喷出賴空氣之空| 嘴。該等喷嘴2卜22係並列且設置成水平，基端部可7! 平旋動地受支持於豎立設置在殼體u之底部ιΐ2之供給, #23之上μ ’且前端部向下屈曲。由洗淨水噴嘴^喷出戈 洗淨水宜使用純水、或者混人⑽之純水以防止靜電。^ 者’雖未圖示’但殼_之底部112連接了心將洗淨心 排水朝處理設備排出之排水管。 各喷嘴2卜22係當保持台30A定位於洗淨位置時，料 持台30A之上方作水平旋動，且朝與保持台取—起旋轉』 10 201145444 自轉之工料1之表面全面”洗淨料錢魏。又，保 持台30Α昇降時’會朝比保持台嫌更外周側旋動且定位 於不甘擾保持台30Α之昇降的退避位置。 [2]洗淨裝置之動作 其次’説明由上述構成形成之洗淨裝置10之動作例。 保持台30Α上昇後定位於工作件傳遞位置，負壓源8〇 運轉而成為負壓傳達到吸附部42之支持面421之狀態。接 著，施行預定之加工之工作件丨呈同心狀載置於支持面 42卜藉此，工作件1以負壓作用吸附、保持於支持面似。 接著保持台3GA下降到洗淨位置，且保持台皿以例如 80〇rpm(reV〇lUti〇nSp_inute)左右之預定洗淨旋轉速度進 行旋轉。而且，洗淨水喷嘴21進行往返旋動並且由該喷嘴 21之前端喷出洗淨水。洗淨水喷出而遍及於自轉之工作件 1 ’附著於工作件1之髒汙成分〈例如切削屑或研削屑）以洗 淨水沖洗。經過預定之洗淨時間後，洗淨水之供給停止， 洗淨水喷嘴21退避。 接著’保持台30A之旋轉速度上昇到例如3〇〇〇rpm左 右’附著於工作件1之洗淨水藉由離心力而驅散。接著與此 同時，空氣喷嘴22進行在返旋動，由該噴嘴22之前端喷出 高壓之乾燥空氣。乾燥空氣遍及自轉之工作件丨，且與利用 離心力之洗淨水之驅散作用相輔相成而使工作件丨快速地 乾燥。經過預定之乾燥時間後，停止乾燥空氣之供給且空 氣喷嘴22退避。 工作件1之洗淨及乾燥結束後，保持台3〇A上升到工作 201145444 件傳遞位置’負壓獅之運轉停止而解除㈣部42進行之 工作件^之吸附。該後工作件4保持台3辦起移動到下— 製程。以上係洗淨裝置10對於1片工作⑴之動作的_ [3]—實施形態之作用以及效果 其次’說明上述實麵態之保持台肅之作賴伴隨之 效果。上述洗淨製程及乾燥製程中， 空氣喷灑到工作件1之表面，因 由於將洗淨水或高壓 此以往會產生摩擦而使工作 件1帶電。然而，根據太眚 低嫌尽貫施形態之保持台30A,由於以 之理由故難以產生帶電。 在作件1保持於保持台遍之吸附部42之狀態下 導體之工作件（半導體晶圓）1與旋轉支持部5_等之金屬 製）1挟有為絕緣體之工作件支持部4〇(框體為例如氣 樹脂、吸附部4為例如氧化⑻。而在此被認Jb與在2片導體 之間爽有絕緣體之平行電容ϋ有同樣構造。 由2片導體板構成之—般電容器之容量C為： 導體板間之比介電率）xs_之面積） 體間之距離）···式1， 、Ί、』口，成马： c er(%轉支持部5〇與工作件丄之間之比介屬 S(旋轉支持部5G與卫作件丨之面積）/ ·作件】與旋 部50間之距離〉。 式一 d曰、即工作件1與旋轉支持部50間之距離愈大則電 ”曰愈】以下為儲存於電容器之電量q與電位差之 12 201145444 一般的關係式： q = cv(c:電容器之容量、v:電位差）...式2 因此，可導出電容器之容量愈小，貝彳q、即帶電量會變小。 如第6圖（a)所示，本實施形態之保持台30A中，工作件 !之内面與旋轉支持㈣之間的距離叫，將保持台撤作 為電容器來考慮時之導體間之距離(相當於絕緣體之厚 度）另方面第6(b)圖係顯示，工作件支持部4〇之框體 41係々本貫施形態’並非為絕緣體’而是由導體(例如鋁) 所構成者，且不形成輕量化空間43，吸附和與本實施形 態同樣由作為絕緣體之喊製之多孔質體構成之情況該 情>兄係吸附°M2之厚度d2為將保持台3{)續為電容器來考 慮時之導體間之距離(絕緣體之厚度）。再者第6圖中，省 略了上述固疋環60及吸引路徑7〇A之圖示。 將兩者中由作件1之裏面到導體之間之距誠、们相 比較，本實施形態者(dl)特別大，因此，本實施形態之保持 台30A之電荷難以貯存，而可經常將帶電量抑制較小。靜電 破壞起因於在卫作件1内之電子的移動，電子之移動係在貯 存之電荷放電時產生，但本實施形態中，由於帶電量經常 抑制在較小，因此在工作件…之電子移動難以產生，且難 以產生放電，結果可有效地抑制靜電破壞。即，作為絕緣 距離之工作件1與；^轉支持部之間的距離宜確保在 8mm以上’例如3〇mm左右。 然而，引起靜電破壞之電子移動除了貯存之 電荷放電 時亦可月匕在内部產生靜電感應時產生。靜電感應係例如 13 201145444 已介電極化之絕緣體靠近導體而引起，介電極化在本實施 形態之情況下係當洗淨水已帶電時，可能會發生於吐出該 洗淨水之工作件支持部4〇之支持面421。當支持面421已介 電極化時，在保持之工作件1會產生靜電感應而電子移動， 招致靜電破壞。然而，本實施形態之工作件支持部4〇之框 體41之材料所舉例之氟樹脂、或如吸附部42之多孔質體為 難以產生介電極化之材料，因此靜電感應難以產生於保持 在工作件支持部40之工作件1，結果與加大工作件丨與旋轉 支持部5GP4之距離相輔相成’也得到相乘之靜電破壞之抑 制效果。 又，本實施形態中，並非僅單純將工作件支持部4〇作 為絕緣體，且於構成工作件支持部4〇之框體41之下面形成 輕量化空間43。因此，由於加大絕緣輯，因此即使加厚 框體4卜保持台3GA之重量之增加少。#保持台观之重量 增加時’例如旋轉中容易晃動，有損穩定度。然而，本實 施形態中，藉由於框體41形成輕量化空_，不會招致重 量之增加，且絕緣距離會變大而可抑制帶電。 又，本實施形態中，使工作件支持部4〇之吸附部财 生負壓之吸引路徑7GA與輕量化空間43未連通。在此合吸 引路徑7〇A與輕量化空間43連通時，對應於保持之工作田件i 之較薄部分（吸附部42、及吸附部42接觸之框體Μ之上部) 可能會產生輕量化空間43側凹下之變形。該變形產生時， 工作件！也會仿效而變形，恐有不良影響之虞。狄而，由於 吸引路徑7GA未連通於輕量化空間43,因此不會產生該種變 201145444 形，因此可安全地保持工作件j。 [4]保持台之其他實施形態 接著’參考第7圖〜第10圖，說明本發明之保持台之其 他實施形態。料圖面中，與上述實施形態之保持台30A 相同之構成要相附則目同標號且簡略說明。 第7圖所示之其他實施形態之保持台遍係用以支持透 過支持膠帶6而支持成同心狀配設且支持於環狀框架5之開 口 5a之狀態之工作件丨。支持膠帶6係單面作成黏著面之勝 帶，且於該黏著面貼著有環狀框架5與卫作件1之内面。環 狀框架5係由金屬輪材構成且具有剛性者藉由支持該環 狀框架5來搬送工作件1。 如第8圖及第9圖所示，該實施形態之保持台細也與上 述實施形態之保持台胤同樣，係於旋轉支持部⑽上以固定 環60來蚊具有輕量化空間43之工作件支持部糊構成。 該態樣之X作件讀部鄉具以上述多孔f體構成之吸 附部42 m雜之框體41之平坦上面構成工作件【之支 持面414又’於該框體41未形成第3吸引路徑73。又，旋 轉支持部5〇不具有第2吸引路徑η，且第丨吸引路徑^朝面 臨輕量化空間43之上面開口。 如第9圖所示，工作件！係隔著支持膠帶6而載置於工作 件支持。卩零！體41)之支持面414，且環狀框架5載置於固定 %60上。而且，支持膠帶6中之工作件1之外周與環狀框架5 之内周之間的環狀部6a係由支持面414之外周部41如跨越 固定環60而載置。 15 201145444 在樞體41之支持面414之對應於支持膠帶6之環狀部6a 之该外周部414a，内周側與外周側之2個環狀溝（吸 附。P)415 ’ 416與框體41形成同心狀。該等環狀溝415、416 係女第10圖所示，藉由形成於支持面414之複數連通溝417 而連通。該態樣之連通溝417形成於彼此距離180。之角度之 位置。框體41形成有由下面通過連通溝417之吸引口418 , 且如第9圖所示’該等吸引口 418與旋轉支持部50之第1吸引 路拴71之開口 711係藉由配設於輕量化空間43之配管74而 連通。 該實施形態中’藉由旋轉支持部50之第1吸引路徑71、 配官74、框體41之吸引口418及連通溝417，構成使環狀溝 415、416與負壓源80連通之吸引路徑7〇B。吸引口 418係朝 面臨輕量化空間43之框體41之下面開口，第丨吸引路徑71係 朝面臨輕量化空間43之旋轉支持部5〇之上面閉口，但該等 開口被配管74堵塞。因此，輕量化空間43不連通於吸引路 徑708，且在保持台3〇8内形成密閉之空間。 固定環6 0係等間隔地安裝有可自由裝脫地保持環狀框 架5之複數搖動式夾66。該等夾66係#保持台_旋轉而產 生離心力時，則如第9圖所示，按壓部66a由上方壓住載置 於固定環6G上之環狀框架5地進行搖動，藉此料環狀框架 根據該實施形態之保持台308，當負壓源8〇運轉時，經 由配管8卜第m引通路7卜配管74、吸引口418及連通溝 417而吸弓丨環狀溝415、416内之空氣，環狀溝415、416成為 201145444 負壓。藉此，支持膠帶6之環狀部6a之覆蓋環狀溝415、416 之。卩分吸附於環狀溝415、416，因此工作件1隔著支持膠帶 6而支持於框體41之支持面414。 藉由該實施形態之保持台3〇B，也不會因為具有輕量化 工門43之工作件支持部4〇而招致重量之增加，可加大工作 件1與旋轉支持部50之間的絕緣距離，並且可有效地抑制工 作件1之帶電。特別是該實施形態中，若將支持膠帶6作成 絕緣性者，财將支持科6之厚度增大作為絕緣距離之-抽又，與上述實施形態之保持台30A同樣地，吸弓丨路徑 70B未連通輕量化空間43，因此可得到工作件i之吸附時不 會產生卫作件支持部做工作件1之變形之狀況之優點。 【圖式簡單說明】 第1圖係顯示適用本發明之— 轉式之洗淨裝置之立體圖，（a) 位置之狀態’（b)料㈣台位於洗淨位置之狀態。 之保持台與保持於該保持台 實施形態之保持台之旋 顯示保持台位於工作件傳遞 第2圖係顯示一實施形態 之工作件的立體圖 第3圖係—實施形態之保持台之分解立體圖。 第4圖係第2圖之IV-IV戴面圖。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a working member for a device for performing various processing or processing on a thin plate-shaped workpiece such as a semiconductor wafer. C -3⁄4. ^hr ί BACKGROUND OF THE INVENTION The semiconductor device is formed by a plurality of rectangular regions in which the surface of the semiconductor wafer is divided by a predetermined line, and an electronic circuit such as 1CaLSI is formed, and then the inside of the wafer is subjected to grinding and polishing. After the treatment, the dividing line is cut and cut into individual components (semiconductor wafers). The cleaning water after the components are removed, the cutting is removed, and the high voltage is sprayed. The air is dried (refer to Patent Document 1, etc.) and transferred to the next bonding process, etc. During the process of cutting, cleaning, and drying in the day w, static electricity is generated to cause wafer charging. For example, When the cutting of the cutting board is cut, the cutting water is supplied to the wafer to be lubricated or cooled, and the wafer is charged by the friction generated by the cutting water contact. When it is clean and dry, since the washing water or high-pressure air is washed toward the wafer supported on the rotating table, the washing water or high-pressure air may be rubbed and charged when it contacts the wafer. 所谓 The so-called wafer charging It means that there is a possibility of discharge, and when electricity is discharged in the element due to discharge, the electrostatic breakdown occurs and the element is damaged. The quality of the element is reduced and becomes *can be used. Since 201145444 = In the above-mentioned Patent Document 1, it is proposed to remove the static electricity by ionizing the air having the effect of removing electricity in the cleaning of the wafer, etc. [Patent Document 1] Japanese Patent Laid-Open Publication No. 2 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The object to be solved by the invention is that 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱 虱As a result, if the fundamental countermeasures such as the discharge generated by the suppression of the electron transfer can be performed, it is more effective than the damage suppression measure. (4) Therefore, the object of the present invention That is, a kind of holding table is provided, which can suppress the static caused by the friction when the processing or the processing is performed on the 2nd part, and the electric charge is difficult to store in the sanitary piece, thereby reducing the charge amount, thereby effectively suppressing Electrostatic destruction. Method for solving the problem The present invention transmits negative pressure to the inner surface of the guard piece and is used for sucking the holding table, and the special emblem of the gray friend V spoon person's, the temple negative pressure transmission member support department, has a negative It is transmitted to the adsorption portion for supporting the support surface of the workpiece, and is formed by an insulating member; the rotation support portion supports the workpiece to support the adjacent rotation; the lightweight space is formed in the rotation support Between the workpiece support portions and the suction path, the adsorption portion is connected to the negative waste source of the negative pressure of 201145444, and is connected to each other. The suction path is not the same as the light weight of the present invention. The workpiece is attached to the support portion of the workpiece support portion by the adsorption portion. Moreover, by rotating = face, negative pressure ' thereby supporting the workpiece in the state of supporting rotation, the holding part 'work piece is, according to the invention, through the work piece support part: the workpiece is subjected to predetermined processing or processing Wait. Compared with the support part of the work piece, the support part is insulated, so the contact between the holding part and the intimate brother can increase the charge amount of the work piece and the rotating support piece, so that it can be reduced in friction and stored in the work. Static damage. Moreover, the work ^ & can effectively suppress the quantization space of the working piece caused by the charging, and the working piece can be increased in the present invention due to the shape of the thickness of the light part, that is, the increase of the insulation rotation amount between the portion and the rotation support portion. When the light path of the road is not connected to the suction of the negative portion of the lightweight space, there is a fear that the work piece will make a 'sucking pinch and a lightweight empty shape' and cause a non-C space for the workpiece. The next change is not connected to the lightweight space. Therefore, in the second invention, the state of the opening of the suction path is the outer circumference of the shoulder piece and the ring between the inner circumference of the annular frame-shaped arbor. In the ditch, the above-mentioned object tour includes a set of the front::: ring in the position of the winning band to form a specific form. The piping in the space is not limited to the present invention, and may be, for example, a semiconductor wafer such as 201145444 矽 wafer, or ceramic, glass, sapphire (Al2〇3), or A conductive element or the like is provided on the inorganic material substrate. According to the present invention, it is possible to suppress the occurrence of static electricity generated during the processing or processing of the held workpiece, and it is difficult to store the charge in operation and the amount of charge can be reduced, whereby the electrostatic breakdown can be effectively suppressed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a rotary type washing apparatus to which a holding table according to an embodiment of the present invention is applied, (a) showing a state in which a holding table is at a transfer position of a work piece, and (b) a display holding table is located The state of the washing position. Fig. 2 is a perspective view showing a holding table of an embodiment and a workpiece held by the holding table. Fig. 3 is an exploded perspective view of the holding table of the embodiment. Figure 4 is a cross-sectional view taken along line IV-IV of Figure 2. Fig. 5 is a plan view showing the frame of the workpiece supporting portion of the holding table of the embodiment. Fig. 6(a) is a side view showing a state in which the holding stage of one embodiment is a configuration of a capacitor, and (b) a case where the frame is a conductor and has no weight reduction space. Fig. 7 is a perspective view showing a holding table of another embodiment of the present invention. Fig. 8 is an exploded perspective view of the holding table of the embodiment. Figure 9 is a sectional view taken along line IV-IV of Figure 7. Fig. 10(a) shows a double annular groove and a communication groove connecting the annular grooves, and Fig. 10(b) shows a sectional view of 10B-10B of Fig. 10(a). 201145444 [Detailed Description of the Preferred Embodiments] Hereinafter, an embodiment of the present invention will be described. [1] Cleaning device Fig. 1 shows a cleaning device 1 适用A applied to the embodiment. This cleaning device 1G is suitable as a device for rinsing a slab-shaped workpiece which has been processed in a processing which is not shown. The figure on the second figure: , the second work piece here. The work piece i is a disk-shaped semiconductor wafer in which a plurality of rectangular members 2 having electronic circuits are formed on the surface. The processing device of the work piece i can be exemplified by a cutting process (including cutting by a cutting blade or laser irradiation), drilling using a laser beam, grinding and grinding, grinding, expanding and splitting. The cleaning device 10 of the present embodiment is provided separately from the processing device or separately from the processing device. As shown in Fig. 1, the cleaning device 10 is formed by accommodating the holding table and the two nozzles 21 and 22 in the rectangular parallelepiped casing u. The casing is called a cylindrical inner wall 111 and a bottom portion 112 forms a washing space 12. The washing space is closed. In addition, the entire board is kept in a circular plate shape, and is disposed in the casing 11 in the same manner as the washing space 12. As shown in Fig. 2, the disk-shaped workpiece support portion 4G and the rotation support portion 5 that rotatably supports the work-holding portion 40 are rotatably supported as shown in Fig. 2 . The rotating shaft 51 that is driven to rotate by a motor branch (not shown) is driven by a rotation support such as a cymbal drive to extend the lower end of the initial lobes to the 'rotation support portion' to rotate two:: 201145444 red turn support portion 5 藉 by the gas rainbow The lifting device (not shown) is configured to be lifted and lowered integrally with the rotation driving unit. As shown in FIG. 3, the workpiece supporting unit 40 includes a carrier 4 that is placed concentrically and fixed to the upper surface of the (four) support portion 5, and is disposed concentrically; a circle above the frame 41 Plate-shaped adsorption section. As shown in the figure, an crocodile portion 4ΐ is formed below the outer peripheral surface of the frame 41. The diameter of the crocodile is more than the rotation support. The direct acting of the P50 is small and the outer circumference of the ring of the rotation support portion is beyond the outer side of the crotch portion 4U. Further, below the frame _, a circular recess is formed as the lightweight space 43. On the other hand, a periphery is left on the frame _, 彖σΜ12 to form a circular recess 413, and the adsorption portion π is provided to be fitted to the recess 413. The frame 41 constituting the workpiece support portion 40 is made of an insulating material, and the insulating material (10) is a fluororesin such as Teflon (registered trademark) or a polystyrene resin or a porous ceramic. Study. Further, the adsorption portion 42 is composed of a porous body having a plurality of pores, and a ceramic (insulator) such as Oxygen Ai2〇3) is used. Further, it is formed to support the rotating support portion 5 of the garnish supporting portion (9) or the ruins of the metal. The adsorption portion 42 occupies most of the upper surface of the workpiece supporting portion 4, and its diameter is set to be the same as or slightly smaller than the diameter of the X-piece 1. The upper surface of the adsorption portion 42 serves to adsorb and support the support surface 421 of the workpiece 1. Since the thickness of the adsorption portion 42 is the same as the depth of the concave portion 413 of the frame 41, the upper surface of the adsorption portion 42 fitted to the concave portion 413 is flush with the upper surface of the outer peripheral portion 412 of the casing 41, and is set horizontally. Further, the diameter of the above-described lightweight space 43 is set to be larger than the diameter of the workpiece 丨. 8 201145444 The workpiece is cut into several parts by fitting into the (four) cut. The diameter of the fixing ring (10) is the same as the diameter of the rotation support portion 5, and a concave portion 61 which is fitted to the crocodile portion is formed below the inner circumferential surface of the fixing ring 60. The outer peripheral members of the rotation support portion 5 are formed with a plurality of screw holes 5〇2 at intervals in the circumferential direction. Further, the through hole 62 of the bolt of the ground is formed on the outer peripheral side of the annular groove 61 of the fixed ring. The fixing ring _ is in a state in which the viewing a corresponds to the screw hole 502 of the rotating support material, and the annular recess 61 is fitted to the crocodile part of the frame w, and will be inspected by the bolt 65 of the cross rail 62. The screw hole of the % is 5〇2 and is bolted, thereby being fixed to the rotation support portion 5〇. Thereby, the workpiece supporting portion 4 is fixed in a state in which the fixing ring 60 and the rotation support portion 5 are inserted. In this fixed state, the lightweight space 43 is fixed by the frame 41 and the rotation support portion 5A. Since the frame 41 is not directly fastened to the rotation support portion 5 by the bolts 65, but is fixed by the fixing ring 60, even if the frame 41 is made of resin, the frame 41 can be fixed without being skewed. As described above, the holding table 30A configured to be fixed to the rotation support portion 5A as described above is formed with the attraction of the adsorption unit 42 and the negative pressure source (vacuum pump or the like) 80. Path 7〇a. The suction path 70A includes a first suction path edge 71 formed at a center of the rotation shaft 51 and communicating with the negative pressure source 80, and is formed radially inside the rotation support portion 50 by the upper end of the first suction path 71. The plurality of second suction paths 72 that are open to the upper surface of the rotation support portion 5 are radially formed inside the frame 41, and are connected to each of the 201145444 second suctions. As shown in FIGS. 4 and 5, the third suction path 3 of the opening 72 of the I path 72 and the plurality of third suction paths 3 of the adsorption unit is the third suction path 73 at the position corresponding to the concave circumference. The position of the staggered point is formed at the center s of the recess 413, and the light-filled space 43 is opened to the recess 413. The light-filled space 43 is not connected to the suction path 7A, and is a space sealed in the holding table 30A. . ...7, /, Le 1 suction path 71 is connected by the pipe 81, and when the negative pressure source g is in operation, the air in the adsorption portion 42 is sucked through the pipe 81, the second and the guide passages 7 and the second suction path 72. The suction is similar to the adsorption portion; the negative pressure is transmitted to the support surface 42. By the negative pressure, the workpiece placed on the holding surface 42 is adsorbed on the support surface 42i and supported. * With the above-mentioned lifting mechanism, the holding table 3GA is positioned in the figure (4): the transfer position of the workpiece near the opening 121 of the body U and the position of the work piece _ are lowered as shown in the first (b) The washing position in the washing space 12. As shown in Fig. 1, the two nozzles 21 and 22 are one of which is a washing water nozzle for washing water, and the other is a nozzle for discharging air. The nozzles 2 and 22 are juxtaposed and arranged horizontally, and the base end portion 7 can be supported by the supply of the bottom ι 2 provided in the housing u, which is erected on the bottom of the housing u, and the front end is flexed downward. . It is advisable to use pure water or pure water mixed with (10) to prevent static electricity from being sprayed from the washing water nozzle. Although the person ' is not shown', the bottom 112 of the shell is connected to a drain that drains the heart from the washing device. Each nozzle 2 is 22 when the holding table 30A is positioned in the washing position, the top of the holding table 30A is horizontally rotated, and is rotated toward the holding table. 10 201145444 The surface of the material 1 is fully washed. In addition, when the platform is raised and lowered, it will be rotated more than the outer peripheral side of the holding platform and positioned at the retreat position that does not disturb the lifting and lowering of the holding table 30. [2] The operation of the cleaning device is second. An example of the operation of the cleaning device 10 is formed. The holding table 30 is raised and positioned at the workpiece transmission position, and the negative pressure source 8 is operated to be in a state where the negative pressure is transmitted to the support surface 421 of the adsorption unit 42. The processed workpiece 丨 is placed concentrically on the support surface 42 whereby the workpiece 1 is adsorbed by the negative pressure and held on the support surface. Then the holding table 3GA is lowered to the washing position, and the table is kept, for example, 80. The predetermined washing rotation speed is rotated by the rpm (reV〇lUti〇nSp_inute), and the washing water nozzle 21 is reciprocated and the washing water is sprayed from the front end of the nozzle 21. The washing water is sprayed over and over. Work on rotation 1 'The dirty component attached to the workpiece 1 (for example, chips or grinding chips) is rinsed with washing water. After a predetermined washing time, the supply of the washing water is stopped, and the washing water nozzle 21 is retracted. The rotation speed of the stage 30A is raised to, for example, about 3 rpm. The washing water adhering to the workpiece 1 is dissipated by the centrifugal force. At the same time, the air nozzle 22 is rotated, and the front end of the nozzle 22 is rotated. The high-pressure dry air is sprayed out. The dry air passes through the rotating working piece 丨 and complements the dispersing action of the washing water by the centrifugal force to quickly dry the workpiece. After the predetermined drying time, the supply of the dry air is stopped. After the cleaning and drying of the workpiece 1 is completed, the holding table 3A is raised to the working position of 201145444. The operation of the negative pressure lion is stopped, and the suction of the workpiece by the (four) portion 42 is released. The work piece 4 holds the table 3 and moves to the lower-process. The above-mentioned cleaning device 10 acts on the action of one piece of work (1) _ [3] - the effect of the embodiment and the effect second In the above cleaning process and drying process, air is sprayed on the surface of the work piece 1, and the work piece is caused by friction due to washing water or high pressure. 1. It is charged. However, it is difficult to generate charging according to the reason why the holding table 30A is too low-lying. The workpiece 1 is held in the state where the holding member 1 is held by the holding portion 42 of the holding portion. The wafer 1 is made of a metal such as a rotation support portion 5_), and the workpiece support portion 4 is an insulator (the frame is, for example, a gas resin, and the adsorption portion 4 is, for example, oxidized (8). Here, it is recognized as Jb and The parallel capacitance of the insulator between the two conductors has the same structure. The capacity C of a general capacitor composed of two conductor plates is: the specific dielectric ratio between the conductor plates) xs_ the area) the distance between the bodies), the formula 1, the Ί, the mouth, the horse: c Er (% of the ratio between the support portion 5〇 and the workpiece 介 is S (the area of the rotation support portion 5G and the guard member )) / · the workpiece] and the distance between the rotation portion 50. That is, the greater the distance between the workpiece 1 and the rotation support portion 50, the electric "healing" The following is the amount of electricity q stored in the capacitor and the potential difference 12 201145444 General relationship: q = cv (c: capacitor capacity, v : (potential difference) Equation 2 Therefore, the smaller the capacity of the derivable capacitor, the smaller the charge amount, ie, the charge amount becomes smaller. As shown in Fig. 6(a), in the holding stage 30A of the present embodiment, the workpiece The distance between the inner surface of the ! and the rotation support (4) is called the distance between the conductors when the stage is removed as a capacitor (corresponding to the thickness of the insulator). In addition, the figure 6(b) shows that the workpiece support portion 4 The frame 41 of the frame is formed by a conductor (for example, aluminum) and is not formed into a lightweight In the case of the space 43, the adsorption is made of a porous body which is called an insulator as in the present embodiment. The thickness d2 of the absorption coefficient M2 is a conductor which is considered when the holding stage 3{) is continued as a capacitor. The distance between the two (the thickness of the insulator). In the sixth figure, the illustration of the above-mentioned fixing ring 60 and the suction path 7A is omitted. In contrast, the present embodiment (dl) is particularly large. Therefore, the electric charge of the holding table 30A of the present embodiment is difficult to store, and the amount of charge can be suppressed to a small extent. The electrostatic breakdown is caused by the inside of the protective member 1. The movement of electrons and the movement of electrons occur when the stored charge is discharged. However, in the present embodiment, since the amount of charge is often suppressed to a small extent, electron movement in the workpiece is hard to occur, and discharge is hard to occur, and as a result, it is effective. The electrostatic damage is suppressed. That is, the distance between the workpiece 1 and the support portion as the insulation distance should be ensured to be more than 8 mm, for example, about 3 〇 mm. However, the electrons causing electrostatic damage move in addition to the stored charge. When electricity is generated, it can also be generated when static electricity is generated inside the moon. The electrostatic induction system is, for example, 13 201145444. The dielectricized insulator is close to the conductor. In the case of the present embodiment, when the cleaning water is charged, it may be The support surface 421 of the workpiece support portion 4 that discharges the washing water is generated. When the support surface 421 is dielectrically polarized, static electricity is generated in the held workpiece 1 and the electrons move, causing electrostatic breakdown. However, this embodiment The fluororesin exemplified as the material of the frame 41 of the workpiece supporting portion 4 or the porous body such as the adsorption portion 42 is a material which is difficult to cause dielectric polarization, so that electrostatic induction is hard to occur in the workpiece supporting portion 40. As a result of the work piece 1, the result is that the distance between the enlarged work piece 丨 and the rotation support portion 5GP4 complements each other', and the synergistic effect of the electrostatic breakdown is also obtained. Further, in the present embodiment, the spacer support portion 4 is not simply used as an insulator, and the lightweight space 43 is formed on the lower surface of the casing 41 constituting the workpiece supporting portion 4''. Therefore, since the insulation is increased, the weight increase of the holding frame 3GA is reduced even if the frame 4 is thickened. #When the weight of the platform is increased, it is easy to sway during rotation, for example, and it is detrimental to stability. However, in the present embodiment, since the frame body 41 is formed into a lightweight space _, an increase in weight is not caused, and the insulation distance is increased to suppress charging. Further, in the present embodiment, the suction path 7GA of the negative pressure of the adsorption portion of the workpiece supporting portion 4 is not communicated with the weight reduction space 43. When the combined suction path 7A is in communication with the lightweight space 43, the thinner portion (the upper portion of the frame Μ where the adsorption portion 42 and the adsorption portion 42 are in contact with each other) may be lighter. The deformation of the space 43 is concave. When the deformation occurs, the work piece! It will also be imitated and deformed, and there may be adverse effects. Di, since the attraction path 7GA is not connected to the lightweight space 43, the type of 201145444 is not generated, so that the work piece j can be safely held. [4] Other Embodiments of the Hold Station Next, other embodiments of the holding table of the present invention will be described with reference to Figs. 7 to 10 . In the drawing surface, the same configurations as those of the holding table 30A of the above-described embodiment are denoted by the same reference numerals and will be briefly described. The holding table of the other embodiment shown in Fig. 7 is used to support the work piece 状态 which is supported in a concentric arrangement and supported by the opening 5a of the annular frame 5 via the support tape 6. The support tape 6 is formed on one side by a single surface, and the inner surface of the annular frame 5 and the decorative member 1 is adhered to the adhesive surface. The annular frame 5 is made of a metal wheel and has rigidity to support the workpiece 1 by supporting the ring frame 5. As shown in Figs. 8 and 9, the holding table of this embodiment is similar to the holding table of the above-described embodiment, and is attached to the rotation support portion (10) with a fixing ring 60 for the workpiece having the lightweight space 43. Support for the composition of the paste. In the X-piece reading portion of the aspect, the flat portion of the frame 41 of the adsorption portion 42 m composed of the porous body described above constitutes a workpiece [the support surface 414 and the third attraction of the frame 41 is not formed. Path 73. Further, the rotation support portion 5 does not have the second suction path η, and the second suction path ^ faces the upper surface of the lightweight space 43. As shown in Figure 9, the work piece! It is placed on the work piece support via the support tape 6.卩 zero! The support surface 414 of the body 41) and the annular frame 5 are placed on the fixed %60. Further, the annular portion 6a between the outer periphery of the work piece 1 in the support tape 6 and the inner circumference of the annular frame 5 is placed by the outer peripheral portion 41 of the support surface 414 such as across the fixed ring 60. 15 201145444 In the outer peripheral portion 414a of the support surface 414 of the pivot 41 corresponding to the annular portion 6a of the support tape 6, two annular grooves (adsorption. P) 415 ' 416 and the frame on the inner peripheral side and the outer peripheral side 41 forms a concentric shape. The annular grooves 415 and 416 are connected to each other by a plurality of communication grooves 417 formed on the support surface 414 as shown in FIG. The communication grooves 417 of this aspect are formed at a distance 180 from each other. The position of the angle. The frame 41 is formed with a suction port 418 that passes through the communication groove 417 from below, and the opening 711 of the first suction path 711 of the rotation receiving portion 50 and the opening 711 of the rotation support portion 50 are disposed as shown in FIG. The piping 74 of the lightweight space 43 is connected to each other. In the embodiment, the first suction path 71 of the rotation support portion 50, the valve 74, the suction port 418 of the frame 41, and the communication groove 417 constitute suction for connecting the annular grooves 415 and 416 to the negative pressure source 80. Path 7〇B. The suction port 418 is opened toward the lower surface of the casing 41 facing the lightweight space 43, and the second suction passage 71 is closed toward the upper surface of the rotation support portion 5 facing the lightweight space 43, but the openings are blocked by the pipe 74. Therefore, the lightweight space 43 does not communicate with the suction path 708, and a sealed space is formed in the holding table 3〇8. The fixed ring 60 is provided with a plurality of rocking clips 66 that are detachably held to hold the annular frame 5 at equal intervals. When the clamp 66 is rotated to generate a centrifugal force, as shown in FIG. 9, the pressing portion 66a is rocked by pressing the annular frame 5 placed on the fixed ring 6G upward, thereby making the ring According to the holding table 308 of this embodiment, when the negative pressure source 8 is operated, the annular groove 415, 416 is sucked through the pipe 8, the m-th guide passage 7, the pipe 74, the suction port 418, and the communication groove 417. The inner air, the annular grooves 415, 416 become the 201145444 negative pressure. Thereby, the annular portion 6a of the support tape 6 covers the annular grooves 415, 416. Since the split is adsorbed to the annular grooves 415 and 416, the workpiece 1 is supported by the support surface 414 of the frame 41 via the support tape 6. With the holding table 3B of this embodiment, the weight of the workpiece supporting portion 4 of the lightweight chemical door 43 is not increased, and the insulation between the workpiece 1 and the rotating support portion 50 can be increased. The distance and the charging of the work piece 1 can be effectively suppressed. In particular, in the embodiment, when the support tape 6 is made insulative, the thickness of the support member 6 is increased as the insulation distance, and the suction bow path 70B is the same as the holding table 30A of the above-described embodiment. Since the lightweight space 43 is not connected, it is possible to obtain the advantage that the deformation of the workpiece 1 is not caused when the workpiece i is adsorbed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a washing apparatus to which the present invention is applied, (a) a state of a position (b) a state in which a material (four) is in a washing position. The holding table and the holding table held in the holding table. The display holding table is located on the workpiece. Fig. 2 is a perspective view showing the working piece of the embodiment. Fig. 3 is an exploded perspective view of the holding table of the embodiment. Figure 4 is a front view of the IV-IV of Figure 2.
第5圖係構成一實施形態之侔垃a ^ L V·* <保持台之工作件支 «之久得4之 器之構 未具有 第6⑷圖係將一實施形態之保持台選定為電容 造之錢之側㈣、⑼係相同構造而框體為導體且 輕量化空間之情況。 17 201145444 第7圖係顯示本發明之其他實施形態之保持台之立體 圖。 第8圖係一實施形態之保持台之分解立體圖。 第9圖係第7圖之IV-IV截面圖。 第10(a)圖係顯示雙重環狀溝及連通該等環狀溝之連通 溝，第10(b)圖係顯示第10(a)圖之10B-10B截面圖。 【主要元件符號說明】 1...工作件 60...固定環 5...環狀框架 61…環狀凹處 5a...環狀框架之開口 62…貫通孔 6...支持膠帶 65...螺栓 6a...環狀部 66... 3¾. 10...洗淨裝置 66a...按壓部 11...殼體 70A，70B···吸引路徑 12...洗淨空間 71...第1吸引路徑 21，22...喷嘴 72...第2吸引路徑 23…供給管部 73...第3吸引路徑 30A，30B...保持台 74...配管 40...工作件支持部 80...負壓源 41...框體 81...配管 42...吸附部 111...内壁 43...輕量化空間 112...底部 50...旋轉支持部 121."開口 51...旋轉軸 411...鍔部 18 201145444 412.. .外周緣部 413.. .凹處 414, 421...支持面 415, 416…環狀溝(吸附部) 417.. .連通溝 418.. .吸引孔 501.. .外周部 502…螺孔 721.. .開口 731…開口 dl,d2..距離 19Fig. 5 is a diagram showing an embodiment of the apparatus for holding a workpiece of a holder. The structure of the holder of the holder is not the sixth (4) diagram. The sides (4) and (9) of the money are the same structure, and the frame is a conductor and the space is reduced. 17 201145444 Fig. 7 is a perspective view showing a holding table of another embodiment of the present invention. Fig. 8 is an exploded perspective view of the holding table of the embodiment. Figure 9 is a sectional view taken along line IV-IV of Figure 7. Fig. 10(a) shows a double annular groove and a communication groove connecting the annular grooves, and Fig. 10(b) shows a sectional view of 10B-10B of Fig. 10(a). [Description of main component symbols] 1...Working member 60: Retaining ring 5... Annular frame 61... Annular recess 5a... Opening of annular frame 62... Through-hole 6... Support tape 65...bolt 6a...annular portion 66...33⁄4. 10...cleaning device 66a...pressing portion 11...casing 70A, 70B···suction path 12...washing Clear space 71...first suction path 21,22...nozzle 72...second suction path 23...supply pipe portion 73...third suction path 30A, 30B...holding table 74... Piping 40...Workpiece support unit 80... Negative pressure source 41...Frame 81...Pipe 42...Adsorption unit 111...Inner wall 43...Lightweight space 112...Bottom 50...rotation support portion 121."opening 51...rotation shaft 411...ankle portion 18 201145444 412.. outer peripheral edge portion 413.. recess 414, 421...support surface 415, 416 ... annular groove (adsorption part) 417... communication groove 418... suction hole 501.. outer peripheral portion 502... screw hole 721.. opening 731... opening dl, d2.. distance 19